TWI611857B - 使用一系列雷射脈衝用於鑽孔之方法 - Google Patents

使用一系列雷射脈衝用於鑽孔之方法 Download PDF

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Publication number
TWI611857B
TWI611857B TW100115628A TW100115628A TWI611857B TW I611857 B TWI611857 B TW I611857B TW 100115628 A TW100115628 A TW 100115628A TW 100115628 A TW100115628 A TW 100115628A TW I611857 B TWI611857 B TW I611857B
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TW
Taiwan
Prior art keywords
pulse
laser
pulses
series
energy
Prior art date
Application number
TW100115628A
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English (en)
Chinese (zh)
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TW201223677A (en
Inventor
幕力森李察德
瑞考馬修
Original Assignee
伊雷克托科學工業股份有限公司
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Publication of TW201223677A publication Critical patent/TW201223677A/zh
Application granted granted Critical
Publication of TWI611857B publication Critical patent/TWI611857B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW100115628A 2010-05-04 2011-05-04 使用一系列雷射脈衝用於鑽孔之方法 TWI611857B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33124210P 2010-05-04 2010-05-04
US61/331,242 2010-05-04

Publications (2)

Publication Number Publication Date
TW201223677A TW201223677A (en) 2012-06-16
TWI611857B true TWI611857B (zh) 2018-01-21

Family

ID=44904061

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100115628A TWI611857B (zh) 2010-05-04 2011-05-04 使用一系列雷射脈衝用於鑽孔之方法
TW105116683A TWI647045B (zh) 2010-05-04 2011-05-04 使用一系列雷射脈衝用於鑽孔之方法與裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105116683A TWI647045B (zh) 2010-05-04 2011-05-04 使用一系列雷射脈衝用於鑽孔之方法與裝置

Country Status (6)

Country Link
US (1) US8816246B2 (enExample)
JP (1) JP6073780B2 (enExample)
KR (1) KR101866579B1 (enExample)
CN (1) CN102939184A (enExample)
TW (2) TWI611857B (enExample)
WO (1) WO2011140229A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011140229A1 (en) * 2010-05-04 2011-11-10 Esi-Pyrophotonics Lasers Inc. Method and apparatus for drilling using a series of laser pulses
CN103582329B (zh) * 2012-07-24 2016-08-03 富泰华工业（深圳）有限公司 壳体及其制造方法
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
JP6362130B2 (ja) * 2013-04-26 2018-07-25 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置
US9808885B2 (en) * 2013-09-04 2017-11-07 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface
JP6320799B2 (ja) * 2014-03-07 2018-05-09 住友重機械工業株式会社 半導体装置の製造方法
KR102214508B1 (ko) 2014-04-28 2021-02-09 삼성전자 주식회사 적층형 반도체 패키지의 제조방법
DE102014108133B4 (de) * 2014-06-10 2016-03-03 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung einer Schwächungslinie in ein Abdeckelement durch Materialabtrag
JP6455021B2 (ja) * 2014-08-22 2019-01-23 オムロン株式会社 接合構造体の製造方法
JP6417786B2 (ja) * 2014-08-22 2018-11-07 オムロン株式会社 接合構造体の製造方法
KR102356592B1 (ko) 2014-11-03 2022-01-28 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP6451370B2 (ja) * 2015-02-09 2019-01-16 オムロン株式会社 接合構造体の製造方法
JP6451421B2 (ja) * 2015-03-12 2019-01-16 オムロン株式会社 接合構造体の製造方法
US20160279737A1 (en) * 2015-03-26 2016-09-29 Pratt & Whitney Canada Corp. Laser drilling through multi-layer components
EP3618782B1 (en) * 2017-05-06 2021-05-26 Novaliq GmbH Drop dispenser
CN107414323A (zh) * 2017-06-09 2017-12-01 西安交通大学 评估正弦调制影响高反射率材料激光焊能量耦合行为的方法
DE102017210217A1 (de) * 2017-06-20 2018-12-20 Bundesdruckerei Gmbh Durchkontaktierung in einer beidseitig bedruckten Trägerfolie
CN107520545B (zh) * 2017-09-01 2019-06-21 大族激光科技产业集团股份有限公司 激光钻孔方法
US11581453B2 (en) 2018-02-23 2023-02-14 First Solar, Inc. Photovoltaic devices with narrow scribes and methods and systems for forming the same
US10615044B1 (en) * 2018-10-18 2020-04-07 Asm Technology Singapore Pte Ltd Material cutting using laser pulses
CN109648192A (zh) * 2018-12-10 2019-04-19 成都莱普科技有限公司 激光钻孔机能量控制方法
DE102018221365A1 (de) * 2018-12-10 2020-06-10 Trumpf Laser Gmbh Verfahren zum Abtragen von Material von einem Werkstück und Laserbearbeitungsanlage
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
US12304001B2 (en) * 2019-04-02 2025-05-20 Asmpt Singapore Pte. Ltd. Optimised laser cutting
JP7421951B2 (ja) * 2020-02-26 2024-01-25 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
DE102020106734A1 (de) * 2020-03-12 2021-09-16 Precitec Gmbh & Co. Kg Verfahren und Vorrichtung zum Einstechen in ein Werkstück mittels eines Laserstrahls
CN112570897B (zh) * 2020-11-17 2023-03-24 华东师范大学重庆研究院 飞秒脉冲簇产生方法及石英微流控芯片制造装置
KR102477657B1 (ko) * 2021-03-18 2022-12-14 주식회사 이오테크닉스 레이저 드릴링 방법
JP7724443B2 (ja) * 2021-06-16 2025-08-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法、および、基板の加工方法
JP7726752B2 (ja) * 2021-11-16 2025-08-20 大船企業日本株式会社 プリント基板における炭酸ガスレーザによるホール加工方法
CN114769847A (zh) * 2022-05-25 2022-07-22 英诺激光科技股份有限公司 一种激光精密加工设备及激光精密加工方法
US20240033857A1 (en) * 2022-07-28 2024-02-01 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for cracking a connecting rod
CN117483983B (zh) * 2023-11-08 2024-07-23 武汉华日精密激光股份有限公司 一种群孔激光加工方法
CN119368947A (zh) * 2024-11-26 2025-01-28 英诺激光科技股份有限公司 一种激光钻孔方法和系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10323781A (ja) * 1997-05-23 1998-12-08 Amada Co Ltd レーザ加工方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5037183A (en) * 1989-02-22 1991-08-06 United Technologies Corporation Laser drilling
DE3934587C2 (de) * 1989-10-17 1998-11-19 Bosch Gmbh Robert Verfahren zum Herstellen von mittels Laserstrahlung erzeugter, hochpräziser Durchgangsbohrungen in Werkstücken
JP2989112B2 (ja) * 1994-12-28 1999-12-13 ミヤチテクノス株式会社 レーザ溶接方法
GB2313079A (en) * 1996-05-16 1997-11-19 British Aerospace Two stage drilling by laser irradiation
US5973290A (en) 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
JP2000301372A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp 透明材料のレーザ加工方法
US6229113B1 (en) * 1999-07-19 2001-05-08 United Technologies Corporation Method and apparatus for producing a laser drilled hole in a structure
US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US6689985B2 (en) * 2001-01-17 2004-02-10 Orbotech, Ltd. Laser drill for use in electrical circuit fabrication
US20060091126A1 (en) * 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
JP2002331377A (ja) * 2001-05-08 2002-11-19 Koike Sanso Kogyo Co Ltd レーザピアシング方法
US6804574B2 (en) * 2002-07-25 2004-10-12 Matsushita Electric Industrial Co., Ltd. Method of using a computer with a laser drilling system
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
US7282666B2 (en) * 2004-05-07 2007-10-16 Micron Technology, Inc. Method and apparatus to increase throughput of processing using pulsed radiation sources
WO2007041460A2 (en) * 2005-10-03 2007-04-12 Aradigm Corporation Method and system for laser machining
US7742511B2 (en) 2006-09-29 2010-06-22 Pyrophotonics Lasers Inc. Method and system for a pulsed laser source emitting shaped optical waveforms
US7428253B2 (en) * 2006-09-29 2008-09-23 Pyrophotonics Lasers Inc. Method and system for a pulsed laser source emitting shaped optical waveforms
US7817685B2 (en) * 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2008194709A (ja) * 2007-02-09 2008-08-28 Hitachi Via Mechanics Ltd レーザ加工方法
WO2008144443A1 (en) * 2007-05-18 2008-11-27 Gsi Group Corporation Laser processing of conductive links
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
GB2458475B (en) * 2008-03-18 2011-10-26 Xsil Technology Ltd Processing of multilayer semiconductor wafers
JP5197271B2 (ja) * 2008-09-25 2013-05-15 住友重機械工業株式会社 レーザ加工装置、及び、レーザ加工方法
US8964801B2 (en) 2009-06-11 2015-02-24 Esi-Pyrophotonics Lasers, Inc. Method and system for stable and tunable high power pulsed laser system
WO2011140229A1 (en) * 2010-05-04 2011-11-10 Esi-Pyrophotonics Lasers Inc. Method and apparatus for drilling using a series of laser pulses

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10323781A (ja) * 1997-05-23 1998-12-08 Amada Co Ltd レーザ加工方法

Also Published As

Publication number Publication date
KR20130069593A (ko) 2013-06-26
TW201634165A (zh) 2016-10-01
US20120111841A1 (en) 2012-05-10
TWI647045B (zh) 2019-01-11
CN102939184A (zh) 2013-02-20
WO2011140229A1 (en) 2011-11-10
JP2013529137A (ja) 2013-07-18
JP6073780B2 (ja) 2017-02-01
US8816246B2 (en) 2014-08-26
TW201223677A (en) 2012-06-16
KR101866579B1 (ko) 2018-06-11

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