KR102240327B1 - 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법 - Google Patents

경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법 Download PDF

Info

Publication number
KR102240327B1
KR102240327B1 KR1020207015428A KR20207015428A KR102240327B1 KR 102240327 B1 KR102240327 B1 KR 102240327B1 KR 1020207015428 A KR1020207015428 A KR 1020207015428A KR 20207015428 A KR20207015428 A KR 20207015428A KR 102240327 B1 KR102240327 B1 KR 102240327B1
Authority
KR
South Korea
Prior art keywords
passes
laser
pattern
inner diameter
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020207015428A
Other languages
English (en)
Korean (ko)
Other versions
KR20200065097A (ko
Inventor
엠 셰인 노엘
토드 씨 세코이
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20200065097A publication Critical patent/KR20200065097A/ko
Application granted granted Critical
Publication of KR102240327B1 publication Critical patent/KR102240327B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
KR1020207015428A 2011-12-20 2012-12-19 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법 Expired - Fee Related KR102240327B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/331,472 US9289858B2 (en) 2011-12-20 2011-12-20 Drilling holes with minimal taper in cured silicone
US13/331,472 2011-12-20
PCT/US2012/070470 WO2013096372A1 (en) 2011-12-20 2012-12-19 Drilling holes with minimal taper in cured silicone

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147019195A Division KR20140103321A (ko) 2011-12-20 2012-12-19 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법

Publications (2)

Publication Number Publication Date
KR20200065097A KR20200065097A (ko) 2020-06-08
KR102240327B1 true KR102240327B1 (ko) 2021-04-14

Family

ID=48609323

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207015428A Expired - Fee Related KR102240327B1 (ko) 2011-12-20 2012-12-19 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법
KR1020147019195A Ceased KR20140103321A (ko) 2011-12-20 2012-12-19 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147019195A Ceased KR20140103321A (ko) 2011-12-20 2012-12-19 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법

Country Status (6)

Country Link
US (1) US9289858B2 (enExample)
JP (1) JP6433295B2 (enExample)
KR (2) KR102240327B1 (enExample)
CN (1) CN104010760B (enExample)
TW (1) TWI623368B (enExample)
WO (1) WO2013096372A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
JP2014130962A (ja) * 2012-12-28 2014-07-10 Ibiden Co Ltd キャビティの形成方法、キャビティの形成装置、プログラム、配線板の製造方法、及び配線板
US9414498B2 (en) * 2013-09-20 2016-08-09 Coherent, Inc. Via-hole drilling in a printed circuit board using a carbon monoxide laser
US9950392B2 (en) 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
US10274806B2 (en) 2015-11-06 2019-04-30 Coherent, Inc. Pulse-dividing method and apparatus for a pulsed carbon monoxide laser
US10423047B2 (en) 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus
US10592006B2 (en) 2017-01-13 2020-03-17 Microsoft Technology Licensing, Llc Pattern for increased coefficient of friction of input devices
GB2574111A (en) 2018-04-05 2019-11-27 British Polythene Ltd Improvements in or relating to container carriers
CN113523613B (zh) * 2020-04-29 2023-10-24 中国科学院宁波材料技术与工程研究所 激光加工锥孔的装置和方法
JP7427248B2 (ja) * 2020-07-21 2024-02-05 Uht株式会社 レーザー加工方法及びレーザー加工装置
CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法
DE102021005297A1 (de) 2021-10-25 2023-04-27 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Erzeugung angesenkter Löcher
CN114833472A (zh) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 用于航空发动机火焰筒的无锥度冷却气膜孔激光加工方法
DE102022124202A1 (de) * 2022-09-21 2024-03-21 TRUMPF Werkzeugmaschinen SE + Co. KG Stanz-Laser-Kombinationsverfahren und Stanz-Laser-Kombinationsmaschine zum Bearbeiten eines Werkstücks sowie Computerprogramm und computerlesbares Speichermedium
CN116833594A (zh) * 2023-08-01 2023-10-03 泰州职业技术学院 雾化器金属基片的微锥孔激光加工方法
CN117444429A (zh) * 2023-12-25 2024-01-26 西安晟光硅研半导体科技有限公司 一种基于微射流技术螺旋加工孔的工艺方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227965B (en) 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5731047A (en) 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
DE19741029A1 (de) 1997-09-18 1999-04-08 Bosch Gmbh Robert Optische Vorrichtung zum Bohren mittels Laserstrahls
US6275250B1 (en) * 1998-05-26 2001-08-14 Sdl, Inc. Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6720567B2 (en) * 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
DE10125397B4 (de) 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
US6811888B2 (en) 2001-09-07 2004-11-02 Siemens Vdo Automotive Corporation Anti-spatter coating for laser machining
DE10145184B4 (de) 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
CN1295052C (zh) * 2001-11-30 2007-01-17 松下电器产业株式会社 激光铣削方法及系统
US6627844B2 (en) 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
US6897405B2 (en) 2001-11-30 2005-05-24 Matsushita Electric Industrial Co., Ltd. Method of laser milling using constant tool path algorithm
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US20040017430A1 (en) * 2002-07-23 2004-01-29 Yosuke Mizuyama Laser processing method and laser processing apparatus
US6749285B2 (en) * 2002-07-25 2004-06-15 Matsushita Electric Industrial Co., Ltd. Method of milling repeatable exit holes in ink-jet nozzles
CN100374000C (zh) * 2002-10-04 2008-03-05 电子科学工业公司 在小型元件载体的弹性遮罩中形成尺寸精确的狭槽的方法
GB2395157B (en) 2002-11-15 2005-09-07 Rolls Royce Plc Laser driliing shaped holes
JP2004243404A (ja) 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
US7057133B2 (en) * 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
US7884315B2 (en) 2006-07-11 2011-02-08 Apple Inc. Invisible, light-transmissive display system
JP2007207898A (ja) * 2006-01-31 2007-08-16 Arai Pump Mfg Co Ltd キャリアプレートおよびその製造方法
JP2007268576A (ja) * 2006-03-31 2007-10-18 Hitachi Via Mechanics Ltd レーザ加工方法
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US7968820B2 (en) 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
US8237080B2 (en) * 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
US8526473B2 (en) 2008-03-31 2013-09-03 Electro Scientific Industries Methods and systems for dynamically generating tailored laser pulses
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
US8119949B2 (en) * 2008-11-26 2012-02-21 Honeywell International Inc. Laser cutting shaped holes by trepanning on the fly
DE102009006179B4 (de) * 2009-01-26 2010-12-30 Continental Automotive Gmbh Schaltungsanordnung zur Ansteuerung eines Einspritzventils
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing

Also Published As

Publication number Publication date
CN104010760A (zh) 2014-08-27
CN104010760B (zh) 2016-10-05
JP2015506276A (ja) 2015-03-02
TWI623368B (zh) 2018-05-11
KR20200065097A (ko) 2020-06-08
KR20140103321A (ko) 2014-08-26
JP6433295B2 (ja) 2018-12-05
US9289858B2 (en) 2016-03-22
WO2013096372A1 (en) 2013-06-27
TW201334905A (zh) 2013-09-01
US20130154159A1 (en) 2013-06-20

Similar Documents

Publication Publication Date Title
KR102240327B1 (ko) 경화된 실리콘에 테이퍼를 최소화한 구멍을 천공하는 방법
KR101866579B1 (ko) 레이저 펄스의 시리즈를 이용하는 드릴링 방법 및 장치
TWI545690B (zh) 以高脈衝重覆頻率的皮秒雷射脈衝來雷射直接剝蝕
JP4774146B2 (ja) レーザを用いて波長より小さなピッチで穴を開けるための方法および装置
JP5479454B2 (ja) ガラス基板内に微細構造を形成するための方法およびシステム
KR100829876B1 (ko) 레이저 기계가공의 제어
JP2009178772A (ja) レーザーによるアブレーション加工方法
JP2004533932A (ja) 硬質な非金属基板における開口部の加熱形成方法
JP7379662B2 (ja) ワークピースを加工する方法
AU2002327193A1 (en) Method of ablating an opening in a hard, non-metallic substrate
JP6608040B2 (ja) 複合加工方法を用いたシャドウマスクの製造方法及びこれにより製造されたシャドウマスク
KR20220016855A (ko) 레이저 가공 장치, 이를 작동하기 위한 방법, 및 이를 사용하여 피가공물을 가공하는 방법
CN104944756A (zh) 激光加工强化玻璃
JP5760251B2 (ja) ガラス基板のレーザ加工装置
WO2016083909A1 (en) Station for processing the surfaces of ceramic products, punches, dies and processing method
JP2004322106A (ja) レーザ加工方法およびレーザ加工装置
JP5923765B2 (ja) ガラス基板のレーザ加工装置
WO2015136948A1 (ja) レーザ加工方法
KR20180136271A (ko) 고속 스캐너를 이용한 가공물 절단 방법 및 절단 장치
JP2006503713A (ja) 連続して最適化される焦点深度を用いたレーザ孔開け装置および方法
KR102433555B1 (ko) 막형성장치 및 막형성방법
KR20130043276A (ko) 동심원 가공 방식을 사용한 반도체 패키지의 레이저 가공 방법
KR20180013679A (ko) 취성재료 기판의 레이저 가공방법 및 레이저 가공장치

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

St.27 status event code: A-0-1-A10-A18-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

Fee payment year number: 1

St.27 status event code: A-2-2-U10-U12-oth-PR1002

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

Not in force date: 20240409

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

St.27 status event code: A-4-4-U10-U13-oth-PC1903

PC1903 Unpaid annual fee

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240409

St.27 status event code: N-4-6-H10-H13-oth-PC1903