CN104010760B - 在经固化硅酮中钻制具有极小锥度的孔 - Google Patents

在经固化硅酮中钻制具有极小锥度的孔 Download PDF

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Publication number
CN104010760B
CN104010760B CN201280063590.1A CN201280063590A CN104010760B CN 104010760 B CN104010760 B CN 104010760B CN 201280063590 A CN201280063590 A CN 201280063590A CN 104010760 B CN104010760 B CN 104010760B
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CN
China
Prior art keywords
over time
laser
diameter
pattern
succession
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Expired - Fee Related
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CN201280063590.1A
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English (en)
Chinese (zh)
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CN104010760A (zh
Inventor
M·夏恩·诺维尔
托德·C·希寇伊
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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Publication of CN104010760A publication Critical patent/CN104010760A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
CN201280063590.1A 2011-12-20 2012-12-19 在经固化硅酮中钻制具有极小锥度的孔 Expired - Fee Related CN104010760B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/331,472 2011-12-20
US13/331,472 US9289858B2 (en) 2011-12-20 2011-12-20 Drilling holes with minimal taper in cured silicone
PCT/US2012/070470 WO2013096372A1 (en) 2011-12-20 2012-12-19 Drilling holes with minimal taper in cured silicone

Publications (2)

Publication Number Publication Date
CN104010760A CN104010760A (zh) 2014-08-27
CN104010760B true CN104010760B (zh) 2016-10-05

Family

ID=48609323

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280063590.1A Expired - Fee Related CN104010760B (zh) 2011-12-20 2012-12-19 在经固化硅酮中钻制具有极小锥度的孔

Country Status (6)

Country Link
US (1) US9289858B2 (enExample)
JP (1) JP6433295B2 (enExample)
KR (2) KR20140103321A (enExample)
CN (1) CN104010760B (enExample)
TW (1) TWI623368B (enExample)
WO (1) WO2013096372A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
JP2014130962A (ja) * 2012-12-28 2014-07-10 Ibiden Co Ltd キャビティの形成方法、キャビティの形成装置、プログラム、配線板の製造方法、及び配線板
US9414498B2 (en) 2013-09-20 2016-08-09 Coherent, Inc. Via-hole drilling in a printed circuit board using a carbon monoxide laser
US9950392B2 (en) * 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
US10274806B2 (en) 2015-11-06 2019-04-30 Coherent, Inc. Pulse-dividing method and apparatus for a pulsed carbon monoxide laser
US10423047B2 (en) 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus
US10592006B2 (en) 2017-01-13 2020-03-17 Microsoft Technology Licensing, Llc Pattern for increased coefficient of friction of input devices
PL3774574T3 (pl) * 2018-04-05 2022-06-20 British Polythene Limited Ulepszenia nośnika pojemnika lub odnoszące się do niego
CN113523613B (zh) * 2020-04-29 2023-10-24 中国科学院宁波材料技术与工程研究所 激光加工锥孔的装置和方法
JP7427248B2 (ja) * 2020-07-21 2024-02-05 Uht株式会社 レーザー加工方法及びレーザー加工装置
CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法
DE102021005297A1 (de) 2021-10-25 2023-04-27 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Erzeugung angesenkter Löcher
CN114833472A (zh) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 用于航空发动机火焰筒的无锥度冷却气膜孔激光加工方法
DE102022124202A1 (de) * 2022-09-21 2024-03-21 TRUMPF Werkzeugmaschinen SE + Co. KG Stanz-Laser-Kombinationsverfahren und Stanz-Laser-Kombinationsmaschine zum Bearbeiten eines Werkstücks sowie Computerprogramm und computerlesbares Speichermedium
CN116833594A (zh) * 2023-08-01 2023-10-03 泰州职业技术学院 雾化器金属基片的微锥孔激光加工方法
CN117444429A (zh) * 2023-12-25 2024-01-26 西安晟光硅研半导体科技有限公司 一种基于微射流技术螺旋加工孔的工艺方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000010674A (ko) * 1996-05-17 2000-02-25 레인하트 죠셉 엘. 에너지 밀도가 가변적인 자외선 레이저 펄스를 사용하여, 다층으로 된 타깃에 블라인드 공간부를 형성하는 방법b
US20030047544A1 (en) * 2001-09-13 2003-03-13 Hubert De Steur Method of laser drilling
US20030103107A1 (en) * 2001-11-30 2003-06-05 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm
US20060027544A1 (en) * 2004-08-04 2006-02-09 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
WO2008137455A1 (en) * 2007-05-03 2008-11-13 Electro Scientific Industries, Inc. Method for machining tapered micro holes
WO2009120585A2 (en) * 2008-03-27 2009-10-01 Electro Scientific Industries, Inc. Method and apparatus for laser drilling holes with gaussian pulses

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227965B (en) 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5731047A (en) 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
DE19741029A1 (de) 1997-09-18 1999-04-08 Bosch Gmbh Robert Optische Vorrichtung zum Bohren mittels Laserstrahls
US6275250B1 (en) * 1998-05-26 2001-08-14 Sdl, Inc. Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6720567B2 (en) * 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
DE10125397B4 (de) 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
US6811888B2 (en) 2001-09-07 2004-11-02 Siemens Vdo Automotive Corporation Anti-spatter coating for laser machining
US6627844B2 (en) 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
CN1295052C (zh) * 2001-11-30 2007-01-17 松下电器产业株式会社 激光铣削方法及系统
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US20040017430A1 (en) * 2002-07-23 2004-01-29 Yosuke Mizuyama Laser processing method and laser processing apparatus
US6749285B2 (en) * 2002-07-25 2004-06-15 Matsushita Electric Industrial Co., Ltd. Method of milling repeatable exit holes in ink-jet nozzles
DE10393438T5 (de) * 2002-10-04 2005-09-08 Electro Scientific Industries, Inc., Portland Verfahren zum Ausbilden von maßgenauen Schlitzen in einer elastischen Maske eines Miniaturbauteilträgers
GB2395157B (en) 2002-11-15 2005-09-07 Rolls Royce Plc Laser driliing shaped holes
JP2004243404A (ja) 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
US7057133B2 (en) * 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
KR101394947B1 (ko) * 2005-07-06 2014-05-14 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
US7884315B2 (en) 2006-07-11 2011-02-08 Apple Inc. Invisible, light-transmissive display system
JP2007207898A (ja) * 2006-01-31 2007-08-16 Arai Pump Mfg Co Ltd キャリアプレートおよびその製造方法
JP2007268576A (ja) * 2006-03-31 2007-10-18 Hitachi Via Mechanics Ltd レーザ加工方法
US7968820B2 (en) 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US8526473B2 (en) 2008-03-31 2013-09-03 Electro Scientific Industries Methods and systems for dynamically generating tailored laser pulses
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
US8119949B2 (en) * 2008-11-26 2012-02-21 Honeywell International Inc. Laser cutting shaped holes by trepanning on the fly
DE102009006179B4 (de) * 2009-01-26 2010-12-30 Continental Automotive Gmbh Schaltungsanordnung zur Ansteuerung eines Einspritzventils
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000010674A (ko) * 1996-05-17 2000-02-25 레인하트 죠셉 엘. 에너지 밀도가 가변적인 자외선 레이저 펄스를 사용하여, 다층으로 된 타깃에 블라인드 공간부를 형성하는 방법b
US20030047544A1 (en) * 2001-09-13 2003-03-13 Hubert De Steur Method of laser drilling
US20030103107A1 (en) * 2001-11-30 2003-06-05 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm
US20060027544A1 (en) * 2004-08-04 2006-02-09 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
WO2008137455A1 (en) * 2007-05-03 2008-11-13 Electro Scientific Industries, Inc. Method for machining tapered micro holes
WO2009120585A2 (en) * 2008-03-27 2009-10-01 Electro Scientific Industries, Inc. Method and apparatus for laser drilling holes with gaussian pulses

Also Published As

Publication number Publication date
KR20200065097A (ko) 2020-06-08
JP6433295B2 (ja) 2018-12-05
JP2015506276A (ja) 2015-03-02
TW201334905A (zh) 2013-09-01
KR20140103321A (ko) 2014-08-26
KR102240327B1 (ko) 2021-04-14
CN104010760A (zh) 2014-08-27
US9289858B2 (en) 2016-03-22
WO2013096372A1 (en) 2013-06-27
US20130154159A1 (en) 2013-06-20
TWI623368B (zh) 2018-05-11

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