JP2013031879A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013031879A5 JP2013031879A5 JP2012194091A JP2012194091A JP2013031879A5 JP 2013031879 A5 JP2013031879 A5 JP 2013031879A5 JP 2012194091 A JP2012194091 A JP 2012194091A JP 2012194091 A JP2012194091 A JP 2012194091A JP 2013031879 A5 JP2013031879 A5 JP 2013031879A5
- Authority
- JP
- Japan
- Prior art keywords
- laser
- pulse
- light
- ultrashort
- illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 39
- 238000000034 method Methods 0.000 claims 31
- 239000012780 transparent material Substances 0.000 claims 14
- 238000005286 illumination Methods 0.000 claims 12
- 230000004048 modification Effects 0.000 claims 7
- 238000012986 modification Methods 0.000 claims 7
- 230000003287 optical effect Effects 0.000 claims 6
- 230000003993 interaction Effects 0.000 claims 3
- 229910052594 sapphire Inorganic materials 0.000 claims 3
- 239000010980 sapphire Substances 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 3
- 238000010521 absorption reaction Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000001902 propagating effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012194091A JP5727433B2 (ja) | 2012-09-04 | 2012-09-04 | 超短パルスレーザでの透明材料処理 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012194091A JP5727433B2 (ja) | 2012-09-04 | 2012-09-04 | 超短パルスレーザでの透明材料処理 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006241654A Division JP5522881B2 (ja) | 2006-09-06 | 2006-09-06 | 材料を接合するための方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014258750A Division JP6005125B2 (ja) | 2014-12-22 | 2014-12-22 | 超短パルスレーザでの透明材料処理 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013031879A JP2013031879A (ja) | 2013-02-14 |
| JP2013031879A5 true JP2013031879A5 (enExample) | 2013-06-27 |
| JP5727433B2 JP5727433B2 (ja) | 2015-06-03 |
Family
ID=47788219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012194091A Active JP5727433B2 (ja) | 2012-09-04 | 2012-09-04 | 超短パルスレーザでの透明材料処理 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5727433B2 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| JP5836998B2 (ja) * | 2013-04-23 | 2015-12-24 | 株式会社豊田中央研究所 | クラックの生成方法、レーザによる割断方法およびクラック生成装置 |
| JP6141715B2 (ja) * | 2013-07-31 | 2017-06-07 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法 |
| US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| JP6207306B2 (ja) * | 2013-08-30 | 2017-10-04 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法及びレーザ加工装置 |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9815730B2 (en) * | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| JP6270520B2 (ja) * | 2014-02-07 | 2018-01-31 | 株式会社ディスコ | ウェーハの加工方法 |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
| EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
| JP6788571B2 (ja) | 2014-07-14 | 2020-11-25 | コーニング インコーポレイテッド | 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法 |
| EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| CN107835794A (zh) | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | 在挠性基材板中连续制造孔的方法和与此相关的产品 |
| CN109311725B (zh) | 2016-05-06 | 2022-04-26 | 康宁股份有限公司 | 从透明基材激光切割及移除轮廓形状 |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
| EP3507057A1 (en) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
| CN113399816B (zh) | 2016-09-30 | 2023-05-16 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| CN110167891A (zh) | 2016-10-24 | 2019-08-23 | 康宁股份有限公司 | 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位 |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| DE102020134197A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
| CN117799173B (zh) * | 2024-03-01 | 2024-06-14 | 珠海市申科谱工业科技有限公司 | 一种微型塑料件激光焊接系统以及焊接方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3530114B2 (ja) * | 2000-07-11 | 2004-05-24 | 忠弘 大見 | 単結晶の切断方法 |
| JP2004337902A (ja) * | 2003-05-14 | 2004-12-02 | Hamamatsu Photonics Kk | レーザ加工装置及びレーザ加工方法 |
| JP4709482B2 (ja) * | 2003-08-22 | 2011-06-22 | 一良 伊東 | 超短光パルスによる透明材料の接合方法、物質接合装置、接合物質 |
| JP2005268752A (ja) * | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
| JP4631044B2 (ja) * | 2004-05-26 | 2011-02-16 | 国立大学法人北海道大学 | レーザ加工方法および装置 |
| JP2006007619A (ja) * | 2004-06-25 | 2006-01-12 | Aisin Seiki Co Ltd | レーザ加工方法及びレーザ加工装置 |
| JP2006150385A (ja) * | 2004-11-26 | 2006-06-15 | Canon Inc | レーザ割断方法 |
-
2012
- 2012-09-04 JP JP2012194091A patent/JP5727433B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013031879A5 (enExample) | ||
| US11292084B2 (en) | Method for joining a substrate and a part with structuring of the substrate | |
| TWI460043B (zh) | 以高斯脈衝做雷射鑽孔的方法與設備 | |
| JP7090594B2 (ja) | レーザ加工するための装置および方法 | |
| KR102426820B1 (ko) | 작업 평면에서 레이저 빔의 횡전력 분포를 제어하는 금속 재료의 레이저 공정 방법 및 상기 방법을 실시하기 위한 머신 및 컴퓨터 프로그램 | |
| JP5591129B2 (ja) | 超短パルスレーザによる透明材料処理 | |
| JP5727433B2 (ja) | 超短パルスレーザでの透明材料処理 | |
| JP2017528322A5 (enExample) | ||
| JP6005125B2 (ja) | 超短パルスレーザでの透明材料処理 | |
| JP2016539005A (ja) | 粗面を有する基板の内部にマーキングを施すための方法及び装置 | |
| CN105458529A (zh) | 一种高效制备高深径比微孔阵列的方法 | |
| CN106029293A (zh) | 槽与孔的激光加工 | |
| KR20160010396A (ko) | 레이저 빔 초점 라인을 사용하여 시트형 기판들을 레이저 기반으로 가공하는 방법 및 디바이스 | |
| RU2014115284A (ru) | Способ и устройство для формирования рельефной поверхности на стальном тиснильном вале | |
| JP2010524692A5 (enExample) | ||
| JP5522881B2 (ja) | 材料を接合するための方法 | |
| TW200602279A (en) | Scribing apparatus and scribing method employing scribing apparatus | |
| JP6466369B2 (ja) | 超短パルスレーザでの透明材料処理 | |
| JP2013119106A5 (enExample) | ||
| JP5902281B2 (ja) | レーザー加工装置 | |
| EP4474097A3 (en) | Systems and methods for drilling vias in transparent materials | |
| CN202506976U (zh) | 一种可调深度的印刷模版飞秒激光打孔装置 | |
| TWI577488B (zh) | 表面加工方法 | |
| KR102898417B1 (ko) | 레이저 가공 장치 및 레이저 가공 방법 | |
| JP6308733B2 (ja) | レーザ加工装置および製造方法 |