JP5727433B2 - 超短パルスレーザでの透明材料処理 - Google Patents

超短パルスレーザでの透明材料処理 Download PDF

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JP5727433B2
JP5727433B2 JP2012194091A JP2012194091A JP5727433B2 JP 5727433 B2 JP5727433 B2 JP 5727433B2 JP 2012194091 A JP2012194091 A JP 2012194091A JP 2012194091 A JP2012194091 A JP 2012194091A JP 5727433 B2 JP5727433 B2 JP 5727433B2
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laser
pulse
welding
ridge
materials
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JP2013031879A (ja
JP2013031879A5 (enExample
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マイケル ボヴァツェック ジェームズ
マイケル ボヴァツェック ジェームズ
ワイ． アライ アラン
ワイ． アライ アラン
ヨシノ フミヨ
ヨシノ フミヨ
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イムラ アメリカ インコーポレイテッド
イムラ アメリカ インコーポレイテッド
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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
JP2012194091A 2012-09-04 2012-09-04 超短パルスレーザでの透明材料処理 Active JP5727433B2 (ja)

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Related Parent Applications (1)

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JP2006241654A Division JP5522881B2 (ja) 2006-09-06 2006-09-06 材料を接合するための方法

Related Child Applications (1)

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JP2014258750A Division JP6005125B2 (ja) 2014-12-22 2014-12-22 超短パルスレーザでの透明材料処理

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JP2013031879A5 JP2013031879A5 (enExample) 2013-06-27
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EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP5836998B2 (ja) * 2013-04-23 2015-12-24 株式会社豊田中央研究所 クラックの生成方法、レーザによる割断方法およびクラック生成装置
JP6141715B2 (ja) * 2013-07-31 2017-06-07 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
JP6207306B2 (ja) * 2013-08-30 2017-10-04 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9815730B2 (en) * 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
JP6270520B2 (ja) * 2014-02-07 2018-01-31 株式会社ディスコ ウェーハの加工方法
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
DE102020134197A1 (de) * 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
CN117799173B (zh) * 2024-03-01 2024-06-14 珠海市申科谱工业科技有限公司 一种微型塑料件激光焊接系统以及焊接方法

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JP4709482B2 (ja) * 2003-08-22 2011-06-22 一良 伊東 超短光パルスによる透明材料の接合方法、物質接合装置、接合物質
JP2005268752A (ja) * 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
JP4631044B2 (ja) * 2004-05-26 2011-02-16 国立大学法人北海道大学 レーザ加工方法および装置
JP2006007619A (ja) * 2004-06-25 2006-01-12 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
JP2006150385A (ja) * 2004-11-26 2006-06-15 Canon Inc レーザ割断方法

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