JP2018157173A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018157173A5 JP2018157173A5 JP2017101964A JP2017101964A JP2018157173A5 JP 2018157173 A5 JP2018157173 A5 JP 2018157173A5 JP 2017101964 A JP2017101964 A JP 2017101964A JP 2017101964 A JP2017101964 A JP 2017101964A JP 2018157173 A5 JP2018157173 A5 JP 2018157173A5
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating layer
- copper
- layer
- phosphorus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 187
- 238000007747 plating Methods 0.000 claims 72
- 229910052759 nickel Inorganic materials 0.000 claims 66
- 239000010949 copper Substances 0.000 claims 64
- 229910052802 copper Inorganic materials 0.000 claims 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 34
- 239000011574 phosphorus Substances 0.000 claims 28
- 229910052698 phosphorus Inorganic materials 0.000 claims 28
- 229910000679 solder Inorganic materials 0.000 claims 19
- 239000002184 metal Substances 0.000 claims 17
- 229910052751 metal Inorganic materials 0.000 claims 17
- 238000004519 manufacturing process Methods 0.000 claims 10
- 229910045601 alloy Inorganic materials 0.000 claims 9
- 239000000956 alloy Substances 0.000 claims 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- 239000000460 chlorine Substances 0.000 claims 4
- 229910052801 chlorine Inorganic materials 0.000 claims 4
- 230000006378 damage Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 150000001879 copper Chemical class 0.000 claims 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- 235000002906 tartaric acid Nutrition 0.000 claims 1
- 239000011975 tartaric acid Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016192095 | 2016-09-29 | ||
| JP2016192095 | 2016-09-29 | ||
| JP2017061686 | 2017-03-27 | ||
| JP2017061686 | 2017-03-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018157173A JP2018157173A (ja) | 2018-10-04 |
| JP2018157173A5 true JP2018157173A5 (enExample) | 2020-07-02 |
| JP7117747B2 JP7117747B2 (ja) | 2022-08-15 |
Family
ID=63717420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017101964A Active JP7117747B2 (ja) | 2016-09-29 | 2017-05-23 | 電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7117747B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109504956A (zh) * | 2018-11-02 | 2019-03-22 | 江西华度电子新材料有限公司 | 一种提高热管、热板吸液芯表面抗氧化的处理方法 |
| US20210387290A1 (en) * | 2018-12-17 | 2021-12-16 | Heraeus Precious Metals North America Conshohocken Llc | Process for forming an electric heater |
| CN110644025A (zh) * | 2019-11-12 | 2020-01-03 | 长沙理工大学 | 一种超薄镍铜合金箔及其制备方法 |
| KR102325114B1 (ko) * | 2019-12-06 | 2021-11-11 | 제엠제코(주) | 반도체 패키지의 제조 방법 |
| CN115767948B (zh) * | 2022-11-14 | 2024-04-02 | 北京自动化控制设备研究所 | Mems惯性系统高密度低应力集成方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066716A (ja) | 2004-08-27 | 2006-03-09 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP4964009B2 (ja) | 2007-04-17 | 2012-06-27 | 株式会社豊田中央研究所 | パワー半導体モジュール |
| JP2009108394A (ja) | 2007-10-31 | 2009-05-21 | Meltex Inc | ニッケルで形成された被めっき表面の前処理に用いる活性化処理液及びその活性化処理液を用いた前処理方法 |
| JP2010040691A (ja) | 2008-08-04 | 2010-02-18 | Ebara Corp | 鉛フリーバンプ形成方法 |
| JP4805412B2 (ja) | 2008-09-18 | 2011-11-02 | 古河電気工業株式会社 | 金属張積層体、回路基板及び電子部品 |
| JP5387388B2 (ja) | 2009-12-25 | 2014-01-15 | サンケン電気株式会社 | 電極構造 |
| JP5502967B2 (ja) | 2012-11-05 | 2014-05-28 | 株式会社Ｊｃｕ | 酸性電解銅めっき液 |
| JP6281468B2 (ja) | 2014-10-30 | 2018-02-21 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
| JP6455197B2 (ja) | 2015-02-06 | 2019-01-23 | 凸版印刷株式会社 | 配線基板、半導体装置及び半導体装置の製造方法 |
-
2017
- 2017-05-23 JP JP2017101964A patent/JP7117747B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018157173A5 (enExample) | ||
| JP2011023574A5 (enExample) | ||
| TW200843064A (en) | Surface structure of a packaging substrate and a fabricating method thereof | |
| JP2017108099A (ja) | 電子部品パッケージ及びこれを含む電子機器 | |
| JP5874827B2 (ja) | 接合用部材 | |
| US10840212B2 (en) | Bonding package components through plating | |
| TW201428865A (zh) | 金屬芯錫球及利用它的半導體裝置的散熱連接結構 | |
| JP7014535B2 (ja) | 導電性ボール及び電子装置とそれらの製造方法 | |
| CN103187324A (zh) | 一种焊点制备方法及其结构 | |
| KR20140035701A (ko) | 금 박막 형성 방법 및 인쇄회로기판 | |
| CN104070294B (zh) | 电子器件用的接合构造和电子器件 | |
| TWI503196B (zh) | 具多層介金屬層的銲點結構 | |
| CN103050466A (zh) | 半导体封装件及其制法 | |
| TW201133662A (en) | Copper-Manganese compound structure for electronic packaging application | |
| CN104465573B (zh) | 一种以FeNi合金或FeNiP合金作为反应界面层的柱状凸点封装结构 | |
| JP2019085631A5 (enExample) | ||
| CN103208428B (zh) | 封装基板及其制法 | |
| JP2017022357A (ja) | 回路基板およびその製造方法 | |
| JP2014146635A (ja) | はんだ接合方法およびはんだボールと電極との接合構造体 | |
| US10804241B2 (en) | Non-porous copper to copper interconnect | |
| TW200939431A (en) | Ball grid array assembly and solder pad | |
| JP2004114123A (ja) | はんだ被覆ボールおよびその製造方法、ならびに半導体接続構造の形成方法 | |
| TWI424545B (zh) | 封裝基板之製法 | |
| JP5552957B2 (ja) | 端子構造、プリント配線板、モジュール基板及び電子デバイス | |
| CN109644561A (zh) | 布线基板和其制造方法 |