JP2019085631A5 - - Google Patents
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- Publication number
- JP2019085631A5 JP2019085631A5 JP2017216616A JP2017216616A JP2019085631A5 JP 2019085631 A5 JP2019085631 A5 JP 2019085631A5 JP 2017216616 A JP2017216616 A JP 2017216616A JP 2017216616 A JP2017216616 A JP 2017216616A JP 2019085631 A5 JP2019085631 A5 JP 2019085631A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- layer
- plating layer
- phosphorus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 54
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 20
- 229910000679 solder Inorganic materials 0.000 claims 11
- 229910052759 nickel Inorganic materials 0.000 claims 10
- JUWOETZNAMLKMG-UHFFFAOYSA-N [P].[Ni].[Cu] Chemical compound [P].[Ni].[Cu] JUWOETZNAMLKMG-UHFFFAOYSA-N 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 7
- 239000010949 copper Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 7
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims 7
- 239000000463 material Substances 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 5
- 239000000956 alloy Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 150000001879 copper Chemical class 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 150000007522 mineralic acids Chemical class 0.000 claims 2
- 150000002815 nickel Chemical class 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017216616A JP6967252B2 (ja) | 2017-11-09 | 2017-11-09 | 電子部品の製造方法、及び電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017216616A JP6967252B2 (ja) | 2017-11-09 | 2017-11-09 | 電子部品の製造方法、及び電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019085631A JP2019085631A (ja) | 2019-06-06 |
| JP2019085631A5 true JP2019085631A5 (enExample) | 2020-11-26 |
| JP6967252B2 JP6967252B2 (ja) | 2021-11-17 |
Family
ID=66763946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017216616A Active JP6967252B2 (ja) | 2017-11-09 | 2017-11-09 | 電子部品の製造方法、及び電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6967252B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7306712B2 (ja) * | 2019-07-26 | 2023-07-11 | 株式会社クオルテック | ヒータチップ及び接合層評価装置 |
| CN112259383B (zh) * | 2020-10-19 | 2022-02-22 | 南京工程学院 | 一种包覆钼酸镍铜复合膜的电极原位制备方法 |
| JP2023079124A (ja) | 2021-11-26 | 2023-06-07 | 国立大学法人東北大学 | パワー半導体素子及びパワー半導体モジュール |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3910363B2 (ja) * | 2000-12-28 | 2007-04-25 | 富士通株式会社 | 外部接続端子 |
| CN102738107B (zh) * | 2006-05-29 | 2014-08-27 | 瑞萨电子株式会社 | 电子部件、半导体封装件和电子器件 |
| JP5450192B2 (ja) * | 2010-03-24 | 2014-03-26 | 日立オートモティブシステムズ株式会社 | パワーモジュールとその製造方法 |
| JP6569511B2 (ja) * | 2015-12-17 | 2019-09-04 | 三菱マテリアル株式会社 | 接合体、冷却器付きパワーモジュール用基板、冷却器付きパワーモジュール用基板の製造方法 |
-
2017
- 2017-11-09 JP JP2017216616A patent/JP6967252B2/ja active Active
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