JP2018121011A - 積層セラミック電子部品 - Google Patents
積層セラミック電子部品 Download PDFInfo
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- JP2018121011A JP2018121011A JP2017012890A JP2017012890A JP2018121011A JP 2018121011 A JP2018121011 A JP 2018121011A JP 2017012890 A JP2017012890 A JP 2017012890A JP 2017012890 A JP2017012890 A JP 2017012890A JP 2018121011 A JP2018121011 A JP 2018121011A
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- multilayer ceramic
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- ceramic capacitor
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- 239000000919 ceramic Substances 0.000 title claims abstract description 101
- 239000003985 ceramic capacitor Substances 0.000 description 65
- 238000005452 bending Methods 0.000 description 26
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
- H01G4/1245—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
上記セラミック素体は、第1軸方向を向いた第1及び第2主面と、上記第1軸に直交する第2軸方向を向いた第1及び第2端面と、上記第1端面に引き出された第1内部電極と、上記第1内部電極に対向し、上記第2端面に引き出された第2内部電極と、を有し、上記第1及び第2軸に直交する第3軸方向に長尺に形成され、上記第1軸方向の寸法が80μm以下である。
上記第1外部電極は、上記第1端面を覆い、上記第1端面から上記第1及び第2主面に延出する。
上記第2外部電極は、上記第2端面を覆い、上記第2端面から上記第1及び第2主面に延出する。
この構成では、積層セラミック電子部品の実装時に第1及び第2外部電極における半田喰われを効果的に防止することができる。
この構成では、セラミック素体の厚さ方向の強度が更に低くなるため、外部電極によってセラミック素体を補強する構成が特に有効である。
図面には、適宜相互に直交するX軸、Y軸、及びZ軸が示されている。X軸、Y軸、及びZ軸は全図において共通である。
図1〜3は、本発明の一実施形態に係る積層セラミックコンデンサ10を示す図である。図1は、積層セラミックコンデンサ10の斜視図である。図2は、積層セラミックコンデンサ10の図1のA−A'線に沿った断面図である。図3は、積層セラミックコンデンサ10の図1のB−B'線に沿った断面図である。
図5は、比較例に係る積層セラミックコンデンサ110の斜視図である。積層セラミックコンデンサ110は、本実施形態に係る積層セラミックコンデンサ10とは異なり、セラミック素体111の長手方向(X軸方向)の両端部に外部電極114,115が設けられた一般的な構成を有する。
実施例に係る積層セラミックコンデンサ10及び比較例に係る積層セラミックコンデンサ110についてそれぞれ、セラミック素体11,111の厚さT1が異なる7種類のサンプルを作製した。積層セラミックコンデンサ10,110のいずれのサンプルにおいても、X軸方向の寸法を1.0mmとし、Y軸方向の寸法を0.5mmとした。
以上、本発明の実施形態について説明したが、本発明は上述の実施形態にのみ限定されるものではなく種々変更を加え得ることは勿論である。
11…セラミック素体
12,13…内部電極
14,15…外部電極
16…容量形成部
17…カバー部
18…サイドマージン部
Claims (3)
- 第1軸方向を向いた第1及び第2主面と、前記第1軸に直交する第2軸方向を向いた第1及び第2端面と、前記第1端面に引き出された第1内部電極と、前記第1内部電極に対向し、前記第2端面に引き出された第2内部電極と、を有し、前記第1及び第2軸に直交する第3軸方向に長尺に形成され、前記第1軸方向の寸法が80μm以下であるセラミック素体と、
前記第1端面を覆い、前記第1端面から前記第1及び第2主面に延出する第1外部電極と、
前記第2端面を覆い、前記第2端面から前記第1及び第2主面に延出する第2外部電極と、
を具備する積層セラミック電子部品。 - 請求項1に記載の積層セラミック電子部品であって、
前記第1及び第2外部電極の前記1及び第2主面上における厚さが2μm以上である
積層セラミック電子部品。 - 請求項1又は2に記載の積層セラミック電子部品であって、
前記セラミック素体の前記第1軸方向の寸法が前記セラミック素体の前記第3軸方向の寸法の5分の1以下である
積層セラミック電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017012890A JP7302940B2 (ja) | 2017-01-27 | 2017-01-27 | 積層セラミック電子部品 |
CN201810076381.XA CN108364789B (zh) | 2017-01-27 | 2018-01-26 | 层叠陶瓷电子部件 |
US15/881,433 US10395830B2 (en) | 2017-01-27 | 2018-01-26 | Multi-layer ceramic electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017012890A JP7302940B2 (ja) | 2017-01-27 | 2017-01-27 | 積層セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018121011A true JP2018121011A (ja) | 2018-08-02 |
JP7302940B2 JP7302940B2 (ja) | 2023-07-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017012890A Active JP7302940B2 (ja) | 2017-01-27 | 2017-01-27 | 積層セラミック電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10395830B2 (ja) |
JP (1) | JP7302940B2 (ja) |
CN (1) | CN108364789B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020043169A (ja) * | 2018-09-07 | 2020-03-19 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP2020096110A (ja) * | 2018-12-14 | 2020-06-18 | 太陽誘電株式会社 | 積層セラミック電子部品及び回路基板 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7182926B2 (ja) | 2018-07-17 | 2022-12-05 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP7289677B2 (ja) * | 2019-03-13 | 2023-06-12 | 太陽誘電株式会社 | 多端子コンデンサ、多端子コンデンサの製造方法、ならびに、多端子コンデンサ実装回路基板 |
US11610738B2 (en) * | 2019-09-30 | 2023-03-21 | Avago Technologies International Sales PTE, Limited | Low profile passive components and devices and packages including the same |
JP2021068733A (ja) * | 2019-10-17 | 2021-04-30 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
JP2022085196A (ja) * | 2020-11-27 | 2022-06-08 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
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2017
- 2017-01-27 JP JP2017012890A patent/JP7302940B2/ja active Active
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2018
- 2018-01-26 CN CN201810076381.XA patent/CN108364789B/zh active Active
- 2018-01-26 US US15/881,433 patent/US10395830B2/en active Active
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JP2015050452A (ja) * | 2013-08-30 | 2015-03-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 |
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JP2020043169A (ja) * | 2018-09-07 | 2020-03-19 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP7065735B2 (ja) | 2018-09-07 | 2022-05-12 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP2020096110A (ja) * | 2018-12-14 | 2020-06-18 | 太陽誘電株式会社 | 積層セラミック電子部品及び回路基板 |
JP7269723B2 (ja) | 2018-12-14 | 2023-05-09 | 太陽誘電株式会社 | 積層セラミック電子部品及び回路基板 |
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US20180218840A1 (en) | 2018-08-02 |
CN108364789A (zh) | 2018-08-03 |
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