JP2018098327A5 - - Google Patents
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- JP2018098327A5 JP2018098327A5 JP2016240850A JP2016240850A JP2018098327A5 JP 2018098327 A5 JP2018098327 A5 JP 2018098327A5 JP 2016240850 A JP2016240850 A JP 2016240850A JP 2016240850 A JP2016240850 A JP 2016240850A JP 2018098327 A5 JP2018098327 A5 JP 2018098327A5
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- JP
- Japan
- Prior art keywords
- ceramic
- main component
- layer
- additive
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims description 77
- 239000000654 additive Substances 0.000 claims description 45
- 230000000996 additive effect Effects 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000003985 ceramic capacitor Substances 0.000 claims description 11
- 229910052878 cordierite Inorganic materials 0.000 claims description 8
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Images
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016240850A JP2018098327A (ja) | 2016-12-13 | 2016-12-13 | 積層セラミックコンデンサおよびその製造方法 |
| US15/836,718 US10475581B2 (en) | 2016-12-13 | 2017-12-08 | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016240850A JP2018098327A (ja) | 2016-12-13 | 2016-12-13 | 積層セラミックコンデンサおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018098327A JP2018098327A (ja) | 2018-06-21 |
| JP2018098327A5 true JP2018098327A5 (cg-RX-API-DMAC7.html) | 2020-08-13 |
Family
ID=62487757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016240850A Pending JP2018098327A (ja) | 2016-12-13 | 2016-12-13 | 積層セラミックコンデンサおよびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10475581B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2018098327A (cg-RX-API-DMAC7.html) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7089402B2 (ja) * | 2018-05-18 | 2022-06-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP7145652B2 (ja) * | 2018-06-01 | 2022-10-03 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP7446705B2 (ja) * | 2018-06-12 | 2024-03-11 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP7151543B2 (ja) * | 2019-02-22 | 2022-10-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR102678767B1 (ko) * | 2019-03-28 | 2024-06-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 칩형 세라믹 전자부품 |
| KR102678753B1 (ko) * | 2019-03-28 | 2024-06-27 | 가부시키가이샤 무라타 세이사쿠쇼 | 칩형 세라믹 전자부품 |
| KR102671969B1 (ko) * | 2019-08-16 | 2024-06-05 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
| KR102736492B1 (ko) * | 2019-12-27 | 2024-11-29 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 |
| US11508524B2 (en) * | 2019-12-27 | 2022-11-22 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| KR20220060286A (ko) * | 2020-11-04 | 2022-05-11 | 삼성전기주식회사 | 적층형 커패시터 |
| JP7765255B2 (ja) * | 2021-11-15 | 2025-11-06 | Tdk株式会社 | 電子部品 |
| JP2023102509A (ja) | 2022-01-12 | 2023-07-25 | 太陽誘電株式会社 | 積層セラミック電子部品およびその製造方法 |
| JP2024011125A (ja) | 2022-07-14 | 2024-01-25 | 太陽誘電株式会社 | 積層セラミック電子部品およびその製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230508A (ja) * | 1990-02-06 | 1991-10-14 | Toshiba Corp | チップ型セラミック電子部品及びその製造方法 |
| JPH0437009A (ja) * | 1990-05-31 | 1992-02-07 | Kyocera Corp | 積層型コンデンサの端子電極形成用導電性ペースト |
| JPH04260314A (ja) | 1991-02-15 | 1992-09-16 | Taiyo Yuden Co Ltd | セラミック積層体 |
| JP2999303B2 (ja) * | 1991-08-29 | 2000-01-17 | 第一工業製薬株式会社 | セラミックコンデンサー電極用導体ペースト |
| JPH05151820A (ja) * | 1991-11-26 | 1993-06-18 | Sumitomo Metal Mining Co Ltd | 導体ペースト |
| JPH05174616A (ja) * | 1991-12-20 | 1993-07-13 | Sumitomo Metal Mining Co Ltd | 導体ペースト |
| JP3039403B2 (ja) * | 1996-12-06 | 2000-05-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP3548775B2 (ja) * | 1998-03-13 | 2004-07-28 | 株式会社村田製作所 | 導電ペースト及びセラミック電子部品 |
| JP2005044903A (ja) | 2003-07-24 | 2005-02-17 | Murata Mfg Co Ltd | 積層セラミック電子部品の外部電極形成方法 |
| JP2005209404A (ja) * | 2004-01-20 | 2005-08-04 | Murata Mfg Co Ltd | 積層セラミック電子部品の内部電極用導電ペースト及びそれを用いた積層セラミック電子部品の製造方法 |
| JP5533387B2 (ja) * | 2010-07-21 | 2014-06-25 | 株式会社村田製作所 | セラミック電子部品 |
| KR101361149B1 (ko) * | 2012-07-17 | 2014-02-24 | 전남대학교산학협력단 | 가뭄 스트레스 저항성 관련 유전자 및 형질전환 식물체 |
| KR20140102003A (ko) * | 2013-02-13 | 2014-08-21 | 삼성전기주식회사 | 도전성 페이스트 조성물, 이를 이용한 적층 세라믹 커패시터 및 이를 이용한 적층 세라믹 커패시터의 제조 방법 |
| JP2015063590A (ja) * | 2013-09-25 | 2015-04-09 | 三井化学株式会社 | 導電ペースト組成物および焼成体 |
| KR102078015B1 (ko) * | 2013-11-07 | 2020-04-07 | 삼성전기주식회사 | 커패시터 내장형 저온동시소성 세라믹 기판 |
-
2016
- 2016-12-13 JP JP2016240850A patent/JP2018098327A/ja active Pending
-
2017
- 2017-12-08 US US15/836,718 patent/US10475581B2/en active Active
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