JP2018088539A - ショットキー接触部を有する半導体デバイスを製造するための方法 - Google Patents
ショットキー接触部を有する半導体デバイスを製造するための方法 Download PDFInfo
- Publication number
- JP2018088539A JP2018088539A JP2018011322A JP2018011322A JP2018088539A JP 2018088539 A JP2018088539 A JP 2018088539A JP 2018011322 A JP2018011322 A JP 2018011322A JP 2018011322 A JP2018011322 A JP 2018011322A JP 2018088539 A JP2018088539 A JP 2018088539A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- schottky
- substrate surface
- forming material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 153
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 239000000463 material Substances 0.000 claims abstract description 64
- 239000002344 surface layer Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 83
- 230000004888 barrier function Effects 0.000 claims description 61
- 230000008569 process Effects 0.000 claims description 51
- 235000012431 wafers Nutrition 0.000 claims description 33
- 238000004140 cleaning Methods 0.000 claims description 32
- 238000004544 sputter deposition Methods 0.000 claims description 30
- 238000001465 metallisation Methods 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 18
- 238000005546 reactive sputtering Methods 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 229910052720 vanadium Inorganic materials 0.000 claims description 6
- 229910002601 GaN Inorganic materials 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- -1 tungsten nitride Chemical class 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 claims 1
- 229940126543 compound 14 Drugs 0.000 claims 1
- 230000007547 defect Effects 0.000 description 16
- 238000005259 measurement Methods 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 230000007847 structural defect Effects 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000007781 pre-processing Methods 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 239000012300 argon atmosphere Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001773 deep-level transient spectroscopy Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 102100021765 E3 ubiquitin-protein ligase RNF139 Human genes 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 101001106970 Homo sapiens E3 ubiquitin-protein ligase RNF139 Proteins 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 101100247596 Larrea tridentata RCA2 gene Proteins 0.000 description 1
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- DGJPPCSCQOIWCP-UHFFFAOYSA-N cadmium mercury Chemical compound [Cd].[Hg] DGJPPCSCQOIWCP-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002484 cyclic voltammetry Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
- H01L29/475—Schottky barrier electrodes on AIII-BV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02592—Microstructure amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28537—Deposition of Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28581—Deposition of Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1602—Diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/6606—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/0495—Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Plasma & Fusion (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
110、210、310 半導体基板
111、211、311 基板表面/第1の面
112、212、312 第2の面
113、213 アモルファス半導体表面層
321 pアノード領域
223、323 ドリフト領域
151、251、351 ショットキー接合形成材料
152、252 第2のメタライゼーション
153、253、353 第1のメタライゼーション
354 接触メタライゼーション
160 半導体ウェーハ
161 第1の方向(黒)
162 第2の方向(赤)
163 第3の方向(緑)
371 打込み用マスク
372 エッチ・マスク
280、380 プラズマ
391 アクティブ区域
392 周辺区域/エッジ終端区域
Claims (20)
- 少なくとも1つのショットキー接触部を有する半導体デバイス(200)を製造するための方法であって、
基板表面(211)を有する半導体基板(210)を設けるステップと、
前記基板表面(211)を容量結合プラズマにさらすことによって前記半導体基板(210)を前処理するステップであって、前記プラズマに容量結合している電力が0W〜80Wの間の範囲であり、具体的には5W〜60Wの間の範囲であり、より具体的には5W〜40Wの間の範囲であるステップと、
ショットキー接合形成材料(251)を前記前処理済みの基板表面(211)上にスパッタリングして、前記ショットキー接合形成材料(251)と前記半導体基板(210)との間にショットキー接触部を形成するステップと
を含む、方法。 - 前記ショットキー接合形成材料(251)が、モリブデン、窒化モリブデン、チタニウム、窒化チタン、タンタル、窒化タンタル、タングステン、窒化タングステン、ドーピング濃度が少なくとも1017/cm3の多結晶シリコン、およびそれらの任意の組合せからなる群から選択される、請求項1に記載の方法。
- 前記基板表面(211)を容量結合プラズマにさらすことによる前記半導体基板(210)の前記前処理が、120秒未満、具体的には90秒未満にわたって実行される、請求項1または2のいずれか一項に記載の方法。
- 前記半導体基板(210)を前処理する前に前記基板表面(211)を粗清浄化するステップをさらに含み、前記粗清浄化するステップが、湿式化学粗清浄化、スパッタリング粗清浄化、反応性スパッタリング粗清浄化、およびそれらの任意の組合せを含む、請求項1〜3のいずれか一項に記載の方法。
- 前記湿式化学粗清浄化が、蒸溜水、H2O2および水酸化アンモニウムを含む第1の洗浄溶液、ならびに/または蒸溜水、H2O2および塩酸を含む第2の洗浄溶液で前記基板表面(211)を清浄化するステップを含む、請求項4に記載の方法。
- 前記スパッタリング粗清浄化および/または前記反応性スパッタリング粗清浄化用が、前記前処理用の電力よりも大きい電力で容量結合プラズマに前記基板表面(211)をさらすステップを含み、前記スパッタリング粗清浄化および/または前記反応性スパッタリング粗清浄化用の前記電力が、少なくとも40W、好ましくは少なくとも60W、より好ましくは少なくとも80Wである、請求項4に記載の方法。
- 前記基板表面(211)の前記前処理によって、アモルファスnドープ半導体表面層(213)が形成される、請求項1〜6のいずれか一項に記載の方法。
- 前記基板表面(211)の前記前処理が実行され、その結果、前記基板表面(211)でのフェルミ準位が所定の値に固定される、請求項1〜7のいずれか一項に記載の方法。
- 前記基板表面(211)を前処理する前記プロセス、および前記前処理された基板表面(211)上に前記ショットキー接合形成材料(251)をスパッタリングするプロセスが、同じプロセス・チャンバ内で実行される、請求項1〜8のいずれか一項に記載の方法。
- 前記基板表面(211)を粗清浄化する前記プロセス、前記前処理された基板表面(211)上に前記ショットキー接合形成材料(251)をスパッタリングするプロセス、および前記スパッタリングされたショットキー接合形成材料(251)上にメタライゼーション(253)を形成するプロセスのうち、少なくとも1つのプロセスも前記同じプロセス・チャンバ内で実行される、請求項9に記載の方法。
- 前記前処理された基板表面(211)上に前記ショットキー接合形成材料(251)をスパッタリングするステップが、窒素含有雰囲気中で実行される、請求項1〜10のいずれか一項に記載の方法。
- 前記半導体基板(310)が、前記基板表面(311)においてさらされる露出部分を有する少なくとも1つのnドープ領域、およびオプションとして、前記基板表面(311)においてさらされる露出部分を有する少なくとも1つのpドープ領域(321)を含み、前記容量結合プラズマ(380)に前記基板表面(311)をさらすことによって、少なくとも前記nドープ領域の前記露出部分が前処理され、前記ショットキー接合形成材料(151)が、前記nドープ領域の前記露出部分と直接接触する、請求項1〜11のいずれか一項に記載の方法。
- 少なくとも1つのショットキー接触部を有する半導体デバイスを製造するための方法であって、
基板表面(211)を有する半導体基板(210)を設けるステップと、
前記基板表面(211)を容量結合プラズマに120秒未満にわたってさらすことによって前記半導体基板(210)を前処理するステップであって、そのときの圧力が0.11パスカル(0.8ミリトル)未満であり、具体的には0.0133パスカル(0.1ミリトル)〜0.11パスカル(0.8ミリトル)の間であるステップと、
ショットキー接合形成材料(251)を前処理済みの基板表面(211)上にスパッタリングして、ショットキー接触部を形成するステップと
を含む、方法。 - 前記半導体基板(210)が、SiC、Si、SiGe、GaAs、GaN、AlGaAs、GaInP、GaAsPなどのIII−V族化合物半導体、(III、III)V族化合物半導体、III(V、V)族化合物半導体、またはダイヤモンドを含む、請求項13に記載の方法。
- 前記半導体基板(210)を前処理するステップが、前記基板表面(211)をアルゴン・プラズマ放電にさらすステップを含み、前記プラズマに容量結合している電力が、0W〜80Wの間の範囲であり、具体的には5W〜60Wの間の範囲であり、より具体的には5W〜40Wの間の範囲である、請求項13または14に記載の方法。
- ウェーハ表面(111)を有するnドープ半導体ウェーハ(110、160)と、
前記ウェーハ表面(111)で形成される複数のショットキー接触部であって、前記ショットキー接触部のそれぞれがショットキー障壁高さを有するショットキー接触部と
を含み、
前記ショットキー接触部の前記ショットキー障壁高さの標準偏差が、前記ショットキー接触部の前記複数の前記ショットキー障壁高さの算術平均ショットキー障壁高さの5%未満であり、具体的には2%未満であり、より具体的には1%未満である、半導体ウェーハ。 - 前記半導体ウェーハ(110、160)が、SiC、Si、SiGe、GaAs、GaN、AlGaAs、GaInP、GaAsPなどのIII−V族化合物半導体、(III、III)V族化合物半導体、III(V、V)族化合物半導体、またはダイヤモンドを含む、請求項16に記載の半導体ウェーハ。
- ショットキー接合形成材料(151)が、前記nドープ半導体ウェーハ(110、160)と接触しており、前記ショットキー接合形成材料(151)が、モリブデン、窒化モリブデン、チタニウム、窒化チタン、タンタル、窒化タンタル、タングステン、窒化タングステン、ドーピング濃度が少なくとも1017/cm3の多結晶シリコン、およびそれらの任意の組合せからなる群から選択されるスパッタリングされた金属またはスパッタリングされた金属窒化物である、請求項16または17に記載の半導体ウェーハ。
- 基板表面(111)を有するnドープ単結晶半導体基板(110)と、
前記nドープ単結晶半導体基板(110)の前記基板表面(111)でのアモルファスnドープ半導体表面層(113)と、
前記アモルファスnドープ半導体表面層(113)と接触しているショットキー接合形成材料(151)と
を含み、
前記ショットキー接合形成材料(151)が、前記アモルファスnドープ半導体表面層(113)との少なくとも1つのショットキー接触部を形成する、半導体デバイス(100)。 - アモルファスnドープ半導体表面層(113)の厚さが、約2nm〜約8nmの間である、請求項19に記載の半導体デバイス(100)。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019203455A JP6938596B2 (ja) | 2015-02-11 | 2019-11-08 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015101966.3A DE102015101966B4 (de) | 2015-02-11 | 2015-02-11 | Verfahren zum Herstellen eines Halbleiterbauelements mit Schottkykontakt und Halbleiterbauelement |
DE102015101966.3 | 2015-02-11 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016023359A Division JP2016149554A (ja) | 2015-02-11 | 2016-02-10 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019203455A Division JP6938596B2 (ja) | 2015-02-11 | 2019-11-08 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018088539A true JP2018088539A (ja) | 2018-06-07 |
Family
ID=56498515
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016023359A Ceased JP2016149554A (ja) | 2015-02-11 | 2016-02-10 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
JP2018011322A Ceased JP2018088539A (ja) | 2015-02-11 | 2018-01-26 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
JP2019203455A Active JP6938596B2 (ja) | 2015-02-11 | 2019-11-08 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016023359A Ceased JP2016149554A (ja) | 2015-02-11 | 2016-02-10 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019203455A Active JP6938596B2 (ja) | 2015-02-11 | 2019-11-08 | ショットキー接触部を有する半導体デバイスを製造するための方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10763339B2 (ja) |
JP (3) | JP2016149554A (ja) |
DE (1) | DE102015101966B4 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017100109A1 (de) * | 2017-01-04 | 2018-07-05 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen derselben |
DE102017107952B4 (de) * | 2017-04-12 | 2022-07-07 | Infineon Technologies Ag | Herstellungsverfahren für eine halbleitervorrichtung |
US11264494B2 (en) | 2017-11-13 | 2022-03-01 | Shindengen Electric Manufacturing Co., Ltd. | Wide-gap semiconductor device |
US11677023B2 (en) * | 2021-05-04 | 2023-06-13 | Infineon Technologies Austria Ag | Semiconductor device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59124765A (ja) * | 1982-12-29 | 1984-07-18 | Fujitsu Ltd | 半導体装置 |
JPS6450527A (en) * | 1987-08-21 | 1989-02-27 | Toshiba Corp | Manufacture of semiconductor device |
JPH03295229A (ja) * | 1990-04-12 | 1991-12-26 | Sumitomo Electric Ind Ltd | 化合物半導体装置の製造方法 |
JPH0480962A (ja) * | 1990-07-24 | 1992-03-13 | Shindengen Electric Mfg Co Ltd | ショットキバリアダイオード |
JPH08195403A (ja) * | 1995-01-18 | 1996-07-30 | Murata Mfg Co Ltd | 半導体装置 |
JPH0964381A (ja) * | 1995-08-25 | 1997-03-07 | Murata Mfg Co Ltd | ショットキーバリアダイオード |
JP2008130874A (ja) * | 2006-11-22 | 2008-06-05 | Nissan Motor Co Ltd | 電極膜/炭化珪素構造体、炭化珪素ショットキバリアダイオード、金属−炭化珪素半導体構造電界効果トランジスタ、電極膜の成膜最適化方法および電極膜/炭化珪素構造体の製造方法 |
JP2009194081A (ja) * | 2008-02-13 | 2009-08-27 | New Japan Radio Co Ltd | 窒化物半導体装置の製造方法 |
JP2013038319A (ja) * | 2011-08-10 | 2013-02-21 | Showa Denko Kk | 炭化珪素半導体装置及びその製造方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1207093A (en) * | 1968-04-05 | 1970-09-30 | Matsushita Electronics Corp | Improvements in or relating to schottky barrier semiconductor devices |
DE3219606A1 (de) | 1982-05-25 | 1983-12-01 | Siemens AG, 1000 Berlin und 8000 München | Schottky-leistungsdiode |
JPS6025275A (ja) * | 1983-07-20 | 1985-02-08 | Matsushita Electric Ind Co Ltd | 電界効果型トランジスタ−のゲ−トの形成法 |
JPS60261177A (ja) * | 1984-06-08 | 1985-12-24 | Agency Of Ind Science & Technol | 化合物半導体電界効果トランジスタ |
JPS61296754A (ja) * | 1985-06-26 | 1986-12-27 | Toshiba Corp | 半導体装置とその製造方法 |
JPH04148565A (ja) * | 1990-10-12 | 1992-05-21 | Shindengen Electric Mfg Co Ltd | ショットキバリアダイオード |
DE19723176C1 (de) * | 1997-06-03 | 1998-08-27 | Daimler Benz Ag | Leistungshalbleiter-Bauelement und Verfahren zu dessen Herstellung |
DE19954866A1 (de) * | 1999-11-15 | 2001-05-31 | Infineon Technologies Ag | Verfahren zur Behandlung einer durch Epitaxie hergestellten Oberfläche eines SiC-Halbleiterkörpers und danach hergestellten Schottkykontakt |
US6373076B1 (en) * | 1999-12-07 | 2002-04-16 | Philips Electronics North America Corporation | Passivated silicon carbide devices with low leakage current and method of fabricating |
JP3651666B2 (ja) | 2001-03-29 | 2005-05-25 | 株式会社東芝 | 半導体素子及びその製造方法 |
WO2003012840A2 (de) * | 2001-07-27 | 2003-02-13 | Ihp Gmbh-Innovations For High Performance Microelectronics/Institut Für Innovative Mikroelektronik | Verfahren und vorrichtung zum herstellen dünner epitaktischer halbleiterschichten |
JP3902534B2 (ja) * | 2001-11-29 | 2007-04-11 | 三洋電機株式会社 | 光起電力装置及びその製造方法 |
JP4319810B2 (ja) | 2002-07-16 | 2009-08-26 | 日本インター株式会社 | 半導体装置及びその製造方法 |
JP4466074B2 (ja) * | 2003-12-26 | 2010-05-26 | 株式会社日立製作所 | 微細金属構造体とその製造方法、並びに微細金型とデバイス |
JP4925601B2 (ja) * | 2005-04-18 | 2012-05-09 | 三菱電機株式会社 | 半導体装置 |
JP4921880B2 (ja) | 2006-07-28 | 2012-04-25 | 株式会社東芝 | 高耐圧半導体装置 |
US7728402B2 (en) * | 2006-08-01 | 2010-06-01 | Cree, Inc. | Semiconductor devices including schottky diodes with controlled breakdown |
JP2009081177A (ja) * | 2007-09-25 | 2009-04-16 | Nec Electronics Corp | 電界効果トランジスタ、半導体チップ及び半導体装置 |
JP5047133B2 (ja) * | 2008-11-19 | 2012-10-10 | 昭和電工株式会社 | 半導体装置の製造方法 |
KR101680410B1 (ko) * | 2009-07-16 | 2016-11-28 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크 및 전사용 마스크의 제조 방법 |
US8476744B2 (en) | 2009-12-28 | 2013-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with channel including microcrystalline and amorphous semiconductor regions |
JP2012069798A (ja) | 2010-09-24 | 2012-04-05 | Toyota Motor Corp | 半導体装置の製造方法 |
JP2015501372A (ja) * | 2011-09-29 | 2015-01-15 | ナイトライド ソリューションズ インコーポレイテッド | 無機材料、それを作製する方法及び装置、並びにその使用 |
JP5885521B2 (ja) * | 2012-02-01 | 2016-03-15 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP6206862B2 (ja) | 2012-05-31 | 2017-10-04 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
GB201217712D0 (en) * | 2012-10-03 | 2012-11-14 | Spts Technologies Ltd | methods of plasma etching |
JP2014078660A (ja) * | 2012-10-12 | 2014-05-01 | Sumitomo Electric Ind Ltd | ワイドギャップ半導体装置およびその製造方法 |
CN107574476A (zh) * | 2013-08-09 | 2018-01-12 | 应用材料公司 | 于外延生长之前预清洁基板表面的方法和设备 |
-
2015
- 2015-02-11 DE DE102015101966.3A patent/DE102015101966B4/de active Active
-
2016
- 2016-02-10 US US15/040,353 patent/US10763339B2/en active Active
- 2016-02-10 JP JP2016023359A patent/JP2016149554A/ja not_active Ceased
-
2018
- 2018-01-26 JP JP2018011322A patent/JP2018088539A/ja not_active Ceased
-
2019
- 2019-11-08 JP JP2019203455A patent/JP6938596B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59124765A (ja) * | 1982-12-29 | 1984-07-18 | Fujitsu Ltd | 半導体装置 |
JPS6450527A (en) * | 1987-08-21 | 1989-02-27 | Toshiba Corp | Manufacture of semiconductor device |
JPH03295229A (ja) * | 1990-04-12 | 1991-12-26 | Sumitomo Electric Ind Ltd | 化合物半導体装置の製造方法 |
JPH0480962A (ja) * | 1990-07-24 | 1992-03-13 | Shindengen Electric Mfg Co Ltd | ショットキバリアダイオード |
JPH08195403A (ja) * | 1995-01-18 | 1996-07-30 | Murata Mfg Co Ltd | 半導体装置 |
JPH0964381A (ja) * | 1995-08-25 | 1997-03-07 | Murata Mfg Co Ltd | ショットキーバリアダイオード |
JP2008130874A (ja) * | 2006-11-22 | 2008-06-05 | Nissan Motor Co Ltd | 電極膜/炭化珪素構造体、炭化珪素ショットキバリアダイオード、金属−炭化珪素半導体構造電界効果トランジスタ、電極膜の成膜最適化方法および電極膜/炭化珪素構造体の製造方法 |
JP2009194081A (ja) * | 2008-02-13 | 2009-08-27 | New Japan Radio Co Ltd | 窒化物半導体装置の製造方法 |
JP2013038319A (ja) * | 2011-08-10 | 2013-02-21 | Showa Denko Kk | 炭化珪素半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102015101966B4 (de) | 2021-07-08 |
JP2020038987A (ja) | 2020-03-12 |
DE102015101966A1 (de) | 2016-08-11 |
US20160276452A1 (en) | 2016-09-22 |
JP2016149554A (ja) | 2016-08-18 |
JP6938596B2 (ja) | 2021-09-22 |
US10763339B2 (en) | 2020-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6938596B2 (ja) | ショットキー接触部を有する半導体デバイスを製造するための方法 | |
US4477311A (en) | Process and apparatus for fabricating a semiconductor device | |
EP0064370A2 (en) | High electron mobility semiconductor device | |
US20020187622A1 (en) | Method for processing a surface of an SiC semiconductor layer and schottky contact | |
JP2011519181A (ja) | 窒化ガリウム材料加工及びその関連するデバイス構造体 | |
EP0064829B1 (en) | High electron mobility semiconductor device and process for producing the same | |
US5723383A (en) | Semiconductor substrate treatment method | |
US6159861A (en) | Method of manufacturing semiconductor device | |
US20190157417A1 (en) | Single column compound semiconductor bipolar junction transistor fabricated on iii-v compound semiconductor surface | |
EP0113983B1 (en) | Fabricating a semiconductor device by means of molecular beam epitaxy | |
EP0690506A1 (fr) | Procédé de réalisation d'un dispositif semiconducteur comprenant au moins deux transistors à effet de champ ayant des tensions de pincement différentes | |
CN103681316A (zh) | 一种深沟槽肖特基二极管及其工艺制作方法 | |
US11626483B2 (en) | Low-leakage regrown GaN p-n junctions for GaN power devices | |
US20210376067A1 (en) | Fabrication of lateral superjunction devices using selective epitaxy | |
US9337281B2 (en) | Planar semiconductor growth on III-V material | |
US20060183267A1 (en) | Process for manufacturing a schottky contact on a semiconductor substrate | |
US11605741B2 (en) | Methods of forming doped silicide power devices | |
US20160365438A1 (en) | Method of manufacturing nitride semiconductor device and nitride semiconductor device | |
US11456171B2 (en) | Deep trench integration processes and devices | |
US20220216306A1 (en) | Producing an ohmic contact and electronic component with ohmic contact | |
US20240030381A1 (en) | Method for Producing a Semiconductor Body and Semicondcutor Arrangement | |
RU2227344C2 (ru) | Способ изготовления мощных свч полевых транзисторов с барьером шоттки | |
TWI394217B (zh) | 雙極性電晶體的製造方法 | |
Yafarov | Use of the atomic structure of silicon crystals to obtain multi-tip field-emission sources of electrons | |
JP3017509B2 (ja) | 化合物半導体ウェーハおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180214 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180214 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190318 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190416 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190716 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191008 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20191107 |
|
A045 | Written measure of dismissal of application [lapsed due to lack of payment] |
Free format text: JAPANESE INTERMEDIATE CODE: A045 Effective date: 20200225 |