JP2018088531A5 - - Google Patents
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- Publication number
- JP2018088531A5 JP2018088531A5 JP2017250549A JP2017250549A JP2018088531A5 JP 2018088531 A5 JP2018088531 A5 JP 2018088531A5 JP 2017250549 A JP2017250549 A JP 2017250549A JP 2017250549 A JP2017250549 A JP 2017250549A JP 2018088531 A5 JP2018088531 A5 JP 2018088531A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- wiring pattern
- main electrode
- electrically connected
- input wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016227744 | 2016-11-24 | ||
| JP2016227744 | 2016-11-24 | ||
| JP2017558040A JP6274380B1 (ja) | 2016-11-24 | 2017-08-07 | 半導体モジュール |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017558040A Division JP6274380B1 (ja) | 2016-11-24 | 2017-08-07 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018088531A JP2018088531A (ja) | 2018-06-07 |
| JP2018088531A5 true JP2018088531A5 (cg-RX-API-DMAC10.html) | 2020-08-13 |
| JP6907931B2 JP6907931B2 (ja) | 2021-07-21 |
Family
ID=62194840
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017558040A Active JP6274380B1 (ja) | 2016-11-24 | 2017-08-07 | 半導体モジュール |
| JP2017250549A Active JP6907931B2 (ja) | 2016-11-24 | 2017-12-27 | 半導体モジュール |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017558040A Active JP6274380B1 (ja) | 2016-11-24 | 2017-08-07 | 半導体モジュール |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10916531B2 (cg-RX-API-DMAC10.html) |
| JP (2) | JP6274380B1 (cg-RX-API-DMAC10.html) |
| WO (1) | WO2018096734A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021005690A (ja) * | 2019-06-27 | 2021-01-14 | 住友電気工業株式会社 | 半導体モジュール |
| JP7142183B2 (ja) * | 2019-07-09 | 2022-09-26 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 集積サージアレスタを有するパワー半導体モジュール |
| JP6979997B2 (ja) * | 2019-12-04 | 2021-12-15 | 三菱電機株式会社 | 電力用半導体装置 |
| US11342257B2 (en) | 2020-01-22 | 2022-05-24 | Delta Electronics (Shanghai) Co., Ltd. | Carrier board and power module using same |
| EP3855490A3 (en) * | 2020-01-22 | 2021-10-13 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
| JP6952834B1 (ja) * | 2020-06-04 | 2021-10-27 | 三菱電機株式会社 | パワーモジュール |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3879150B2 (ja) * | 1996-08-12 | 2007-02-07 | 株式会社デンソー | 半導体装置 |
| JP5287359B2 (ja) * | 2009-03-04 | 2013-09-11 | 株式会社デンソー | 半導体モジュール |
| JP2011036016A (ja) * | 2009-07-31 | 2011-02-17 | Daikin Industries Ltd | 電力変換装置 |
| CN103238269B (zh) | 2010-12-01 | 2015-06-24 | 株式会社安川电机 | 电力变换装置 |
| EP2811642A4 (en) * | 2012-01-31 | 2015-10-07 | Yaskawa Denki Seisakusho Kk | POWER CONVERTER AND METHOD FOR PRODUCING A POWER CONVERTER |
| JP6097013B2 (ja) * | 2012-02-29 | 2017-03-15 | ローム株式会社 | パワーモジュール半導体装置 |
| JP2015135895A (ja) | 2014-01-17 | 2015-07-27 | パナソニックＩｐマネジメント株式会社 | 半導体モジュール |
| JP6181136B2 (ja) | 2015-11-09 | 2017-08-16 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP6583072B2 (ja) * | 2016-03-15 | 2019-10-02 | 住友電気工業株式会社 | 半導体モジュール |
-
2017
- 2017-08-07 JP JP2017558040A patent/JP6274380B1/ja active Active
- 2017-08-07 US US16/349,397 patent/US10916531B2/en active Active
- 2017-08-07 WO PCT/JP2017/028626 patent/WO2018096734A1/ja not_active Ceased
- 2017-12-27 JP JP2017250549A patent/JP6907931B2/ja active Active
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