JP2018078184A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2018078184A JP2018078184A JP2016218775A JP2016218775A JP2018078184A JP 2018078184 A JP2018078184 A JP 2018078184A JP 2016218775 A JP2016218775 A JP 2016218775A JP 2016218775 A JP2016218775 A JP 2016218775A JP 2018078184 A JP2018078184 A JP 2018078184A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 132
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 7
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
【解決手段】2個の半導体モジュール10、110を第1接続部材30で直列に接続する場合は、隣接して配置した2個の半導体モジュールのうちの左側のモジュール10の段差部18Dに平板部32を嵌め込んではんだ接続し、右側のモジュール110の段差部112Cに平板部36を嵌め込んではんだ接続する。半導体モジュールを並列に接続する場合は、隣接して配置した2個の半導体モジュールのうちの左側のモジュール10の段差部12Dに平板部44を嵌め込んではんだ接続し、右側のモジュール210の段差部212Cに平板部46を嵌め込んではんだ接続し、左側のモジュール10の段差部18Dに平板部50を嵌め込んではんだ接続し、右側のモジュールの段差部218Cに平板部52を嵌め込んではんだ接続する。
【選択図】図2
Description
本明細書では、組立時に切断・変形工程を要しない技術を開示する。
仮想線24は、モールド樹脂の形成後に切断するラインを示し、切断すると隣接するピン同士が絶縁される。各ピン18Fは、モールド樹脂中で各ボンディング部18Eにまで延び、ボンディングワイヤ20によって半導体素子16内のゲート電極またはセンサ等に接続される。
なお図8の断面図は模式的なものであり、各部材12,14,16,18,20,40の周囲はモールド樹脂で封止されている。表面側第2接続部材42と裏面側第2接続部材48の間隔にもモールド樹脂が充填されている。
12:表面電極板
12A:平板部
12B:端子部
12C,12D:接続部品受入れ用段差部
14:スペーサ
16:半導体素子
16A:表面電極(エミッタ電極)
16B:非被覆領域
16C:ワイヤボンディングパッド(ゲートパッドを含む)
16D:裏面電極(コレクタ電極)
18:裏面電極板
18A:平板部
18B:端子部
18C,18D:接続部品受入れ用段差部
18E:ボンティング部
18F:ピン部
20:ワイヤ
22:樹脂モールド輪郭
24:切断線
30:第1接続部材
32:平板部
34;接続部
36:平板部
40:第2接続部材
42:表面側第2接続部材
44,46:平板部
48:裏面側第2接続部材
50,52:平板部
60:モールド樹脂
110,210,310,410,510:半導体モジュール
Claims (1)
- 複数個の半導体モジュールを接続部品で接続した組立体をモールド樹脂で封止した半導体装置であり、
各半導体モジュールが、
表面電極と裏面電極を備えている半導体素子と、
前記表面電極に固定されている表面電極板と、
前記裏面電極に固定されている裏面電極板を備えており、
前記接続部品が、
隣接する前記半導体モジュールの表面電極板と裏面電極板を接続する第1接続部品と、
隣接する前記半導体モジュールの表面電極板同士を接続するとともに裏面電極板同志を接続する第2接続部品のいずれか一方であり、
隣接する前記半導体モジュールを、前記第1接続部品で接続することと前記第2接続部品で接続することの両者が可能であることを特徴とする半導体装置。
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JP2016218775A JP6772768B2 (ja) | 2016-11-09 | 2016-11-09 | 半導体装置 |
US15/788,148 US10304777B2 (en) | 2016-11-09 | 2017-10-19 | Semiconductor device having a plurality of semiconductor modules connected by a connection component |
CN201711084622.7A CN108063125A (zh) | 2016-11-09 | 2017-11-07 | 半导体装置 |
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CN108063125A (zh) | 2018-05-22 |
US10304777B2 (en) | 2019-05-28 |
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