JP2018070440A5 - - Google Patents
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- Publication number
- JP2018070440A5 JP2018070440A5 JP2017200837A JP2017200837A JP2018070440A5 JP 2018070440 A5 JP2018070440 A5 JP 2018070440A5 JP 2017200837 A JP2017200837 A JP 2017200837A JP 2017200837 A JP2017200837 A JP 2017200837A JP 2018070440 A5 JP2018070440 A5 JP 2018070440A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- carbide epitaxial
- basal plane
- less
- epitaxial layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 37
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016196636 | 2016-10-04 | ||
| JP2016196636 | 2016-10-04 | ||
| JP2017544970A JP6233555B1 (ja) | 2016-10-04 | 2017-06-05 | 炭化珪素エピタキシャル基板及び炭化珪素半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017544970A Division JP6233555B1 (ja) | 2016-10-04 | 2017-06-05 | 炭化珪素エピタキシャル基板及び炭化珪素半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018070440A JP2018070440A (ja) | 2018-05-10 |
| JP2018070440A5 true JP2018070440A5 (cg-RX-API-DMAC7.html) | 2020-07-02 |
| JP6891758B2 JP6891758B2 (ja) | 2021-06-18 |
Family
ID=61831463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017200837A Active JP6891758B2 (ja) | 2016-10-04 | 2017-10-17 | 炭化珪素エピタキシャル基板及び炭化珪素半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10714572B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6891758B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN109791879B (cg-RX-API-DMAC7.html) |
| DE (1) | DE112017005034T5 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018066173A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074928B (zh) | 2018-05-09 | 2023-12-22 | 住友电气工业株式会社 | 碳化硅外延衬底和制造碳化硅半导体器件的方法 |
| JP6585799B1 (ja) * | 2018-10-15 | 2019-10-02 | 昭和電工株式会社 | ＳｉＣ基板の評価方法及びＳｉＣエピタキシャルウェハの製造方法 |
| JP2023508691A (ja) | 2019-12-27 | 2023-03-03 | ウルフスピード インコーポレイテッド | 大口径炭化ケイ素ウェハ |
| WO2022041157A1 (zh) * | 2020-08-28 | 2022-03-03 | 华为技术有限公司 | 一种衬底及功率放大器件 |
| US12125701B2 (en) * | 2020-12-15 | 2024-10-22 | Wolfspeed, Inc. | Large dimension silicon carbide single crystalline materials with reduced crystallographic stress |
| CN113388888B (zh) * | 2021-06-22 | 2022-07-12 | 山东天岳先进科技股份有限公司 | 一种碳化硅晶体、其使用的籽晶及籽晶的制备方法 |
| WO2024080071A1 (ja) * | 2022-10-11 | 2024-04-18 | 住友電気工業株式会社 | 炭化珪素結晶基板、エピタキシャル基板および半導体装置の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7314520B2 (en) * | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low 1c screw dislocation 3 inch silicon carbide wafer |
| WO2009035085A1 (ja) | 2007-09-12 | 2009-03-19 | Daikin Industries, Ltd. | 電解液 |
| JP5273741B2 (ja) * | 2007-09-12 | 2013-08-28 | 昭和電工株式会社 | エピタキシャルＳｉＣ単結晶基板及びエピタキシャルＳｉＣ単結晶基板の製造方法 |
| JP2010184833A (ja) * | 2009-02-12 | 2010-08-26 | Denso Corp | 炭化珪素単結晶基板および炭化珪素単結晶エピタキシャルウェハ |
| CA2999629C (en) | 2010-03-01 | 2020-12-15 | The University Of British Columbia | Derivatized hyperbranched polyglycerols |
| JP6025306B2 (ja) * | 2011-05-16 | 2016-11-16 | 株式会社豊田中央研究所 | ＳｉＣ単結晶、ＳｉＣウェハ及び半導体デバイス |
| JP5958949B2 (ja) * | 2011-05-26 | 2016-08-02 | 一般財団法人電力中央研究所 | 炭化珪素基板、炭化珪素ウェハ、炭化珪素ウェハの製造方法及び炭化珪素半導体素子 |
| US8940614B2 (en) * | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
| JP6122704B2 (ja) | 2013-06-13 | 2017-04-26 | 昭和電工株式会社 | ＳｉＣエピタキシャルウェハ及びその製造方法 |
| WO2016051975A1 (ja) | 2014-10-01 | 2016-04-07 | 住友電気工業株式会社 | 炭化珪素エピタキシャル基板 |
| JP2016166112A (ja) * | 2015-03-10 | 2016-09-15 | 株式会社東芝 | 半導体基板及び半導体装置 |
| US10626520B2 (en) * | 2015-07-29 | 2020-04-21 | Showa Denko K.K. | Method for producing epitaxial silicon carbide single crystal wafer |
| US20170321345A1 (en) * | 2016-05-06 | 2017-11-09 | Ii-Vi Incorporated | Large Diameter Silicon Carbide Single Crystals and Apparatus and Method of Manufacture Thereof |
-
2017
- 2017-06-05 DE DE112017005034.0T patent/DE112017005034T5/de active Granted
- 2017-06-05 CN CN201780061273.9A patent/CN109791879B/zh active Active
- 2017-06-05 WO PCT/JP2017/020887 patent/WO2018066173A1/ja not_active Ceased
- 2017-06-05 US US16/333,308 patent/US10714572B2/en active Active
- 2017-10-17 JP JP2017200837A patent/JP6891758B2/ja active Active
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