JP2018041803A - フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 - Google Patents

フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 Download PDF

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Publication number
JP2018041803A
JP2018041803A JP2016173856A JP2016173856A JP2018041803A JP 2018041803 A JP2018041803 A JP 2018041803A JP 2016173856 A JP2016173856 A JP 2016173856A JP 2016173856 A JP2016173856 A JP 2016173856A JP 2018041803 A JP2018041803 A JP 2018041803A
Authority
JP
Japan
Prior art keywords
layer
flexible printed
printed circuit
circuit board
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016173856A
Other languages
English (en)
Japanese (ja)
Inventor
智 海老原
Satoshi Ebihara
智 海老原
高久 加藤
Takahisa Kato
高久 加藤
伸人 佐々木
Nobuto Sasaki
伸人 佐々木
和之 我妻
Kazuyuki Azuma
和之 我妻
友博 下川路
Tomohiro Shimokawaji
友博 下川路
豪夫 若林
Takeo Wakabayashi
豪夫 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Nikkan Industries Co Ltd
Original Assignee
Nippon Mektron KK
Nikkan Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK, Nikkan Industries Co Ltd filed Critical Nippon Mektron KK
Priority to JP2016173856A priority Critical patent/JP2018041803A/ja
Priority to DE112017004465.0T priority patent/DE112017004465T5/de
Priority to CN201780043062.2A priority patent/CN109479371B/zh
Priority to PCT/JP2017/022890 priority patent/WO2018047434A1/ja
Priority to US16/307,111 priority patent/US10485093B2/en
Priority to TW106127951A priority patent/TWI642332B/zh
Publication of JP2018041803A publication Critical patent/JP2018041803A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016173856A 2016-09-06 2016-09-06 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 Pending JP2018041803A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016173856A JP2018041803A (ja) 2016-09-06 2016-09-06 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
DE112017004465.0T DE112017004465T5 (de) 2016-09-06 2017-06-21 Flexible gedruckte Leiterplatte und Verfahren zum Herstellen einer flexiblen gedruckten Leiterplatte
CN201780043062.2A CN109479371B (zh) 2016-09-06 2017-06-21 柔性印刷电路板以及柔性印刷电路板的制造方法
PCT/JP2017/022890 WO2018047434A1 (ja) 2016-09-06 2017-06-21 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
US16/307,111 US10485093B2 (en) 2016-09-06 2017-06-21 Flexible printed board and method for manufacturing flexible printed board
TW106127951A TWI642332B (zh) 2016-09-06 2017-08-17 柔性印刷電路板以及柔性印刷電路板之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016173856A JP2018041803A (ja) 2016-09-06 2016-09-06 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法

Publications (1)

Publication Number Publication Date
JP2018041803A true JP2018041803A (ja) 2018-03-15

Family

ID=61562413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016173856A Pending JP2018041803A (ja) 2016-09-06 2016-09-06 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法

Country Status (6)

Country Link
US (1) US10485093B2 (zh)
JP (1) JP2018041803A (zh)
CN (1) CN109479371B (zh)
DE (1) DE112017004465T5 (zh)
TW (1) TWI642332B (zh)
WO (1) WO2018047434A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087989A (ja) * 2018-11-16 2020-06-04 東京特殊電線株式会社 熱電モジュール用基板及び熱電モジュール

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112492777B (zh) * 2019-09-12 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
CN112888165A (zh) * 2019-11-29 2021-06-01 深圳市普能达电子有限公司 一种柔性印刷电路板的制备方法
CN112105143A (zh) * 2020-10-15 2020-12-18 河南博美通电子科技有限公司 一种铝箔代替高分子柔性膜的柔性电路板结构及制备工艺
CN112654165A (zh) * 2020-12-29 2021-04-13 博罗县精汇电子科技有限公司 有凹槽的新型散热导通钢片线路板的生产方法
CN113507780A (zh) * 2021-07-08 2021-10-15 江西柔顺科技有限公司 一种散热线路板及其制备方法
CN114071962A (zh) * 2021-11-12 2022-02-18 合肥维信诺科技有限公司 一种散热结构及电子设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593567U (ja) * 1982-06-29 1984-01-11 松下電器産業株式会社 両面フレキシブルプリント基板
JPS61192473U (zh) * 1985-05-24 1986-11-29
JP2005039110A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2005276943A (ja) * 2004-03-23 2005-10-06 Oki Electric Cable Co Ltd 放熱フレキシブル配線板
JP2007266204A (ja) * 2006-03-28 2007-10-11 Denki Kagaku Kogyo Kk 金属ベース回路基板およびその製法、ならびにｌｅｄモジュール
JP2010189614A (ja) * 2009-01-26 2010-09-02 Sumitomo Bakelite Co Ltd 樹脂組成物、絶縁層付支持材料、プリプレグ、発光素子用積層板、発光素子用回路基板および発光装置
JP2011012193A (ja) * 2009-07-03 2011-01-20 Denki Kagaku Kogyo Kk 樹脂組成物及びその用途
JP2011189614A (ja) * 2010-03-15 2011-09-29 Nitto Denko Corp 中間転写ベルトの製造方法および中間転写ベルト
JP2011249574A (ja) * 2010-05-27 2011-12-08 Nippon Mektron Ltd フレキシブル回路基板
JP2013058611A (ja) * 2011-09-08 2013-03-28 Hitachi Chemical Co Ltd 配線板積層体、部品実装配線板積層体、及び電子部品

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CN1875669A (zh) 2004-04-19 2006-12-06 株式会社荣恩电子 具有走线间隙填充树脂的印刷电路板及其制造方法
JP4672425B2 (ja) * 2005-04-19 2011-04-20 電気化学工業株式会社 金属ベース回路基板およびその製法ならびにそれを用いた混成集積回路
KR101073423B1 (ko) 2005-04-19 2011-10-17 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판, ｌｅｄ, 및 ｌｅｄ 광원 유닛
JP2007251076A (ja) * 2006-03-20 2007-09-27 Hitachi Ltd パワー半導体モジュール
TWM410427U (en) 2010-12-31 2011-08-21 Jtprofound Technology Co Ltd Improved structure for metal core printed circuit board
CN102653149A (zh) * 2011-03-03 2012-09-05 广州宏仁电子工业有限公司 一种柔性无卤素高导热系数覆树脂铜箔及其制备方法
EP3035778B1 (en) 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593567U (ja) * 1982-06-29 1984-01-11 松下電器産業株式会社 両面フレキシブルプリント基板
JPS61192473U (zh) * 1985-05-24 1986-11-29
JP2005039110A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2005276943A (ja) * 2004-03-23 2005-10-06 Oki Electric Cable Co Ltd 放熱フレキシブル配線板
JP2007266204A (ja) * 2006-03-28 2007-10-11 Denki Kagaku Kogyo Kk 金属ベース回路基板およびその製法、ならびにｌｅｄモジュール
JP2010189614A (ja) * 2009-01-26 2010-09-02 Sumitomo Bakelite Co Ltd 樹脂組成物、絶縁層付支持材料、プリプレグ、発光素子用積層板、発光素子用回路基板および発光装置
JP2011012193A (ja) * 2009-07-03 2011-01-20 Denki Kagaku Kogyo Kk 樹脂組成物及びその用途
JP2011189614A (ja) * 2010-03-15 2011-09-29 Nitto Denko Corp 中間転写ベルトの製造方法および中間転写ベルト
JP2011249574A (ja) * 2010-05-27 2011-12-08 Nippon Mektron Ltd フレキシブル回路基板
JP2013058611A (ja) * 2011-09-08 2013-03-28 Hitachi Chemical Co Ltd 配線板積層体、部品実装配線板積層体、及び電子部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087989A (ja) * 2018-11-16 2020-06-04 東京特殊電線株式会社 熱電モジュール用基板及び熱電モジュール
JP7237417B2 (ja) 2018-11-16 2023-03-13 東京特殊電線株式会社 熱電モジュール用基板及び熱電モジュール

Also Published As

Publication number Publication date
WO2018047434A1 (ja) 2018-03-15
CN109479371A (zh) 2019-03-15
TW201813461A (zh) 2018-04-01
TWI642332B (zh) 2018-11-21
US20190090345A1 (en) 2019-03-21
DE112017004465T5 (de) 2019-05-16
US10485093B2 (en) 2019-11-19
CN109479371B (zh) 2021-11-09

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