TWM410427U - Improved structure for metal core printed circuit board - Google Patents

Improved structure for metal core printed circuit board Download PDF

Info

Publication number
TWM410427U
TWM410427U TW99225732U TW99225732U TWM410427U TW M410427 U TWM410427 U TW M410427U TW 99225732 U TW99225732 U TW 99225732U TW 99225732 U TW99225732 U TW 99225732U TW M410427 U TWM410427 U TW M410427U
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
core printed
layer
metal core
Prior art date
Application number
TW99225732U
Other languages
Chinese (zh)
Inventor
Jing-Wen Tzeng
Original Assignee
Jtprofound Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jtprofound Technology Co Ltd filed Critical Jtprofound Technology Co Ltd
Priority to TW99225732U priority Critical patent/TWM410427U/en
Publication of TWM410427U publication Critical patent/TWM410427U/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

mimil 五、新型說明: 【新型所屬之技術領域】 t本創作係有關一種金屬核心印刷電路板(MCPCB),尤 才曰-種可快速且均自W由電子元件及組件或配件所產生 的熱之金屬核心印刷電路板結構改良。 【先前技術】 採用發光二極體所面臨的挑戰包括溫度管理與較高 、、巧成本的問題;此外 較高的光度輸出》 節炉一般電子元件,如發光二極體(LED)挾其高效率、 路^、、可調紐之優勢在照明市場已逐漸形成風潮,其在 隹二車燈、戶外照明、情境照明等應用已是全球矚目的 #''N Μ〇 * 一 該市場也要求在單位光源下具有 離傳統的方法是將發光二極體晶片安裝在基體上使構成 散式的發光二極體元件,如第一圖所示,接著再將這些 光二極體元件92配置在印刷電路板(PCB)91上,形成多 、發光二極體光源組合,藉以提升照明度’然而,這些發 2二極體元件會因為阻抗消耗電能而產生大量熱量,若這 ^熱量未能有效的散逸出去,將會影響其發光效率及光原 :質、損耗使用壽命,更甚者會損壞而無法使用,因此在 设計時就必須考量其散熱問題’以確保裝置運作效能及延 伸裝置的壽命。 一 然而’一般如發光二極體之類的電子元件因散熱需求 向’因此多會在該電子元件上或週邊設置如風扇或散熱鰭 片等的散熱裝置,讓熱源先由電子元件轉移到空氣中,以 3 M410427 增加對流效率,惟,使用風扇必須消耗電能,同時也佔據 空間,因此,在現今電氣裝置曰趨薄形化的趨勢中是較不 適用的。 【新型内容】 有鑑於此,本創作之主要目的即在提供一種可快速且 均勻導出廢熱之金屬核心印刷電路板結構。 為達上揭目的,本創作之金屬核心印刷電路板(MCPCB) 係包括有一金屬基板層、一銅羯線路層、一絕緣薄層以及 一石墨均熱層;其中,金屬基板層係做為整體金屬核心印 刷電路板的主要機械結構體;銅箔線路層係建構有依照所 裝載電子元件(如發光二極體或其他電子元件)而佈設的電 氣走線;至於,絕緣薄層係設於金屬基板層與銅箔線路層 之間,主要將金屬基板層與銅箔線路層加以隔離,而該石 墨均熱層則設於金屬基板層相對於銅箱線路層之另一側。 本創作之功效之一,在於該電子元件所產生之廢熱即 可藉由金屬基板層導出並透過石墨均熱層的快速導熱、均 熱特性,增加廢熱擴散面積,有助於其所裝載的電子元件 之廢熱傳導。 本創作之功效之二,在於當金屬基板層係運用薄型板 做為機械結構體時,因石墨均熱層亦具有可撓折的特性, 使整體金屬核心印刷電路板具有可配合電氣裝置彎折定型 的特性。 本創作之功效之三,在於金屬基板層及石墨均熱層具 有較佳的散熱作用,使所裝載的發光二極體或其他電子元 件獲致較佳的效能。 【實施方式】 【實施方式】 本創作 而 獲得清楚地瞭解 之特點,可參閱本案圖式及實施例之詳細說明 圖,如第二圖(A)本創作金屬核心印刷電路板結構剖视 示,t第二圖本創作金屬核心印刷電路板外觀立體圖所 2 ,其創作之金屬核心印刷電路板1〇係供裝載電子元件 緣薄月包括有:一金屬基板層11、一銅箔線路層12、一絕 '广13以及一石墨均熱層14 ;其中: 之機該金屬基板層11,主要做為金屬核心印刷電路板10 板械結構體’可由薄蜇板型式(如第四圖所示)或厚型 以為式(如第七圖所示)的金屬板片所構成’而其材質可 .’、銘板、銘合金金屬板,或銅板、銅合金金屬板。 該鋼箔線路層12,設於金屬基板層n之一 載電子元株^ 因 千2(如圖所示之發光二極體或其他電子元件), 建構有依照所|載電子元件2而佈設的電氣走線(圖 甲未標示)。 片广絕緣薄層13 ’係設於該金屬基板層11與銅镇線路 ^ 之間,主要將金屬基板層11與銅箔線路層12加以隔 使能夠避免短路,而且不致於犧牲太多的散熱速率, =將熱阻降到最低’同時對金屬基板層ii與銅祕路層 提供良好的黏合效果,增加整體金屬核心印刷電路板 的可靠度。 該石墨均熱詹14,可為柔性石墨、高溫熱解石墨或者 石墨塊等,其係設置於金屬基板層U相對於銅箔線路層 12之另一侧;其中該石墨均熱層14係以塗佈方式設置於 M410427 金屬基板層11表面;或者,以機械壓合方式定位於金屬基 板層11表面;當然,也可以黏貼劑黏合於金屬基板層11 表面,而該黏貼劑係可為導熱膠、熱溶膠或感壓膠等。 另外,如第二圖(B)所示’係為本創作第二實施例之 金屬核心印刷電路板結構剖視圖,可進一步於該石墨均熱 層相對於金屬基板詹之另一側設有一導熱層,而該導熱層 係可為導熱片或導熱膠,其材質則可為油脂(Grease)、矽 利康(Silicone)或相變化材。 據以,該電子元件2所產生之廢熱即可藉由金屬基板層 11導出並透過石墨均熱層14的快速導熱、均熱特性,增加 廢熱擴散面積,有助於其所裝載的電子元件2之廢熱傳導而 散逸於空氣中。 , 另外’如第二圖(A)所示之實施例中,該金屬基板層 11係由薄型板型式的金屬板片所構成,具有可撓折的特 性’同時石墨均熱層14亦具有可撓折的特性,因此使整體 金屬核心印刷電路板10具有可配合電氣裝置彎折定犁的特 性(如第四圖及第五圖所示),當本創作之金屬核心印刷電 路板10供裝載電子元件2使用時’可配合將金屬核心印刷電 路板10彎曲或彎折成與照明設備20之殼座21相貼合的狀 態,增加金屬核心印刷電路板1〇與殼座21之接觸面積,有 助於電子元件2之廢熱傳導,以符合高亮度發光二極體照明 設備之設計需求。 又’如第六圖及第七圖所示,該金屬基板層係由厚型 板型式的金屬板片所構成,並且在其板面設有若干平行配 置的溝槽111,使整體金屬核心印刷電路板10保持應有的 支撐作用,並且具有可以沿著溝槽111彎折、定型之特性, Μ4Γ0427 可直接做為電氣裝置的支樓結構體或殼體,如第八圖所 示,可配合將金屬核心印刷電路板10彎折成為照明設備 20之燈架22或殼座。 另外,如第九圖及第十圖所示,該金屬基板層n與石 墨均熱層14接觸相對位置設有若干凹凸結構或若干波紋 結構,使金屬基板層11與石墨均熱層14接觸力及接合面 . 增加強度。 综上所述,本創作提供一較佳可行之金屬核心印刷電 脅路板結構改良,爰依法提呈新型專利之申請;本創作之技 術内容及技術特點巳揭示如上’然而熟悉本項技術之人士 仍可能基於本創作之揭示而作各種不背離本案創作精神之 替換及修飾。因此,本創作之保護範圍應不限於實施例所 揭不者,而應包括各種不背離本創作之替換及修飾,並為 以下之申請專利範圍所涵蓋。 【圖式簡單說明】 多重發光二極體光源組合之結構Mimil V. New Description: [New Technology Area] t This creation is about a metal core printed circuit board (MCPCB), a kind of heat that can be quickly and automatically generated from electronic components and components or accessories. The metal core printed circuit board structure is improved. [Prior Art] The challenges faced by the use of light-emitting diodes include temperature management and higher, more costly problems; in addition, higher photometric output, general electronic components such as light-emitting diodes (LEDs) The advantages of efficiency, roads, and adjustable New Zealand have gradually formed a trend in the lighting market. Its applications in the second lamp, outdoor lighting, and ambient lighting have been the world's attention. #''N Μ〇* This market also requires The conventional method under the unit light source is to mount the light-emitting diode chip on the substrate to form a floating light-emitting diode element, as shown in the first figure, and then arrange the light-emitting diode elements 92 in the printing. On the circuit board (PCB) 91, a plurality of light-emitting diode light source combinations are formed to improve the illumination. However, these two-diode elements generate a large amount of heat due to the power consumption of the impedance, and if the heat is not effective. Dissipating out will affect its luminous efficiency and light source: quality, loss of service life, and even more will be damaged and can not be used, so the heat dissipation problem must be considered in the design to ensure the operation of the device Can be extended and extending the life of the device. However, in general, electronic components such as light-emitting diodes are required to dissipate heat due to heat dissipation. Therefore, heat sinks such as fans or heat sink fins are disposed on or around the electronic components, so that the heat source is first transferred from the electronic components to the air. In the case of 3 M410427, the convection efficiency is increased. However, the use of a fan must consume electric energy and also occupy space, and therefore, it is less applicable in the trend of thinning of electric devices today. [New content] In view of this, the main purpose of this creation is to provide a metal core printed circuit board structure that can quickly and evenly derive waste heat. In order to achieve the above, the metal core printed circuit board (MCPCB) of the present invention comprises a metal substrate layer, a copper germanium circuit layer, an insulating thin layer and a graphite heat equalizing layer; wherein the metal substrate layer is as a whole The main mechanical structure of the metal core printed circuit board; the copper foil circuit layer is constructed with electrical traces arranged according to the loaded electronic components (such as light-emitting diodes or other electronic components); as for the thin layer of insulation is provided on the metal Between the substrate layer and the copper foil circuit layer, the metal substrate layer is mainly separated from the copper foil circuit layer, and the graphite heat storage layer is disposed on the other side of the metal substrate layer with respect to the copper box wiring layer. One of the effects of the present invention is that the waste heat generated by the electronic component can be derived from the metal substrate layer and transmitted through the rapid thermal conductivity and soaking characteristics of the graphite soaking layer, thereby increasing the waste heat diffusion area and contributing to the loaded electrons. Waste heat transfer of components. The second effect of this creation is that when the metal substrate layer uses a thin plate as a mechanical structure, the graphite homogenized layer also has a flexible property, so that the integral metal core printed circuit board can be bent with the electrical device. The characteristics of the stereotype. The third effect of this creation is that the metal substrate layer and the graphite soaking layer have a better heat dissipation effect, so that the mounted light-emitting diode or other electronic components can achieve better performance. [Embodiment] [Embodiment] For a clear understanding of the features of the present invention, reference may be made to the drawings and detailed description of the embodiments, such as the second diagram (A) of the structural metal core printed circuit board structure. The second figure is a three-dimensional view of the appearance of the metal core printed circuit board. The metal core printed circuit board of the present invention is provided with a metal substrate layer 11 and a copper foil circuit layer. A '13' and a graphite soaking layer 14; wherein: the metal substrate layer 11, mainly as a metal core printed circuit board 10, the mechanical structure 'can be thinned plate type (as shown in the fourth figure) Or a thick type of metal sheet (as shown in the seventh figure) is formed 'and its material can be ', 'Mingban, Ming alloy metal plate, or copper plate, copper alloy metal plate. The steel foil circuit layer 12 is disposed on one of the metal substrate layers n, such as a light-emitting diode (such as a light-emitting diode or other electronic component), and is disposed in accordance with the electronic component 2 to be mounted. Electrical wiring (not shown in Figure A). A wide-area insulating thin layer 13' is disposed between the metal substrate layer 11 and the copper-line circuit, and the metal substrate layer 11 and the copper foil circuit layer 12 are mainly separated to avoid short circuit, and the heat dissipation is not sacrificed. The rate, = minimizes the thermal resistance' while providing a good adhesion to the metal substrate layer ii and the copper secret layer, increasing the reliability of the overall metal core printed circuit board. The graphite soaking heat 14 may be a flexible graphite, a high temperature pyrolytic graphite or a graphite block or the like, which is disposed on the other side of the metal substrate layer U with respect to the copper foil circuit layer 12; wherein the graphite soaking layer 14 is It is disposed on the surface of the M410427 metal substrate layer 11 by coating; or is mechanically pressed on the surface of the metal substrate layer 11; of course, the adhesive may be adhered to the surface of the metal substrate layer 11, and the adhesive agent may be thermally conductive. Glue, hot melt or pressure sensitive adhesive. In addition, as shown in the second figure (B), it is a cross-sectional view of the metal core printed circuit board structure of the second embodiment of the present invention, and a heat conducting layer may be further disposed on the other side of the graphite heat equalizing layer relative to the metal substrate. The thermal conductive layer may be a thermal conductive sheet or a thermal conductive adhesive, and the material may be Grease, Silicone or phase change material. Therefore, the waste heat generated by the electronic component 2 can be derived by the metal substrate layer 11 and transmitted through the rapid thermal conductivity and soaking characteristics of the graphite heat equalizing layer 14, thereby increasing the waste heat diffusion area and contributing to the electronic component 2 loaded thereon. The waste heat is transmitted and dissipated in the air. In addition, in the embodiment shown in the second figure (A), the metal substrate layer 11 is composed of a thin plate type metal plate piece, and has a flexible property. Meanwhile, the graphite heat equalizing layer 14 also has a The characteristic of the deflection, so that the overall metal core printed circuit board 10 has the characteristics of being able to be bent with the electric device to bend the plough (as shown in the fourth and fifth figures), when the metal core printed circuit board 10 of the present invention is loaded When the electronic component 2 is used, the metal core printed circuit board 10 can be bent or bent into a state of being attached to the housing 21 of the lighting device 20, and the contact area between the metal core printed circuit board 1 and the housing 21 is increased. It contributes to the waste heat conduction of the electronic component 2 to meet the design requirements of the high-brightness light-emitting diode lighting device. Further, as shown in the sixth and seventh figures, the metal substrate layer is composed of a thick plate type metal plate, and a plurality of grooves 111 arranged in parallel are arranged on the plate surface to make the whole metal core printed. The circuit board 10 maintains the supporting function and has the characteristic that it can be bent and shaped along the groove 111. The Μ4Γ0427 can be directly used as the branch structure or the casing of the electric device, as shown in the eighth figure, which can be matched. The metal core printed circuit board 10 is bent into a lamp holder 22 or a housing of the lighting device 20. In addition, as shown in the ninth and tenth diagrams, the metal substrate layer n is provided with a plurality of concave-convex structures or a plurality of corrugated structures at a position in contact with the graphite soaking layer 14, so that the metal substrate layer 11 and the graphite soaking layer 14 are in contact with each other. And joint surface. Increase strength. In summary, the present invention provides a better and feasible metal core printed electric threat board structure improvement, and the application for a new patent is proposed according to law; the technical content and technical features of the present invention are disclosed above, but are familiar with the technology. Persons may still make substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of this creation should not be limited to the examples, but should include various alternatives and modifications that do not depart from the present invention and are covered by the following claims. [Simple diagram of the diagram] Structure of multiple light-emitting diode source combination

第一圖係為一種習用 不意圖。 實施例之金屬核心印刷電 第一圖(A)係為本創作第一 路板結構剖視圖。 路板、ί;:匕)係為本創作第二實施例之金屬核心印刷電 外觀為摘作第—實施取金屬如印刷電路板 第四圖係為本創作第一實施例之一種使用狀態示意 7 M410427 第五圖係為本創作第一實施例之另一種使用狀態示意 圖。 第六圖係為本創作第三實施例之金屬核心印刷電路板 結構剖視圖。 第七圖係為本創作第四實施例之金屬核心印刷電路板 外觀結構圖。 第八圖係為本創作第三實施例之一種使用狀態示意 圖。 第九圖係為本創作第四實施例之金屬核心印刷電路板 結構剖視圖。 第十圖係為本創作第五實施例之金屬核心印刷電路板 結構剖視圖。 電子元件2 照明設備20 殼座21 燈架22 印刷電路板91 發光二極體元件92 【主要元件符號說明】 金屬核心印刷電路板10 金屬基板層11 溝槽111 銅箔線路層12 絕緣薄層13 石墨均熱層14 導熱層15The first picture is a conventional use. Metal core printed electricity of the embodiment The first figure (A) is a cross-sectional view of the first board structure of the present invention. The circuit board, ί;: 匕) is the metal core printed electrical appearance of the second embodiment of the present invention is the first one - the implementation of the metal, such as the printed circuit board, the fourth picture is a state of use of the first embodiment of the creation 7 M410427 The fifth figure is another schematic diagram of the state of use of the first embodiment of the creation. Figure 6 is a cross-sectional view showing the structure of a metal core printed circuit board of the third embodiment of the present invention. The seventh figure is an external structural view of the metal core printed circuit board of the fourth embodiment of the present invention. The eighth figure is a schematic view of a state of use of the third embodiment of the present creation. The ninth drawing is a sectional view showing the structure of the metal core printed circuit board of the fourth embodiment of the present invention. The tenth drawing is a cross-sectional view showing the structure of the metal core printed circuit board of the fifth embodiment of the present invention. Electronic component 2 Lighting device 20 Housing 21 Lamp holder 22 Printed circuit board 91 Light-emitting diode element 92 [Main component symbol description] Metal core printed circuit board 10 Metal substrate layer 11 Groove 111 Copper foil wiring layer 12 Insulating thin layer 13 Graphite soaking layer 14 heat conducting layer 15

Claims (1)

wmu4:Z7Wmu4: Z7 六、申請專利範圍:Sixth, the scope of application for patents: 丄、一種金屬核心印刷電路板結構改良,係供裝載電 子元件,其包括有: 一金屬基板層’主要做為金屬核心印刷電路板之機械 結構體;丄, a metal core printed circuit board having improved structure for loading electronic components, comprising: a metal substrate layer 'mainly as a mechanical structure of a metal core printed circuit board; _ 一鋼箔線路層,設於金屬基板層之一側,供裝載電子 元件建構有依照所裝載電子元件而佈設的電氣走線; 一絕緣薄層’設於該金屬基板層與銅箔線路層之間; 以及 墨句熱層,設置於金屬基板層相對於銅箔線路層 之另一側。 2、如请求項1所述之金屬核心印刷電路板結構改 良,其中該金屬基板層係為薄型板。 3如请求項1所述之金屬核心印刷電路板結構改 九其中該金屬基板層係為厚型板β _+如请求項3所述之金屬核心印刷電路板結構改 义5、屬基板層的板面設有若干平行配置的溝槽。 沐电=明求項2或3所述之金屬核心印刷電路板結構 改良6其中:金屬基板層係為銘板。 浓& * ΐ 求項2或3所述之金屬核心印刷電路板結構 改良;其金屬基板層係為銘合金金屬板。 改戸,it:求項2或3所述之金屬核心印刷電路板結構 又8 、如=金屬基板層係為銅板。 改良,其中4 =項2或3所述之金屬核心印刷電路板結構 ^ 、以金屬基板層係為銅合金金屬板。 9 κ:. wmm 9、如請求項1所述之金屬核心印刷電路板結構改 良,其中該裝載於銅箔線路層的電子元件為發光二極體。 1 0、如請求項1所述之金屬核心印刷電路板結構改 良,其中該石墨均熱層係以塗佈方式設置於金屬基板層表 面。 1 1、如請求項1所述之金屬核心印刷電路板結構改 良,其中該石墨均熱層係以機械壓合方式定位於金屬基板 層表面。 1 2、如請求項1所述之金屬核心印刷電路板結構改 良,其中該石墨均熱層係以黏貼劑黏合於金屬基板層表面。 1 3、如請求項1 2所述之金屬核心印刷電路板結構 改良,其中該黏貼劑係為導熱膠、熱溶膠或感壓膠。 1 4、如請求項1 2所述之金屬核心印刷電路板結構 改良,其中該石墨均熱層係為柔性石墨。 1 5、如請求項1 2所述之金屬核心印刷電路板結構 改良’其中該石墨均熱屠係為rfj溫熱解石墨。 1 6、如請求項1 2所述之金屬核心印刷電路板結構 改良,其中該石墨均熱層係為石墨塊。 1 7、如請求項1所述之金屬核心印刷電路板結構改 良,其中該石墨均熱層相對於金屬基板層之另一側設有一 導熱層。 1 8、如請求項1 7所述之金屬核心印刷電路板結構 改良,其中該導熱層係為導熱片或導熱膠。 1 9、如請求項1 7所述之金屬核心印刷電路板結構 改良,其中該導熱層係為油脂(Grease )。 2 0、如請求項1 7所述之金屬核心印刷電路板結構 M41.0427_ a steel foil circuit layer, disposed on one side of the metal substrate layer, for mounting electronic components to be constructed with electrical traces arranged in accordance with the loaded electronic components; an insulating thin layer 'on the metal substrate layer and the copper foil circuit layer And the hot layer of the ink sentence is disposed on the other side of the metal substrate layer with respect to the copper foil circuit layer. 2. The metal core printed circuit board structure of claim 1 is improved, wherein the metal substrate layer is a thin plate. 3 The structure of the metal core printed circuit board according to claim 1 is changed to nine, wherein the metal substrate layer is a thick plate β_+ the metal core printed circuit board structure as defined in claim 3 is modified 5, belonging to the substrate layer The plate surface is provided with a plurality of grooves arranged in parallel. MU = the metal core printed circuit board structure described in Item 2 or 3. Improvement 6 wherein: the metal substrate layer is a nameplate. Concentration & * ΐ The metal core printed circuit board structure described in Item 2 or 3 is improved; the metal substrate layer is an alloy metal plate. Modification, it: The metal core printed circuit board structure described in Item 2 or 3 is as follows. For example, the metal substrate layer is a copper plate. The improvement, wherein the metal core printed circuit board structure of the item 4 or the item 2 or the metal substrate layer is a copper alloy metal plate. 9 κ:. wmm 9. The metal core printed circuit board structure according to claim 1 is improved, wherein the electronic component mounted on the copper foil wiring layer is a light emitting diode. 10. The metal core printed circuit board structure of claim 1 is improved, wherein the graphite soaking layer is disposed on the surface of the metal substrate layer in a coating manner. 1 1. The metal core printed circuit board structure of claim 1 is improved, wherein the graphite soaking layer is mechanically pressed to the surface of the metal substrate layer. 1 . The metal core printed circuit board structure according to claim 1 is improved, wherein the graphite soaking layer is adhered to the surface of the metal substrate layer by an adhesive. 1 3. The metal core printed circuit board structure according to claim 12 is improved, wherein the adhesive is a thermal adhesive, a hot melt or a pressure sensitive adhesive. 14. The metal core printed circuit board structure according to claim 12, wherein the graphite soaking layer is flexible graphite. 15. The metal core printed circuit board structure as claimed in claim 1 is modified wherein the graphite homogenate is rfj warm pyrolytic graphite. The metal core printed circuit board structure according to claim 12, wherein the graphite soaking layer is a graphite block. The metal core printed circuit board structure according to claim 1, wherein the graphite heat equalizing layer is provided with a heat conducting layer on the other side of the metal substrate layer. 18. The metal core printed circuit board structure according to claim 17, wherein the heat conductive layer is a heat conductive sheet or a thermal conductive paste. 19. The metal core printed circuit board structure according to claim 17, wherein the heat conductive layer is Gree. 2 0. Metal core printed circuit board structure as claimed in claim 17 M41.0427 改良,其中該導熱層係為矽利康(Silicone)。 21、如請求項17所述之金屬核心印刷電路板結構 改良,其中該導熱層係為相變化材。 2 2、如請求項1所述之金屬核心印刷電路板結構改 良,其中該金屬基板層設有若干凹凸結構。 2 3、如請求項1所述之金屬核心印刷電路板結構改 良,其中該金屬基板層設有若干波紋結構。Improved, wherein the thermally conductive layer is Silicone. 21. The metal core printed circuit board structure of claim 17, wherein the thermally conductive layer is a phase change material. 2. The metal core printed circuit board structure according to claim 1 is improved, wherein the metal substrate layer is provided with a plurality of concave and convex structures. 2. The metal core printed circuit board structure of claim 1 is improved, wherein the metal substrate layer is provided with a plurality of corrugated structures. 11 i M410427 圖式: — 七11 i M410427 Pattern: — Seven M410427M410427 P P 2 13 M410427P P 2 13 M410427 _〇427_〇427 16 Μ41Ό42716 Μ41Ό427 17 M41042717 M410427 1818 \9 M410427\9 M410427 11 20 Μ41Ό42711 20 Μ41Ό427 21 M41042721 M410427 22twenty two
TW99225732U 2010-12-31 2010-12-31 Improved structure for metal core printed circuit board TWM410427U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99225732U TWM410427U (en) 2010-12-31 2010-12-31 Improved structure for metal core printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99225732U TWM410427U (en) 2010-12-31 2010-12-31 Improved structure for metal core printed circuit board

Publications (1)

Publication Number Publication Date
TWM410427U true TWM410427U (en) 2011-08-21

Family

ID=45086227

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99225732U TWM410427U (en) 2010-12-31 2010-12-31 Improved structure for metal core printed circuit board

Country Status (1)

Country Link
TW (1) TWM410427U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10485093B2 (en) 2016-09-06 2019-11-19 Nippon Mektron, Ltd. Flexible printed board and method for manufacturing flexible printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10485093B2 (en) 2016-09-06 2019-11-19 Nippon Mektron, Ltd. Flexible printed board and method for manufacturing flexible printed board

Similar Documents

Publication Publication Date Title
JP4969332B2 (en) Substrate and lighting device
TW201100711A (en) Light emitting diode light source assembly with heat dissipation base
US20150201530A1 (en) Heat Spreading Packaging Apparatus
JP3128955U (en) Electric circuit board structure with heat dissipation sheet
CN105333407A (en) Heat dissipation structure and manufacturing method
CN101740678A (en) Solid state light-emitting element and light source module
TW201209340A (en) Illustrator with light emitting diode
TWI482536B (en) Flexible substrate module
WO2005103564A1 (en) Led light source module packaged with metal
JP3128948U (en) Electric circuit board structure with heat dissipation layer
US8279608B2 (en) Heatsink device directly contacting a heat source to achieve a quick dissipation effect
TWM410427U (en) Improved structure for metal core printed circuit board
WO2012017725A1 (en) Substrate module for having heat generating source mounted thereon, and lighting device
JP3144915U (en) Radiator with electronic circuit module
TWM344027U (en) Heat conductive mechanism for light emitting diode
TWM362512U (en) LED module
TWM331851U (en) Illumination lamp and illumination module
TWI267964B (en) Light-emitting diode module, and heat dissipation system and its heat dissipation method using LED module
TW200837985A (en) LED device with high heat dissipation
WO2011155340A1 (en) Flexible printed wiring board
WO2012176581A1 (en) Heat-dissipating unit
TW201233313A (en) Heat dissipation structure without polarity
KR200433460Y1 (en) Circuit board with heat radiating sheet
TW201144678A (en) Thermal resistance parallel connected LED light source and lighting device containing the thermal resistance parallel connected LED light source
TW201303210A (en) A detachable LED bulb with a separation structure of heat source

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees