201233313 四、指定代表圖： (一) 本案指定代表圖為：第（一）圖。 (二) 本代表圖之元件符號簡單說明： 電路板1 熱源2 絕緣基板11 正面導電電路圖案12 絕緣導熱膠帶13 防銲漆15 銲墊14 • 五、 本案若有化學式時，請揭示最能顯示發明特徵的化學式 六、 發明說明： 【發明所屬之技術領域】 本發明係有關於一種不具極性散熱結構，尤指一種藉 201233313 由絕緣導熱膠帶包覆電路板，以達到不具極性散熱結構與 減少使用者觸電之危險的設計。 【先前技術】 目前生活電子產品越做越小，但是卻有越來越大的散 熱問題，如發光二極體（Light Emitting Diode)，是一種 微小的固態光源，與傳統之白熾燈泡及螢光燈相比，發光 二極體可具有多顆、多種的組合，且單一的發光二極體之 光轉換效率高、耗電量小、耐震性高等保特性，但熱對發 • 光二極體的發光效率及使用壽命會產生相當大的影響，因 此發光二極體運作時之散熱問題，必需得到妥善的解決。 為了使熱源（發光二極體）能在適當的工作溫度下運 作，通常需設有適當的散熱結構，用以協助熱源散熱，來 增加散熱能力，習知熱源之散熱結構，多係在熱源所結合 的基板上或四周空間，利用裝設絕緣鋁製或銅製的散熱鰭 片，以達到吸熱散熱的目的，但該種熱傳導若應用在交流 I 二極體則使用者有高壓觸電之危險，與吸熱不均勻，故散 熱能力有限。 【發明内容】 本發明人有鑑於習知熱源之散熱結構，多係在熱源所 結合的基板上或四周空間，利用裝設絕緣鋁製或銅製的散 熱鰭片達到吸熱散熱，該種熱傳導方式效果不佳，此乃欲 解決之技術問題點。 本發明提供一種不具極性散熱結構，其包括有一電路 201233313 板，該電路板係由一具有正面及背面之絕緣基板，該絕緣 基板正面或背面的至少一面上設有一導電電路圖案，於至 少一導電電路圖案上設有至少二個銲墊，及以至少一絕緣 導熱膠帶包覆電路板的正面與背面，與露出銲墊供熱源組 設，以達到不具極性散熱結構功能。 本發明之主要目的，其利用絕緣導熱膠帶包覆電路板 並直接接觸熱源的設計，使熱源直接透過絕緣導熱膠帶與 散熱鰭片散熱不會有極性問題，可以預防使用者觸電之危 聲險。 本發明的次要目的，其利用絕緣導熱膠帶包覆電路 板，即達不具極性散熱結構效果，該種結構之設計簡單， 製作及材料成本低廉，符合經濟效益與更適合量產，提昇 產品競爭力。 本發明的又一目的，其利用絕緣導熱膠帶包覆電路板 並直接接觸熱源的設計，使熱源直接透過絕緣導熱膠帶與 Φ 散熱鰭片散熱，使熱源的熱源能迅速散開到大氣空間，得 有效維持設備的使用效能及其壽命。 【實施方式】 茲配合圖式將本發明較佳實施例詳細說明如下： 如第一圖本發明第一較佳實施例組合剖面圖所示，本 發明一種不具極性散熱結構，其包括有一電路板1，該電路 板1係由一具有正面及背面之絕緣基板11，該絕緣基板11 正面設有一正面導電電路圖案12 ，於正面導電電路圖案1 2上設有至少二個銲墊14與防銲漆15，該絕緣基板11材質 201233313 係為FR4玻纖環氧基板、FR1紙質基板、CEM-1複合基板、C EM-3複合基板、聚脂樹脂（p〇iyester(PET))、聚亞醯胺（P olyimide(PI))、電木、塑膠、鋁基板、石墨、陶瓷、矽膠 、氧化鋁、玻璃、氧化鋅或氧化後絕緣之金屬，該正面導 電電路圖案12材質係為銅、金、銀、鋁等導電材料。 至少一熱源2，該熱源2係如發光二極體，係結合於正 面導電電路圖案12之銲墊14上，該正面導電電路圖案12電 性連接電源，俾供應給該熱源2電源。 ^ 及一絕緣導熱膠帶13，該絕緣導熱膠帶13材質係為銅 箔、鋁箔、錫箔、金箔、銀箔、玻纖布、矽膠等絕緣導熱 膠帶與於該絕緣導熱膠帶13上設置黏膠由電路板1正面之 銲墊14與正面導電電路圖案12,經由電路板1之側邊與背面 將電路板1包覆並黏貼於該電路板1 ’藉以導引並吸附該熱 源2連接電源所產生的熱。 如第二圖本發明第二較佳實施例組合剖面圖所示，本 φ 發明一種不具極性散熱結構，其包括有一電路板1，該電路 板1係由一具有正面及背面之絕緣基板11，該絕緣基板11 正面設有一正面導電電路圖案12與背面設有一背面導電電 路圖案16，於正面導電電路圖案12上設有至少二個銲墊14 ，該絕緣基板11材質係為FR4玻纖環氧基板、FR1紙質基板 、CEM-1複合基板、CEM-3複合基板、聚脂樹脂（Polyester (PET))、聚亞醯胺（p〇iyimide(pl))、電木、塑膠、鋁基板 、石墨、陶瓷、矽膠、氧化鋁、玻璃、氧化鋅或氧化後絕 緣之金屬，該正面導電電路圖案12與背面導電電路圖案16[s] .5 201233313 材質係為銅、金、銀、鋁等導電材料。 至少一熱源2，該熱源2係如發光二極體，係結合於正 面導電電路圖案12之銲墊14上，該正面導電電路圖案12電 性連接電源，俾供應給該熱源2電源。 及一絕緣導熱膠帶13，該絕緣導熱膠帶13材質係為鋼 绪、銘猪、錫绪、金猪、銀落、玻纖布、石夕膠等絕緣導熱 膠帶與於該絕緣導熱膠帶13上設置黏膠由熱源2本體之— 側邊經由電路板1正面之銲墊14與正面導電電路圖案12，再 ® 經由電路板1之一側邊與電路板1背面之背面導電電路圖案 16，再經由電路板1之另一側邊與電路板1正面之銲墊14與 正面導電電路圖案12’再回到熱源2本體之另一側邊將電路 板1包覆並黏貼於該電路板1 ’藉以導引並吸附該熱源2連接 電源所產生的熱。 如第三圖本發明第三較佳實施例組合剖面圖所示，本 發明一種不具極性散熱結構’其包括有一電路板1 ’該電路 板1係由一具有正面及背面之絕緣基板11 ’該絕緣基板11 ® 正面設有一正面導電電路圖案12與背面設有一背面導電電 路圖案16 ’於正面導電電路圖案12上設有至少二個銲螯1 4，該絕緣基板11材質係為叩4玻纖環氧基板、FR1紙質基板 、CEM-1複合基板、CEM-3複合基板、聚脂樹脂（Polyester (PET))、聚亞醯胺（p〇lyimide(PI))、電木、塑膠、鋁基板 、石墨、陶瓷、矽膠、氧化鋁、玻璃、氧化鋅或氧化後絕 緣之金屬，該正面導電電路圖案12與背面導電電路圖案16 材質係為銅、金、銀、銘等導電材料。 6 201233313 至少一熱源2，該熱源2係如發光二極體，係結合於正 面導電電路圖案12之銲墊14上’該導電電路圖案12電性連 接電源，俾供應給該熱源2電源。 及二絕緣導熱膠帶13 ’該絕緣導熱膠帶13材質係為銅 箔、鋁箔、錫箔、金箔、銀箔、玻纖布、石夕膠等絕緣導熱 膠帶與於該絕緣導熱膠帶13上設置黏膠，該二絕緣導熱膠 帶13各由熱源2本體之一侧邊經由電路板1正面之銲墊丨4與 正面導電電路圖案12,再經由電路板1之各一側邊與電路板 * 1背面之背面導電電路圖案16將電路板1包覆並黏貼於該電 路板1，藉以導引並吸附該熱源2連接電源所產生的熱。 上述三實施例的電路板1與絕緣導熱膠帶13係可再結 合於一散熱雜片40上，分別如第四、五圖所示。 由上述具體實施例之結構’可得知本發明具有下述之 效益： 1. 其利用絕緣導熱膠帶13包覆電路板1,即達不具 φ 極性散熱結構效果，該種結構之設計簡單，製作及材料成 本低廉，符合經濟效益與更適合量產，提昇產品競爭力。 2. 其利用絕緣導熱膠帶13包覆電路板1並直接接觸 熱源2的設計，使熱源2直接透過絕緣導熱膠帶13與散 熱鰭片40散熱不會有極性問題’可以預防使用者觸電之 危險。 S] 3. 其利用絕緣導熱膠帶13包覆電路板1並直接接觸 熱源2的設計，使熱源2直接透過絕緣導熱膠帶13與散熱 鰭片40散熱，使熱源2的熱源能迅速散開到大氣空間’得 7 201233313 有效維持設備的使用效能及其壽命。 【圖式簡單說明】 第一圖：本發明第一較佳實施例組合剖面圖。 第二圖：本發明第二較佳實施例組合剖面圖。 第三圖：本發明第三較佳實施例組合剖面圖。 第四圖：本發明一種實施例配合散熱鰭片示意圖。 第五圖：本發明另一種實施例配合散熱鰭片示意圖。 【主要元件符號說明】 熱源2 正面導電電路圖案12 銲墊14 背面導電電路圖案16 電路板1 絕緣基板11 絕緣導熱膠帶13 防録漆15 散熱鰭片40201233313 IV. Designated representative map: (1) The representative representative of the case is: (1). (2) The symbol of the symbol of this representative figure is simple: Circuit board 1 Heat source 2 Insulating substrate 11 Front conductive circuit pattern 12 Insulating thermal tape 13 Solder resist 15 Solder pad 14 • V. If there is a chemical formula in this case, please reveal the best display The invention is characterized by a non-polar heat dissipation structure, in particular, a circuit board coated with an insulating thermal conductive tape by 201233313 to achieve a non-polar heat dissipation structure and reduced use. The design of the danger of electric shock. [Prior Art] At present, the life of electronic products is getting smaller and smaller, but there are more and more heat dissipation problems, such as Light Emitting Diode, which is a tiny solid-state light source, with traditional incandescent bulbs and fluorescent light. Compared with the lamp, the light-emitting diode can have a combination of multiple and multiple, and the single light-emitting diode has high light-conversion efficiency, low power consumption, high shock resistance, and the like, but the heat is opposite to the light-emitting diode. Luminous efficiency and service life will have a considerable impact, so the heat dissipation problem of the LED operation must be properly solved. In order to enable the heat source (light-emitting diode) to operate at an appropriate operating temperature, it is usually necessary to provide a proper heat dissipation structure to assist the heat source to dissipate heat, thereby increasing the heat dissipation capability, and the heat dissipation structure of the heat source is mostly in the heat source. The heat-dissipating fins made of insulating aluminum or copper are used on the combined substrate or in the surrounding space to achieve the purpose of heat absorption and heat dissipation. However, if the heat conduction is applied to the AC I diode, the user may have a high-voltage electric shock. The heat absorption is uneven, so the heat dissipation capacity is limited. SUMMARY OF THE INVENTION The present inventors have in view of the heat dissipation structure of the conventional heat source, which is mostly disposed on the substrate or the surrounding space of the heat source, and is provided with heat-dissipating fins made of insulating aluminum or copper to achieve heat absorption and heat dissipation. Poor, this is the technical problem to be solved. The present invention provides a non-polar heat dissipation structure, comprising a circuit 201233313, the circuit board comprising an insulating substrate having a front side and a back side, wherein at least one side of the front or back side of the insulating substrate is provided with a conductive circuit pattern for at least one conductive The circuit pattern is provided with at least two solder pads, and the front and back surfaces of the circuit board are covered by at least one insulating and thermal conductive tape, and the heat source is assembled with the exposed solder pads to achieve the function of not having a polar heat dissipation structure. The main object of the present invention is to cover the circuit board with insulating thermal conductive tape and directly contact the heat source design, so that the heat source directly passes through the insulating thermal conductive tape and the heat dissipation fins to dissipate heat without a polarity problem, thereby preventing the user from risk of electric shock. The secondary object of the present invention is to cover the circuit board with insulating thermal conductive tape, that is, to achieve the effect of non-polar heat dissipation structure, the structure of the structure is simple, the production and material cost are low, the economic benefit is more suitable, and the product is more suitable for mass production, thereby enhancing product competition. force. Another object of the present invention is to use an insulating thermal conductive tape to cover the circuit board and directly contact the heat source design, so that the heat source directly transmits heat through the insulating thermal conductive tape and the Φ heat dissipation fin, so that the heat source of the heat source can be quickly dispersed to the atmospheric space, which is effective. Maintain equipment performance and its longevity. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings: FIG. 1 is a cross-sectional view of a first preferred embodiment of the present invention. The present invention has a non-polar heat dissipation structure including a circuit board. 1. The circuit board 1 is composed of an insulating substrate 11 having a front surface and a back surface. The front surface of the insulating substrate 11 is provided with a front conductive circuit pattern 12, and at least two solder pads 14 are disposed on the front conductive circuit pattern 12 and solder resist. Paint 15, the material of the insulating substrate 11 201233313 is FR4 glass fiber epoxy substrate, FR1 paper substrate, CEM-1 composite substrate, C EM-3 composite substrate, polyester resin (p〇iyester (PET)), poly Asia A metal (P olyimide (PI)), bakelite, plastic, aluminum substrate, graphite, ceramic, silicone, alumina, glass, zinc oxide or oxidized insulating metal. The front conductive circuit pattern 12 is made of copper or gold. Conductive materials such as silver and aluminum. At least one heat source 2, such as a light-emitting diode, is bonded to the pad 14 of the front surface conductive circuit pattern 12, and the front conductive circuit pattern 12 is electrically connected to the power source, and is supplied to the heat source 2 power source. And an insulating thermal conductive tape 13, the insulating thermal conductive tape 13 is made of copper foil, aluminum foil, tin foil, gold foil, silver foil, fiberglass cloth, silicone rubber and the like, and an insulating thermal conductive tape is disposed on the insulating thermal conductive tape 13 by a circuit board. 1 front pad 14 and front conductive circuit pattern 12, the circuit board 1 is covered and adhered to the circuit board 1 ' via the side and the back of the circuit board 1 to guide and adsorb the heat generated by the heat source 2 connected to the power source . As shown in the second cross-sectional view of the second preferred embodiment of the present invention, the φ invention has a non-polar heat dissipation structure including a circuit board 1 which is composed of an insulating substrate 11 having a front side and a back side. The front surface of the insulating substrate 11 is provided with a front conductive circuit pattern 12 and a back surface conductive circuit pattern 16. The front conductive circuit pattern 12 is provided with at least two solder pads 14 made of FR4 glass epoxy. Substrate, FR1 paper substrate, CEM-1 composite substrate, CEM-3 composite substrate, Polyester (PET), polypyridinium (pl), bakelite, plastic, aluminum substrate, graphite , ceramic, silicone, alumina, glass, zinc oxide or oxidized insulating metal, the front conductive circuit pattern 12 and the back conductive circuit pattern 16 [s] .5 201233313 The material is copper, gold, silver, aluminum and other conductive materials . At least one heat source 2, such as a light-emitting diode, is bonded to the pad 14 of the front surface conductive circuit pattern 12, and the front conductive circuit pattern 12 is electrically connected to the power source, and is supplied to the heat source 2 power source. And an insulating thermal conductive tape 13 , the insulating thermal conductive tape 13 is made of steel, Ming pig, tin, gold pig, silver drop, fiberglass cloth, Shi Xijiao and other insulating thermal tape and set on the insulating thermal tape 13 The adhesive is made up of the heat source 2 body via the solder pad 14 on the front side of the circuit board 1 and the front conductive circuit pattern 12, and then via the side of one of the circuit board 1 and the back surface conductive circuit pattern 16 on the back side of the circuit board 1, The other side of the circuit board 1 and the pad 14 on the front side of the circuit board 1 and the front conductive circuit pattern 12' are returned to the other side of the body of the heat source 2 to wrap and adhere the circuit board 1 to the circuit board 1' The heat generated by the heat source 2 connected to the power source is guided and adsorbed. 3 is a non-polar heat dissipation structure of the present invention, which includes a circuit board 1 The front surface of the insulating substrate 11 ® is provided with a front conductive circuit pattern 12 and the back surface is provided with a back conductive circuit pattern 16 ′. The front conductive circuit pattern 12 is provided with at least two soldering strips 14 , and the insulating substrate 11 is made of 叩 4 glass fiber. Epoxy substrate, FR1 paper substrate, CEM-1 composite substrate, CEM-3 composite substrate, Polyester (PET), polyplyimide (PI), bakelite, plastic, aluminum substrate The graphite, the ceramic, the tantalum, the aluminum oxide, the glass, the zinc oxide or the metal after the oxidation, the front conductive circuit pattern 12 and the back conductive circuit pattern 16 are made of a conductive material such as copper, gold, silver or quartz. 6 201233313 At least one heat source 2, such as a light-emitting diode, is bonded to the pad 14 of the front surface conductive circuit pattern 12. The conductive circuit pattern 12 is electrically connected to a power source, and is supplied to the heat source 2 power source. And two insulating thermal conductive tapes 13 'the insulating thermal conductive tape 13 is made of copper foil, aluminum foil, tin foil, gold foil, silver foil, fiberglass cloth, Shishijiao and other insulating thermal conductive tape and adhesive glue is disposed on the insulating thermal conductive tape 13, The two insulating and thermally conductive adhesive tapes 13 are each electrically connected to the front conductive circuit pattern 12 via the soldering pad 4 on the front side of the circuit board 1 and the front side of the circuit board 1 The circuit pattern 16 covers and adheres the circuit board 1 to the circuit board 1 to guide and adsorb the heat generated by the heat source 2 connected to the power source. The circuit board 1 and the insulating and thermally conductive tape 13 of the above three embodiments can be further combined with a heat dissipating sheet 40 as shown in Figs. 4 and 5, respectively. It can be seen from the structure of the above specific embodiment that the present invention has the following benefits: 1. The circuit board 1 is covered by the insulating thermal conductive tape 13, that is, the effect of the heat dissipation structure without φ polarity is obtained, and the design of the structure is simple, and the manufacturing is simple. And the material cost is low, it is economical and more suitable for mass production, and enhance product competitiveness. 2. It covers the circuit board 1 with the insulating thermal conductive tape 13 and directly contacts the design of the heat source 2, so that the heat source 2 directly transmits heat through the insulating heat-conducting tape 13 and the heat-dissipating fins 40 without polarity problem, which can prevent the user from being exposed to electric power. S] 3. The circuit board 1 is covered by the insulating thermal conductive tape 13 and directly contacts the heat source 2, so that the heat source 2 directly transmits heat through the insulating thermal conductive tape 13 and the heat dissipation fins 40, so that the heat source of the heat source 2 can be quickly dispersed to the atmospheric space. '得得7 201233313 Effectively maintain the performance of the equipment and its life. BRIEF DESCRIPTION OF THE DRAWINGS First FIG. is a sectional view showing a combination of a first preferred embodiment of the present invention. Second Figure: A cross-sectional view of a combination of a second preferred embodiment of the present invention. Figure 3 is a cross-sectional view showing a combination of a third preferred embodiment of the present invention. Fourth figure: A schematic diagram of an embodiment of the present invention with a heat sink fin. Figure 5 is a schematic view of another embodiment of the present invention with a heat sink fin. [Main component symbol description] Heat source 2 Front conductive circuit pattern 12 Solder pad 14 Back surface conductive circuit pattern 16 Circuit board 1 Insulation substrate 11 Insulation heat conductive tape 13 Anti-recording paint 15 Heat sink fins 40