M331851 • 八、新型說明： 【新型所屬之技術領域】 ^ 本創作係有關使用發光二極體之照明燈具改良，尤針 ' 對照明當中的照明模組結構加以改良，旨在提供一種具有 較佳散熱功效，以及具有較佳光源投射效果的照明燈具。 【先前技術】 發光二極體（Light Emitting Diode，LED)是一種 利用電子電洞的相互結合將能量以光形式釋發的半導體 元件，由於屬冷光發光，具有體積小、壽命長、耗電量低、 反應速率快、耐震性特佳等優點，除了可以做為電氣產品 的發光元件之外，更可以廣泛做為照明燈具之發光元件。 因此坊間即出現有許多應用於上揭照明燈具之發光 二極體照明模組；如第一圖所示，即為一種習見使用發光 二極體照明模組的路燈結構示意圖，此路燈主要係在燈罩 11内部建構有一裝設有複數個發光二極的照明模組20 ; * 其所習用的照明模組主要係利用一具有導電功能的硬質·· RF-4印刷電路板21做為呈載發光二極體22的載板。 由於一般RF-4印刷電路板為不可彎曲，使得整體照 明模組的所有發光二極體22只能夠以相同平直面的方式 排列，不但適用性較低，而且無法有效的所有發光二極體 22之光源集中，因此光線的投射效果並不如預期理想， ^ 尤其一般硬質印刷電路板21並未具備任何的散熱機制， 無法配合將發光二極體22所產生的熱源釋出，導致整體 5 M331851 照明燈具的溫度過熱，進而影響照明燈具之使用壽命。 【新型内容】 有鑑於此，本創作即針對照明燈具當中的照明模組結 構加以改良，旨在提供一種具有較佳散熱效能，以及具有 較佳光源投射效果的照明燈具及其照明模組結構。 為達上揭目的，本創作所揭示的照明模組係由一個載 板以及至少一個發光二極體所構成；至於，载板係由一可 撓性底層為基材，並且在可撓性底層上依序設有導熱絕緣 層以及導電層，各發光二極體即建構在载板的導電層上， 透過導電層與電源導通，俾可將照明模組配合不同形式的 燈罩彎折配置，以獲致較佳的光源投射效果，以及利用導 熱絕緣層將發光二極體所產生的熱源直接透過燈罩釋 出’以增加整體照明燈具之散熱效率。 本創作之功效之一，在於可以利用軟性的載板配合不 同形式的照明燈具的燈罩或燈架等結構體彎折，可以有效 集中發光二極體的光源，因此具有較佳的光線投射效果。 本創作之功效之二，在於整體照明燈具可以透過載板 熱絕緣層將發光二極體所產生熱源釋放傳導至燈罩 "放’因此具有較佳的散熱效能。 【實施方式】 〜本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地瞭解。 M331851 如第二圖（A)所示，本創作之照明燈具係在一燈罩11 内部建構有一使用發光二極體31之照明模組30,該照明 模組30基本上係由一個載板32以及至少一個發光二極體 31所構成；請同時配合參照第三圖所示，該載板32係由 一可撓性底層321為基材，即為一軟性的載板結構，並且 在可撓性底層321上依序設有導熱絕緣層323以及導電層 322,各發光二極體31即建構在載板32的導電層322上， 且該可撓性底層321之厚度係小於或等於〇. 2匪。 於貫施日τ ’可挽性底層3 21係可以由紹、銅、鐵、不 銹鋼等金屬材料所製成的軟性結構體；至於，導電層322 係可以全面或局部鋪蓋於導熱絕緣層323上，其具有以銅 為主的線路3221，並且在線路3221之間設有由絕緣材料 所構成的絕緣部3222供發光二極體31定置，發光二極體 31之導線311則配合接續至導電層32的線路3221處， 並與線路3221形成電性連接，使能夠透過導電層322與 電源導通。 ··再者，該導熱絕緣層323可以為導熱膠或導熱膠片， 而該導熱膠可為一雙面膠，由導熱絕緣層323構成導電層 322與可撓性底層321相結合；整體照明模組即可如第二 圖所示，利用軟性的載板32配合不同形式的照明燈具之 燈罩11彎折，如圖所示係將該軟性的載板32彎折成中心 向内凹之形式，俾可以有效集中發光二極體31的光源’ 因此具有較佳的光線投射效果；尤其，可以透過載板32 的導熱絕緣層33將發光二極體31所產生熱源釋放傳導至 7 M331851 可撓性底層32卜並可朝燈罩u釋放，因此具有較佳的 散熱效能:而該軟性的載板32亦可f折成中心向外凸之 形式’如第二圖⑻所示，俾可以有效發散發光體Μ 的光源。 湘第四圖所示的實施例當中，照明模組30係 1八广的载板32直接建構在一般俗稱T-BAR的燈架 12上，该燈架12係設有若干用以放置發光元件的容置槽 121，整體照明模組3〇即可順著容置才曹121的形狀彎折， 使各發光二極體31得以確實纽在所對應的容置槽121 田中而八有車又佳的適用性，尤其可以透過載板32的導 熱絕緣層321將發光二極體31所產生熱源釋放，因此具 有較佳的散熱效能，甚至於可以如第五圖所示，進一步在 載板32相對於可撓性底層321下方鋪設一焊料層325， 方便整體照明模組直接黏著在相關照明設備的結構體上。 藉由上述發光模當中以可撓性底層為基材的載板結 構設計，可以配合不同形式燈具之燈罩、燈架等結構體彎 折，以及透過載板的導熱絕緣層將發光二極體所產生熱源 ，放，確實提供-適用性廣以及具有較佳散熱效能的照明 模組，以及具有較佳光線投射效果之照明燈具結構，爰依 法提呈新型專利之申請。 本創作之技術内容及技術特點已揭示如上，然而熟悉 本項技術之人士仍可能基於本創作之揭示而作各種不背 離本案創作_之替換及修飾。因此，本創作之保護 應不限於實施例所揭示者’而應包括各料f離本創作之 8 M331851 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 , 第一圖係為一習用照明燈具之結構示意圖。 第二圖（A)、（B)本創作第一實施例之照明燈具結構示意 圖。 第三圖本創作第一實施例之照明模組結構示意圖。 第四圖本創作第三實施例之照明燈具結構示意圖。 • 第五圖本創作第二實施例之照明模組結構示意圖。 【主要元件代表符號說明】 11燈罩 32載板 12燈架 321可撓性底層 121容置槽 322導電層 21硬質印刷電路板 3221線路 3222絕緣部 323導弟絕緣層 325焊料層 22發光二極體 • 30照明模組 31發光二極體 311導線M331851 • VIII. New Description: 【New Technology Fields】 ^ This essay is about the improvement of lighting fixtures using LEDs, especially to improve the structure of lighting modules in lighting, aiming to provide a better Cooling effect, and lighting fixtures with better light source projection. [Prior Art] A Light Emitting Diode (LED) is a semiconductor element that emits energy in the form of light by the combination of electron holes. Because of the cold light, it has a small size, long life, and power consumption. Low, fast reaction rate, excellent shock resistance, etc., in addition to being used as a light-emitting component of electrical products, it can be widely used as a light-emitting component of lighting fixtures. Therefore, there are many light-emitting diode lighting modules applied to the above-mentioned lighting fixtures; as shown in the first figure, it is a schematic diagram of a street light structure using a light-emitting diode lighting module. The lampshade 11 is internally constructed with a plurality of illumination modules 20 equipped with a plurality of light-emitting diodes. * The lighting module used in the lampshade 11 is mainly made of a hard-charged RF-4 printed circuit board 21 having a conductive function. The carrier of the diode 22 is provided. Since the general RF-4 printed circuit board is inflexible, all the LEDs 22 of the overall illumination module can be arranged in the same flat surface manner, which is not only suitable for use, but also cannot be effective for all the LEDs 22 The light source is concentrated, so the projection effect of the light is not as ideal as expected. ^ Especially the hard printed circuit board 21 does not have any heat dissipation mechanism, and can not cooperate with the release of the heat source generated by the LED 22, resulting in the overall 5 M331851 illumination. The temperature of the luminaire is overheated, which in turn affects the service life of the luminaire. [New content] In view of this, the creation of the lighting module structure in the lighting fixture is aimed at providing a lighting fixture with better heat dissipation performance and better light source projection effect and a lighting module structure thereof. In order to achieve the above, the lighting module disclosed in the present invention is composed of a carrier board and at least one light-emitting diode; as for the carrier board, a flexible bottom layer is used as a substrate, and the flexible bottom layer is The thermal conductive insulating layer and the conductive layer are sequentially arranged, and each of the light emitting diodes is constructed on the conductive layer of the carrier, and is electrically connected to the power source through the conductive layer, and the lighting module can be bent and configured with different types of lampshades to A better light source projection effect is obtained, and a heat source generated by the light emitting diode is directly transmitted through the lamp cover by using a heat conductive insulating layer to increase the heat dissipation efficiency of the overall lighting fixture. One of the functions of the present invention is that the flexible carrier plate can be used to bend the structure of the lampshade or the lamp holder of different types of lighting fixtures, and the light source of the light-emitting diode can be effectively concentrated, so that the light projection effect is better. The second effect of this creation is that the overall lighting fixture can transmit the heat source generated by the light-emitting diode to the lampshade through the thermal insulation layer of the carrier plate, so that it has better heat dissipation performance. [Embodiment] ~ The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the examples. M331851 As shown in the second figure (A), the lighting fixture of the present invention is constructed with a lighting module 30 using a light-emitting diode 31 inside a lampshade 11, the lighting module 30 basically consisting of a carrier 32 and At least one light-emitting diode 31 is formed; please refer to the third figure at the same time, the carrier 32 is made of a flexible bottom layer 321 as a substrate, that is, a soft carrier structure, and is flexible. The bottom layer 321 is provided with a heat conductive insulating layer 323 and a conductive layer 322, and each of the light emitting diodes 31 is formed on the conductive layer 322 of the carrier 32, and the thickness of the flexible bottom layer 321 is less than or equal to 〇. 2 bandit. The sturdy sturdy τ 'retractable bottom layer 3 21 can be made of a metal material such as slag, copper, iron, stainless steel, etc.; as for the conductive layer 322 can be fully or partially covered on the thermal conductive layer 323 It has a copper-based line 3221, and an insulating portion 3222 made of an insulating material is disposed between the lines 3221 for the light-emitting diode 31 to be fixed, and the wires 311 of the light-emitting diode 31 are connected to the conductive layer. The line 3221 of the 32 is electrically connected to the line 3221 so as to be electrically connected to the power source through the conductive layer 322. In addition, the thermal conductive insulating layer 323 may be a thermal conductive adhesive or a thermal conductive film, and the thermal conductive adhesive may be a double-sided adhesive. The conductive layer 322 is formed by the thermal conductive insulating layer 323 and the flexible bottom layer 321 is combined; The group can be bent by the flexible carrier 32 in combination with the lampshade 11 of different types of lighting fixtures as shown in the second figure, as shown in the figure, the flexible carrier 32 is bent into a centrally inwardly concave form.俾 can effectively concentrate the light source of the light-emitting diode 31. Therefore, it has a better light projection effect; in particular, the heat source generated by the light-emitting diode 31 can be released to the 7 M331851 through the thermally conductive insulating layer 33 of the carrier 32. The bottom layer 32b can be released toward the lampshade u, so that it has better heat dissipation performance: and the flexible carrier plate 32 can also be folded into a centrally convex form as shown in the second figure (8), which can effectively emit light. The source of the body. In the embodiment shown in the fourth embodiment of the figure, the light-emitting module 30 is directly mounted on a lamp holder 12 commonly referred to as a T-BAR, and the lamp holder 12 is provided with a plurality of light-emitting elements. The accommodating groove 121, the overall lighting module 3 〇 can be bent along the shape of the accommodating Cao 121, so that each of the illuminating diodes 31 can be surely placed in the corresponding accommodating groove 121 in the field. For example, the heat source generated by the LEDs 31 can be released through the thermal conductive layer 321 of the carrier 32, so that the heat dissipation performance is better, and even on the carrier 32 as shown in FIG. A solder layer 325 is disposed under the flexible bottom layer 321 to facilitate the direct attachment of the entire lighting module to the structure of the associated lighting device. By designing the carrier structure with the flexible bottom layer as the base material in the above-mentioned light-emitting mold, it is possible to bend the structure of the lampshade, the lamp holder and the like of different types of lamps, and to transmit the light-emitting diode through the heat-conductive insulating layer of the carrier plate. Produce a heat source, put it, and provide a lighting module with wide applicability and better heat dissipation performance, as well as a lighting fixture structure with better light projection effect, and apply for a new patent according to law. The technical content and technical features of the present invention have been disclosed as above, but those skilled in the art may still make various substitutions and modifications without departing from the present disclosure based on the disclosure of the present invention. Therefore, the protection of the present invention should not be limited to those disclosed in the examples, but should include the replacement and modification of the 8 M331851 of the present invention, and is covered by the following patent application. [Simple diagram of the diagram], the first diagram is a schematic diagram of the structure of a conventional lighting fixture. Second (A), (B) Schematic diagram of the structure of the lighting fixture of the first embodiment of the present creation. The third figure is a schematic structural view of the lighting module of the first embodiment of the present invention. The fourth figure is a schematic view showing the structure of the lighting fixture of the third embodiment. • Fig. 5 is a schematic view showing the structure of the lighting module of the second embodiment. [Main component representative symbol description] 11 lamp cover 32 carrier plate 12 lamp holder 321 flexible bottom layer 121 accommodating groove 322 conductive layer 21 hard printed circuit board 3221 line 3222 insulating portion 323 guide brother insulating layer 325 solder layer 22 light emitting diode • 30 lighting module 31 LED 311 wire