M331757 八、新型說明： 【新型所屬之技術領域】 本創作係有關使用發光二極體之照明模組改良，尤針 * 對照明模組當中的載板結構加以改良，旨在提供一種具有 較佳散熱功效，以及可配合燈罩、燈架等結構體彎折的照 明模組。 _ 【先前技術】 發光二極體（Light Emitting Diode，LED)是一種 利用電子電洞的相互結合將能量以光形式釋發的半導體 元件，由於屬冷光發光，具有體積小、壽命長、耗電量低、 反應速率快、耐震性特佳等優點，除了可以做為電氣產品 的發光元件之外，更可以廣泛做為照明燈具、資訊看板等 照明裝置之發光元件。 因此坊間即出現有許多應用於上揭照明燈具、資訊看 板等裝置之發光二極體照明模組；類似的照明模組主要係 > 在一具有導電功能的載板上建構有複數個做為發光元件 的發光二極體，而其中的載板則多係由一般RF4印刷電路 板所構成。 - 由於一般RF-4印刷電路板為不可彎曲，使得整體照 , 明模組的適用性較低，故坊間另外出現有如第一圖所示在 軟性電路板20上建構有發光二極體10的照明模組，主要 利用軟性電路板20可彎折之特性，提升整體照明模組之 適用性。 5 • M331757 然而，第一圖所示習用照明模組當中的軟性電路板 20並未具備任何的散熱機制，無法配合將發光二極體10 ' 所產生的熱源釋出，導致整體照明模組的溫度過熱，甚至 - 於反而會因此對照明模組之應用範圍造成限制。 【新型内容】 有鑑於此，本創作即針對照明模組當中的載板結構加 以改良，旨在提供一種具有較佳散熱效能，以及可配合燈 • 罩、燈架等結構體彎折的照明模組。 為達上揭目的，整體照明模組基本上係由一個載板以 及至少一個發光二極體所構成；其中，載板係由一可撓性 底層為基材，並且在可撓性底層上依序設有導熱絕緣層以 及導電層，各發光二極體即建構在載板的導電層上，透過 導電層與電源導通；據以，整體照明模組除了可以利用軟 性的載板配合燈罩、燈架等結構體彎折，而具有較佳的適 用性之外，整體照明模組更可以透過載板的導熱絕緣層將 • 發考二極體所產生熱源釋放，因此具有較佳的散熱效能。 本創作之功效之一，在於可以利用軟性的載板配合燈 罩、燈架等結構體彎折，因此具有較佳的適用性。 本創作之功效之二，在於可以透過載板的導熱絕緣層 將發光二極體所產生熱源釋放，因此具有較佳的散熱效 *能。 【實施方式】 6 M331757 本創作之特點，可參閱本案圖式 而獲得清楚地瞭解。 貫施例之砰細說明 如第二圖所示，賴叙朗模纟 板30以及至少—個發光：極體= 一個载 30係由一可撓性底層31為基材，一"、，載板 且可撓曲，並且在可撓性心3 性的载板結構 抑以及_ 32，絕緣層 導電声竹μ·认士 「建構在載板30的 鎧^a貫㈣，可挽性底層31係可以由銘、銅、 金屬材料所製成的軟性結制，且該可撓性 底層31之厚度係小於或等於0.2mm。 33卜電層32係可以全面或局部鋪蓋於導熱絕緣層 钟二/、/、有以銅為主的線路321，並且在線路321之間 置，；緣材料所構成的絕緣部322供發光二極體10定 綠％ 極體Μ之導線U則配合接續至導電層32的 電層32與電源導ί路321形成電性連接’使能夠透過導 Ϊ 亥導熱絕緣層33可以為導熱膠或導熱膠片， 可i雔而：撓性底層31與導電層32之結合，而導熱膠更 祷性ί廢^所構成，由導熱絕緣層33構成導電層32與可 =一&曰相結合；據以，整體照明模組即可如第三圖 彎:。^用軟性的載板30配合燈罩、燈架等結構體40 如圖當中的結構體40係為一般俗稱Τ—BAR的 木…、口構體40設有若干用以放置發光元件的容置 7 M331757 槽41，整體照明模組即可順著容置槽41的形狀彎折，使 各發光二極體10得以確實裝配在所對應的容置槽41當 ' 中，而具有較佳的適用性，尤其可以透過載板30的導熱 '絕緣層31將發光二極體10所產生熱源釋放，因此具有較 佳的散熱效能；當然，可以如第四圖所示，進一步在載板 30相對於可撓性底層31下方鋪設一焊料層35,方便整體 照明模組直接黏著在相關照明設備的結構體上。 藉由上述以可撓性底層為基材的載板結構設計，可以 * 利用軟性的載板配合燈罩、燈架等結構體彎折，以及透過 載板的導熱絕緣層將發光二極體所產生熱源釋放，確實提 供一適用性廣以及具有較佳散熱效能的照明模組，爰依法 提呈新型專利之申請。 本創作之技術内容及技術特點巳揭示如上，然而熟悉 本項技術之人士仍可能基於本創作之揭示而作各種不背 離本案創作精神之替換及修飾。因此，本創作之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本創作之 • 替換及修飾，並為以下之申請專利範®所涵蓋。 【圖式簡單說明】 . 第一圖係為一習用照明模組之結構示意圖。 第二圖本創作第一實施例之照明模組結構示意圖。 第三圖本創作之照明模組使用狀態示意圖。 第四圖本創作第二實施例之照明模組結構示意圖。 8 M331757 【主.要元件代表符號說明】 10發光二極體 ' 11導線 - 20軟性電路板 30載板 31可撓性底層 32導電層 321線路 • 322絕緣部 33導熱絕緣層 35焊料層 40結構體 41容置槽M331757 VIII. New Description: 【New Technology Fields】 This is a series of lighting module improvements using LEDs. The design of the carrier module in the lighting module is improved to provide a better Cooling effect, and lighting module that can be bent with structures such as lampshades and lamp holders. _ [Prior Art] A Light Emitting Diode (LED) is a semiconductor component that uses electrons to combine light to emit light in the form of light. Because of its cold light, it has a small size, long life, and power consumption. The advantages of low volume, fast reaction rate and excellent shock resistance are not only used as light-emitting elements of electrical products, but also widely used as lighting elements for lighting devices such as lighting fixtures and information billboards. Therefore, there are many light-emitting diode lighting modules used in the installation of lighting fixtures, information billboards, etc.; similar lighting modules are mainly used in a conductive board with multiple functions as The light-emitting diode of the light-emitting element, and the carrier plate therein is mostly composed of a general RF4 printed circuit board. - Since the general RF-4 printed circuit board is not bendable, the overall illumination and the brightness of the module are low. Therefore, the light-emitting diode 10 is constructed on the flexible circuit board 20 as shown in the first figure. The lighting module mainly utilizes the characteristics that the flexible circuit board 20 can be bent to improve the applicability of the overall lighting module. 5 • M331757 However, the flexible circuit board 20 in the conventional lighting module shown in the first figure does not have any heat dissipation mechanism, and can not cooperate with the release of the heat source generated by the light-emitting diode 10', resulting in the overall lighting module. Overheating of the temperature can even limit the application of the lighting module. [New content] In view of this, this creation is to improve the carrier structure in the lighting module, aiming to provide a lighting module with better heat dissipation performance and bending with structures such as lamps, covers, and lamp holders. group. In order to achieve the above, the overall lighting module is basically composed of a carrier plate and at least one light-emitting diode; wherein the carrier plate is made of a flexible bottom layer and is on the flexible bottom layer. The heat conducting insulating layer and the conductive layer are arranged in sequence, and each light emitting diode is constructed on the conductive layer of the carrier board, and is electrically connected to the power source through the conductive layer; accordingly, the overall lighting module can be combined with the lamp cover and the lamp by using a flexible carrier board. In addition to the better suitability of the structure such as the frame, the overall illumination module can release the heat source generated by the test diode through the thermal conductive layer of the carrier, thereby providing better heat dissipation performance. One of the functions of this creation is that it can be flexed by using a flexible carrier plate to fit a structure such as a lamp cover or a lamp holder, so that it has better applicability. The second effect of this creation is that the heat source generated by the light-emitting diode can be released through the thermal conductive insulating layer of the carrier, so that the heat dissipation effect is better. [Embodiment] 6 M331757 The characteristics of this creation can be clearly understood by referring to the schema of this case. The detailed description of the embodiment is as shown in the second figure, the Lai-Shulang modular plate 30 and at least one of the light-emitting elements: the polar body = one carrier 30 is composed of a flexible bottom layer 31 as a substrate, a ", The carrier plate is flexible and has a flexible carrier structure and _32, and the insulating layer is electrically conductive, and the "layer" is constructed on the carrier 30 (four), the removable bottom layer The 31 series can be softly made of Ming, copper, metal materials, and the thickness of the flexible bottom layer 31 is less than or equal to 0.2 mm. 33 The electrical layer 32 can be fully or partially covered by the thermal insulation layer clock The second/,/, has a copper-based circuit 321 and is disposed between the lines 321; the insulating portion 322 formed of the edge material is used for the light-emitting diode 10 to be green, and the wire U of the pole body is connected to The electrical layer 32 of the conductive layer 32 is electrically connected to the power supply path 321 to enable transmission of the thermal conductive insulating layer 33, which may be a thermal conductive adhesive or a thermal conductive film, and the flexible underlayer 31 and the conductive layer 32 may be In combination, the thermal conductive adhesive is more praying, and the conductive layer 32 is composed of the thermally conductive insulating layer 33 and can be combined with a & According to the above, the overall lighting module can be bent as shown in the third figure: ^ With the flexible carrier 30 to match the structure of the lampshade, the lamp holder, etc. 40, the structure 40 in the figure is generally known as Τ-BAR wood... The mouth structure 40 is provided with a plurality of accommodating 7 M331757 slots 41 for arranging the illuminating elements, and the integral illuminating module can be bent along the shape of the accommodating slots 41, so that the illuminating diodes 10 can be assembled at the same position. The corresponding accommodating groove 41 has a better applicability, and in particular, the heat source generated by the illuminating diode 10 can be released through the heat conducting insulating layer 31 of the carrier 30, thereby having better heat dissipation performance; As shown in the fourth figure, a solder layer 35 may be further disposed on the carrier 30 opposite to the flexible underlayer 31 to facilitate adhesion of the entire lighting module directly to the structure of the associated lighting device. The underlying substrate is designed as a carrier structure for the substrate. The flexible carrier plate can be used to bend the structure such as the lamp cover and the lamp holder, and the heat source generated by the light-emitting diode can be released through the thermal conductive layer of the carrier. Wide applicability and better The thermal performance of the lighting module, the application for new patents in accordance with the law. The technical content and technical characteristics of this creation are disclosed above, but those who are familiar with this technology may still make a variety of creations based on the disclosure of this creation. Therefore, the scope of protection of this creation should not be limited to those disclosed in the examples, but should include all kinds of replacements and modifications that do not depart from the creation, and are covered by the following patents. The first figure is a schematic diagram of the structure of a conventional lighting module. The second figure is a schematic diagram of the structure of the lighting module of the first embodiment. The third figure shows the state of use of the lighting module of the present creation. A schematic diagram of the structure of the lighting module of the second embodiment is created. 8 M331757 [Main. Main component representative symbol description] 10 LEDs '11 wires - 20 flexible circuit board 30 carrier board 31 flexible bottom layer 32 conductive layer 321 lines • 322 insulating portion 33 thermally conductive insulating layer 35 solder layer 40 structure Body 41 receiving slot
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