201037863 ' 六、發明說明： 【發明所屬之技術領蜮】 本發明係關於一種電致發光與發熱之複合模組，特 別是關於一種兼具照明及保暖效果之發光二極體電致 發光與發熱之複合模組。 【先前技術】 隨者照明科技的提升’發光二極體（light emitting O diode，LED)因具有高亮度、高使用壽命與低耗能等優 點而逐漸被大量應用在各種節能燈具之組裝製造上，且 其已逐步取代卤素燈及日光燈等傳統發光照明裝置。一 般來說’發光一極體分為無機發光二極體（即俗稱的 LED)及有機發光一極體（OLED) ’而目前應用在照明燈 具上的大多屬於無機發光二極體。在構造上，無機發光 二極體係由P型及N型半導體化合物所組成，當電子 與電洞於P型及N型半導體化合物的介面相結:時， 因能階差異將會產生各種不同的能量轉箅 象，例如產生光能或熱能。實際上，目前轉的 =1 見 極體的光取出效率並非100%，其係因為部分能量轉變 成熱能的形式而造成能量的損耗。再者，當無機發光二 極體的溫度因受熱而提高時，則會更進一步降低P型及 N型半導體化合物的光取出效率。 為了避免溫度升高影響光取出效率，許多照明燈具 設計增加散熱裝置。例如，中華民國公告第1298554號 201037863 發明專利揭示-種具有高散熱功效之LED I具，其具 有-燈具本體’以供容置數個發光二極體於其中，該燈 具本體之一基座可固定於天花板或牆壁上，且該燈具本 體之基座㈣設有數個容室，各容室裝填有助於導熱及 散熱的高導熱物質。藉此，將各發光二極體發光時所產 生的高溫快迷導出，並發散至燈具周圍靠近天花板（或 牆壁）的空氣中，以消除因過熱造成發光二極體之發光 功率下降，進而影響照明亮度之問題者。在安裝時，該 LED燈具利用該燈具本體之基座固設於室内天花板或 牆壁上，該發光二極體則朝向下方，以發射光線提供照 明效果。惟，該LED燈具係以提供照明功能為主，因 此僅將該發光二極體產生之熱能視為廢熱排除到燈具 四周，並未善加利用。同時，由於熱能集中在該發光二 極體及該燈具本體的基座之間而該基座又貼接於天花 板（或牆壁）’因此熱能往四周自然對流的實際散熱效果 十分有限。 再者’中華民國公告第M348199號新型專利揭示一 種發光二極體照明模組，其主要係於一散熱板上依序設 有一基板、一反射罩及一外蓋，其中該基板上形成有連 接線路，以相互連接數個發光二極體，該反射罩上形成 有數個反射杯，該反射、杯底部可使該基板上各發光二極 體穿出，該外蓋為可透光之蓋體，其利用數個彈性扣夾 適當夾扣於該散熱板上。在安裝時，該發光二極體照明 模組利用該散熱板固設於室内天花板或牆壁上，該發光 5 201037863 極體助向下方，以發射光線提供照明效果。惟，該 X光二極體料模組仍以提供照明功能為主，因此僅將 該發光-極體產生之熱能視為廢熱利用該散熱板排除 到燈具四周’並未善加彻。同時，由於熱能集中在該 發光極體及該散熱板之間而該散熱板又貼接於天花 板(或心壁）’因此熱能往四周自然對流的實際散熱效果 十分有限。 ❸ 另方面，由於上述各種習用發光二極體之照明裝 置普以提供照’能為主，因此必需使用符合正規照明 標準的發光二極體元件，以提供最佳亮度，但此舉不利 於降低燈具零件成本，同時上述習用照明裝置也不能用 來對天花板或牆壁產生特殊的裝飾性照明效果。目前， 業界在生產製造發光二極體期間不可避免的皆會產出 一些不符正規照明標準的發光二極體次級品，其可能具 有較低的光取出效率並會產生較多的廢熱，但卻具有較 © 低的售價，然而目前市面上並沒有出現可利用該些次級 品的照明裝置。 因此’有必要提供一種發光二極體之照明模組，使 其能使用發光二極體次級品，並能妥善利用發光二極體 產生之熱能，藉以解決習知技術所存在的問題。 【發明内容】 本發明之主要目的在於提供一種電致發光與發熱之 複合模組’其係利用支架將燈具本體懸掛於固定表面 6 201037863 上，並使燈具本體之發光侧朝向固定表面，同時將燈具 本體之熱輻射側朝向欲保溫之空間，如此可利用發光侧 之發光二極體提供壁面打光效果及經由熱輻射侧之熱 輻射板提供電熱保暖功能，進而增加燈具之功能性及其 附加價值，並有助於提升散熱效率。 本發明之次要目的在於提供一種電致發光與發熱之 複合模組，其係使用具有較低光取出效率並會產生較多 熱能之發光二極體次級品來提供壁面打光效果及電熱 〇 保暖功能，進而降低複合燈具組裝成本。 本發明之另一目的在於提供一種電致發光與發熱之 複合模組，其係藉由改變發光二極體之半導體化合物的 材料種類或分層結構，來提高發光二極體電能轉換成熱 能的比例，進而提高燈具之電熱保暖效果。 為達上述之目的，本發明提供一種電致發光與發熱 之複合模組，其包含至少一支架、一燈具本體、數個發 ❹ 光二極體元件及一熱輻射板。該支架具有一第一端及一 第二端，該第一端用以固定在一固定表面上，及該第二 端用以結合於該燈具本體。該燈具本體具有一容室、一 發光侧及-熱輻射側，其中該發光购向該固定表面， 該熱輻射側朝向相反^該固定表面之—欲保溫空間。該 令至用以4納4發光二極體元件。該發光二極體元件經 由該燈具本體之發光_向㈣定表面發射光線。該敎 輕射板至㈣置在該燈具本體的熱輻射側，以朝向該欲 保溫空間輻射該發光二極體產生的熱能。 7 201037863 在本發明之一實施例中，該熱輻射板凸設形成至少 一熱輻射鰭片。 在本發明之一實施例中，該燈具本體之發光侧係呈 弧形。 在本發明之一實施例中，該燈具本體之熱輻射侧及 該熱輕射板係呈弧形。 在本發明之一實施例中，該發光二極體元件結合在 該容室内之一印刷電路板或一軟性電路板上。 在本發明之一實施例中， 有一聚光罩。 在本發明之一實施例中， 具有一聚熱罩。 在本發明之一實施例中， 顯示元件。 在本發明之一實施例中， 器面板或一感溫變色油墨。 在本發明之一實施例中， 該燈具本體之發光侧另具 該燈具本體之熱輻射侧另 該熱輻射板另具有一溫度 該溫度顯示元件係一顯示 該發光二極體元件具有P 型半導體化合物及N型半導體化合物，其將電能轉換 成光能與熱能的比例介於70% : 30%至50% : 50%之間。 在本發明之一實施例中，該發光二極體元件之P型 半導體化合物的端面另具有一阻障層或一電洞傳輸 層，以產生熱能。 在本發明之一實施例中，該發光二極體元件之N型 半導體化合物的端面另具有一阻障層或一電子注入 8 201037863 層，以產生熱能。 及N 實施例中，該發光二極體元件在P型 另夾設一電阻層，以產 生熱能。_合物兩者之間 在本發明之 及N 料 型半導體^^ + ^光二極^件在P型 以產生熱能。合物兩者之至少—方摻雜一電阻材 〇 【實施方式】 為了讓本發明之v 明翮異榀 上述及其他目的、特徵、優點能更 圖4 了文將特舉本發明較佳實施例，並配合所附 圖式，作詳細說明如下。 請灸昭笛1201037863 ' VI. Description of the invention: [Technical Profile of the Invention] The present invention relates to a composite module of electroluminescence and heat generation, in particular to a light-emitting diode electroluminescence and heat having both illumination and warmth effects Composite module. [Prior Art] With the improvement of lighting technology, light emitting O diode (LED) has been widely used in the assembly and manufacture of various energy-saving lamps due to its high brightness, high service life and low energy consumption. And it has gradually replaced traditional lighting devices such as halogen lamps and fluorescent lamps. In general, the light-emitting body is divided into an inorganic light-emitting diode (also known as an LED) and an organic light-emitting diode (OLED). Currently, most of the light-emitting diodes are inorganic light-emitting diodes. In terms of structure, the inorganic light-emitting diode system is composed of P-type and N-type semiconductor compounds. When electrons and holes are combined in the interface of P-type and N-type semiconductor compounds, different energy levels will produce different kinds of Energy conversion, such as the production of light or heat. In fact, at present, the light extraction efficiency of the pole =1 is not 100%, which is caused by the partial energy conversion into thermal energy. Further, when the temperature of the inorganic light-emitting diode is increased by heat, the light extraction efficiency of the P-type and N-type semiconductor compounds is further lowered. In order to avoid temperature rise affecting light extraction efficiency, many lighting fixtures are designed to add heat sinks. For example, the Republic of China Announcement No. 1298554 No. 201037863 discloses a LED I tool having a high heat dissipation effect, which has a lamp body for accommodating a plurality of light emitting diodes therein, and a base of the lamp body can be It is fixed on the ceiling or the wall, and the base (4) of the lamp body is provided with a plurality of chambers, and each chamber is filled with a high thermal conductive material which is helpful for heat conduction and heat dissipation. Thereby, the high temperature generated by each of the light-emitting diodes is quickly derived and diffused into the air around the ceiling (or the wall) to eliminate the decrease in the luminous power of the light-emitting diode due to overheating, thereby affecting The problem of lighting brightness. During installation, the LED luminaire is fixed to the indoor ceiling or wall by the base of the luminaire body, and the illuminating diode is directed downward to emit light to provide illumination. However, the LED luminaire is mainly for providing illumination function, so that only the heat generated by the illuminating diode is regarded as waste heat to be excluded from the luminaire, and is not well utilized. At the same time, since the thermal energy is concentrated between the light-emitting diode and the base of the lamp body and the base is attached to the ceiling (or wall), the actual heat dissipation effect of the thermal energy to the surrounding natural convection is very limited. In addition, the new patent of the Republic of China Announcement No. M348199 discloses a light-emitting diode lighting module, which is mainly provided with a substrate, a reflective cover and an outer cover on a heat dissipation plate, wherein the substrate is formed with a connection. a plurality of light-emitting diodes are connected to each other, and a plurality of reflective cups are formed on the reflector. The bottom of the reflector and the bottom of the cup can pass through the light-emitting diodes on the substrate, and the outer cover is a light-permeable cover. It is suitably clipped to the heat sink by using a plurality of elastic clips. During installation, the light-emitting diode lighting module is fixed on the indoor ceiling or wall by using the heat-dissipating plate, and the light body 5 201037863 is assisted downward to emit light to provide illumination. However, the X-ray diode module is still mainly provided for providing illumination function, so that only the heat energy generated by the illuminator-polar body is regarded as waste heat, and the heat-dissipating plate is excluded from the periphery of the lamp. At the same time, since the heat energy is concentrated between the light-emitting body and the heat-dissipating plate and the heat-dissipating plate is attached to the ceiling plate (or the core wall), the actual heat-dissipating effect of the thermal energy to the surrounding natural convection is very limited. ❸ On the other hand, since the illumination devices of the above-mentioned various conventional light-emitting diodes generally provide illumination, it is necessary to use a light-emitting diode component that meets the regular illumination standard to provide optimal brightness, but this is not conducive to lowering The cost of the luminaire parts, and the above-mentioned conventional lighting devices cannot be used to produce special decorative lighting effects on the ceiling or the wall. At present, in the industry during the production of LEDs, it is inevitable that some LED sub-products that do not conform to the formal lighting standards will be produced, which may have lower light extraction efficiency and generate more waste heat, but However, it has a lower price than ©, but there are currently no lighting devices available on the market that can utilize these secondary products. Therefore, it is necessary to provide a lighting module for a light-emitting diode, which enables the use of a light-emitting diode sub-product, and can properly utilize the heat energy generated by the light-emitting diode, thereby solving the problems of the prior art. SUMMARY OF THE INVENTION The main object of the present invention is to provide a composite module of electroluminescence and heat generation, which uses a bracket to suspend a lamp body on a fixed surface 6 201037863 and has a light emitting side of the lamp body facing a fixed surface, and The heat radiating side of the lamp body faces the space to be insulated, so that the light emitting diode on the light emitting side can be used to provide the wall surface lighting effect and the heat radiation layer through the heat radiation side to provide the electric heat warming function, thereby increasing the functionality of the lamp and the additional Value and help improve heat dissipation efficiency. A secondary object of the present invention is to provide a composite module of electroluminescence and heat generation, which uses a light-emitting diode sub-product having lower light extraction efficiency and generating more heat energy to provide wall surface lighting effect and electric heating. 〇 Warmth function, which reduces the cost of assembly of composite lamps. Another object of the present invention is to provide a composite module for electroluminescence and heat generation, which is capable of improving the conversion of light-emitting diodes into heat by changing the material type or layered structure of the semiconductor compound of the light-emitting diode. The ratio, in turn, improves the electric heating effect of the lamp. To achieve the above object, the present invention provides a composite module of electroluminescence and heat generation comprising at least one bracket, a lamp body, a plurality of light emitting diode elements, and a heat radiating plate. The bracket has a first end and a second end. The first end is fixed on a fixing surface, and the second end is coupled to the lamp body. The luminaire body has a chamber, a illuminating side and a heat radiant side, wherein the illuminating light is purchased toward the fixing surface, and the heat radiating side faces the opposite fixing surface. This order is used for 4 nanometer 4 LED components. The light-emitting diode element emits light through a light-emitting surface of the lamp body to a (four) fixed surface. The light-emitting plate to (4) is placed on the heat radiation side of the lamp body to radiate heat generated by the light-emitting diode toward the space to be insulated. 7 201037863 In one embodiment of the invention, the heat radiating plate is convexly formed to form at least one heat radiating fin. In an embodiment of the invention, the illuminating side of the luminaire body is curved. In an embodiment of the invention, the heat radiation side of the lamp body and the heat light plate are curved. In one embodiment of the invention, the light emitting diode component is incorporated into a printed circuit board or a flexible circuit board within the housing. In one embodiment of the invention, there is a concentrating mask. In one embodiment of the invention, there is a heat collecting hood. In an embodiment of the invention, the display element. In one embodiment of the invention, the panel or a thermochromic ink. In an embodiment of the present invention, the light-emitting side of the lamp body has a heat radiation side of the lamp body, and the heat radiation plate further has a temperature. The temperature display element indicates that the light-emitting diode element has a P-type semiconductor. Compounds and N-type semiconductor compounds that convert electrical energy into a ratio of light energy to thermal energy between 70%: 30% to 50%: 50%. In an embodiment of the invention, the end face of the P-type semiconductor compound of the light-emitting diode element further has a barrier layer or a hole transport layer to generate thermal energy. In an embodiment of the invention, the end face of the N-type semiconductor compound of the LED component further has a barrier layer or an electron injection layer 8 201037863 to generate thermal energy. In the N and N embodiments, the light-emitting diode element is further provided with a resistive layer on the P-type to generate thermal energy. In the present invention, the N-type semiconductor ^^ + ^ photodiode is in the P-type to generate thermal energy. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> For example, in conjunction with the drawings, a detailed description will be given below. Please moxibustion flute 1
> “、、乐i圖所示，本發明第一實施例之電致發光 與發熱之複合模組主要包含至少—支架卜—燈具本體 2數個發光一極體元件3及一熱輻射板(heat radiation plate)4。本發明之電致發光與發熱之複合模組係可固定 在一固定表面5上，例如：在本實施例中，該固定表面 5係以室内之天花板為例，該複合模組係用以對該固定 表面5提供壁面打光效果，以及對燈具附近的欲保溫空 間及使用者提供電熱保暖效果。然而，該固定表面5並 不限於此，其亦可能是建築物、車輛或其他交通工具之 天花板、内部牆壁或外部牆壁等’於此合先敘明。 請再參照第1圖所示，本發明第一實施例之支架】 201037863 係~τ選自各種適合用於吊燈之支撲構造，且本發明並不 限制其長度等尺寸。在本實施例中，該支架丨係選自二 條中空桿體，其可取材自熱絕緣材質或導熱材質，例如 塑膠或金屬，但亦不限於此。該支架！具有一第一端 11及一第二端12。在本實施例中，該第一端u較佳係 一基座，其可藉由數個螺絲或鐵釘(未繪示）加以固定在 該固定表面5上，但在其他實施例中，該第一端u亦 ❹ 可能是一樞接座（未繪示），其中該支架11之桿體可枢轉 的結合在該第一端11上；或者，該第一端u亦可能是 $拆座或其他等效固定元件，甚至直接插設固定在該固 疋表面5内。再者，該第二端12較佳係選擇利用螺紋 對接、焊接、螺絲鎖固、倒鉤卡掣或膠黏接合等方式插 設結合於該燈具本體2上，以將該燈具本體2懸掛於該 固定表面5上。另外’該支架Π本身之内部則可供一 電線13穿設通過，以將外部電源導至該燈具本體2内。 ❹ 在另一實施方式中，該支架11本身亦可選自繩體或電 線等可撓性線材。 請再參照第1圖所示，本發明第一實施例之燈具本 體2係選自一中空殼體，其形狀可依實際使用需求或裝 飾设計而加以改變。該燈具本體2較佳取材自熱絕緣材 質或導熱材質，例如塑膠或金屬，但並不限於此。該燈 具本體2具有一容室21、一發光侧22及一熱輻射側 23。該容室21用以容納該發光二極體元件3。該發光 侧22及熱輪射侧23係分別位於該容室21之上下二 201037863 側’其中S譜光側22朝向該固定表面5，該熱輻射侧 23朝向相反於該固定表面5之一欲保溫空間。該發光 侧22通常具有數個安裝孔221或-開口（未標示），以 便使該發光二極體元件3經由該安裝孔221(或開口）而 朝向該固定表面5發射光線，以產生裝飾性的打光照明 效果。該發光侧22亦可選擇料有色或無色之透明蓋 板、擴散板或柔光板(未繪示）等配件，以提供不同的光 〇 、線效果。再者’該熱輻射侧23係指背對該發光側22之 另一#丨面，該熱輻射侧23用以結合該熱輻射板4。 、，请再參照第1及2圖所示，本發明第一實施例之發 光二極體元件3係可選自各種型式之無機發光二極體 (LED) ’本發明並未限制其型式，但為了兼顧照明與電 熱保溫之雙®效果，本發明觀之發光二極體元件3較 佳必需具有適當的光取出效率及必需伴隨產生足夠的 熱能，例如該發光二極體元件3將電能轉換成光 能與熱 ❹ 能的比例可選擇控制介於70%: 30%至50%: 5〇%之間。 在-實施财’本發明之發光二極體元件3可以選自符 合一般正規照明標準的發光二鋪；但亦可選自不符正 規照明標準的發光二極體次級品，其具有較低的光取出 效率並會產生較多的廢熱，但適用於本發明之複合模 組。在另一實施例中，本發明亦可設計發光二極體構 ^使其月b產生所需的光能與熱能比例。例如，如第2 圖所不’該發光二極體元件3通常係由一 p型半導體化 合物31及一 N型半導體化合物％所組成，但本發明 11 201037863 可使該P型半導體化合物31的端面另具有一阻障層或 一電洞傳輸層（未繪示），以產生更多熱能。相似的，亦 可使該N型半導體化合物32的端面另具有一阻障層或 一電子注入層（未繪示），以產生更多熱能。或者，本發 明可另外選擇在P型及N型半導體化合物31、32兩者 之間夾設一電阻層（未繪示），以產生更多熱能。抑或， 在P型及N型半導體化合物31、32兩者之至少一方選 擇摻雜一電阻材料，以產生更多熱能。在選定種類並進 行組裝時，該發光二極體元件3可藉由焊接或插槽等方 式電性連接在一基板30上，在本發明中，該基板30係 選自硬質之印刷電路板。在組裝時，該基板30係容置 在該燈具本體2之容室21中，並電性連接該電線13。 該發光二極體元件3則插設在該安裝孔221内或對位於 該安裝孔221，以便朝向該固定表面5發射光線。 凊再參照第1圖所示，本發明第一實施例之熱輻射 板4係由鋁、銅等導熱金屬或合金材質製成之板體。在 本1明中，該熱輻射板4係可選擇利用螺絲鎖固、倒鉤 2掣、滑槽嵌入、螺紋對接、焊接或膠黏接合等方式結 合在該燈具本體2之熱輻射側23 ±，該結合方式並非 用以限制本發日卜賴_板4至少設置在紐具本體 的熱輕射侧23’但亦可能延伸到該燈具本體2的各個 在某-實施方式中’該熱輻射板4亦可能是至 ς由=燈具本體2之熱輻射侧23直接—再 在本發财，賴㈣板4科表讀佳凸設形成 12 201037863 至 熱輻射鰭片4卜該熱輻射鰭片41係以適當形 狀、長度、寬度及數4排列在該熱輻射板4的外表面， 藉以增加熱交換面積。藉由上述構造，當使用本發明第 實知例之電致發光與發熱之複合模組時，該發光二極 體疋件3經由腿具本體2之發光侧22朝向該固定表 面5發射光線。同時1置在該燈具本體2的熱輻射侧 23之該熱輻射板4 _叫向減於㈣絲面5之 〇 一欲保溫空間(如室内空間)輻射該發光二極體3產生的 熱能。藉此，本發明不但可提供壁面打光效果，更能額 外提供電熱保暖功能，並有助於增加散熱效率 ，進而增 加燈具之功能性及其附加價值。 請參照第3圖所示，本發明第二實施例之電致發光 與發熱之複合模組係相似於本發明第一實施例，但兩者 間差異之特徵在於：該第二實施例之電致發光與發熱之 複合模組進一步選擇性設置數個配件，例如：使該燈具 ◎ 本體2之發光侧22另增設一聚光罩24，以將該發光二 極體元件3發射的光線聚集在該固定表面5的特定區域 中。再者，亦可使該燈具本體2之熱輻射侧23另增設 - 一聚熱罩25，以將該發光二極體元件3產生的熱能經 由該熱輻射板4及聚熱罩25聚集在特定之欲保溫空間 區域中。再者，該熱輻射板4的外表面另可選擇設置一 溫度顯示元件42，其係可選自一顯示器面板或一感溫 變色油墨。當該溫度顯示元件42選自顯示器面板時， 其搭配有溫度仙電路(未繪示），在溫度㈣電路積測 13 201037863 該熱輻射板4之溫度後，即可由顯示器面板顯示出數位 溫度數值，以使燈具下方的使用者得知電熱保暖的即時 溫度。或者，當該溫度顯示元件42選自感溫變色油墨 時，感溫變色油墨可製成溫度計形狀或其他裝飾圖案形 狀，且能隨著該熱輻射板4之溫度改變顏色，以使燈具 下方的使用者得知電熱保暖的即時溫度。 請參照第4圖所示，本發明第三實施例之電致發光 與發熱之複合模組係相似於本發明第一實施例，但兩者 間差異之特徵在於：該第三實施例之電致發光與發熱之 複合模組進一步選擇改變該燈具本體2之形狀，例如： 使該燈具本體2之發光侧22及熱輻射侧23呈弧形，並 使該發光側22之弧長小於該熱輻射侧23之弧長，該熱 輻射板4亦對應呈弧形造形。藉此，本發明可將該發光 二極體元件3發射的光線聚集在該固定表面5的特定區 域中，同時擴大該熱輻射板4所能加熱之欲保溫空間範 圍。為了搭配該燈具本體2之彎弧形狀，該發光二極體 元件3之基板30較佳選自一軟性電路板。在另一實施 例中，亦可使該發光侧22之弧長大於該熱輻射侧23之 弧長（未繪示）’藉此，本發明可擴大該發光二極體元件 3照明該固定表面5的範圍，並將該發光二極體元件3 產生的熱能經由該熱輪射板4聚集在特定之欲保溫空 間區域中。在又一實施例中，亦可使該發光側22呈弧 狀，但使該熱輻射側23呈平板狀；或者，使該發光侧 22呈平板狀，但使該熱輻射側23呈弧狀，其皆為本發 14 201037863 明可能實施之方式。 如上所述’相較於習用發光二極體之照明裝 提供照明魏為主，僅將該發光二極體產生之熱能 廢熱利用該散熱板排除到燈具四周，並未善加 其實際散熱效果十分有限等缺點，第1至4圖之本發明 藉由利用該支架1將該燈具本體2懸掛於該固定表面 5(如天花板或牆壁)上，並使該燈具本體2之發光侧^ 〇 朝向朗定表面5 ’同時將該燈具本體2之熱輻射侧23 及熱輪射板4朝向欲保溫之空間，如此可彻該發光侧 22之發光一極體3提供壁面打光效果及經由該熱輻射 側23之熱輻射板4提供電熱保暖功能，進而增加燈具 之功能性及其附加價值，並有助於提升散熱效率。再 者’本發明之發光二極體元件3不但可選自符合一般正 ^照明標準的發光二極體，更可選自發光二極體次級 品，其雖具有較低光取出效率並會產生較多熱能，但適 〇 用於提供㈣打光效果及電減暖魏，進而降低複合 燈具組裝成本。另外，本發明亦可藉由改變該發光二極 體元件3之P型、N型半導體化合物3卜32的材料種 類或分層結構’來提高該發光二極體元件3之電能轉換 成熱能的比例，進而有效提高燈具之·保暖效果。、 雖然本發明已以較佳實施例揭s，然其並非用以限 制本發明，任何熟習此項技藝之人士，在不脫離本發明 之精神和範圍内，當可作各種更動與修飾，因此本發明 之保護範圍當視後附之申請專利範圍所界定者為準。 15 201037863 【圖式簡單說明】 第1圖：本發明第一實施例之電致發光與發熱之複合模 組之組合剖視圖。 第2圖：本發明第一實施例之發光二極體元件之結構示 意圖。 第3圖：本發明第二實施例之電致發光與發熱之複合模 組之組合剖視圖。 第4圖：本發明第三實施例之電致發光與發熱之複合模 組之組合剖視圖。 【主要元件符號說明】 1 支架 11 第一端 12 第二端 13 電線 2 燈具丰體 21 容室 22 發光側 221 安裝孔 23 熱輻射侧 24 聚光罩 25 聚熱罩 3 發光二極體元件 30 基板 31 P型半導體化合物 32 N型半導體化合物 4 熱輻射板 41 熱輻射鰭片 42 溫度顯示元件 5 固定表面 16<>, as shown in the figure, the composite module of electroluminescence and heat generation according to the first embodiment of the present invention mainly comprises at least a bracket-a lamp body 2, a plurality of light-emitting body elements 3 and a heat radiation plate. (heat radiation plate) 4. The electroluminescent and heat-generating composite module of the present invention can be fixed on a fixing surface 5, for example, in the embodiment, the fixing surface 5 is exemplified by an indoor ceiling. The composite module is used to provide a wall surface lighting effect on the fixing surface 5, and to provide an electric heating warming effect to the space to be insulated and the user in the vicinity of the lamp. However, the fixing surface 5 is not limited thereto, and may also be a building. The ceiling of the vehicle or other vehicle, the inner wall or the outer wall, etc. will be described in the following. Please refer to Fig. 1 again, the bracket of the first embodiment of the present invention] 201037863 series ~τ is selected from various suitable The structure of the chandelier is not limited to the length and the like. In the embodiment, the bracket is selected from two hollow rods, and the material can be self-heat insulating material or heat conductive material, such as plastic. Metal, but not limited to this. The bracket has a first end 11 and a second end 12. In the embodiment, the first end u is preferably a base, which can be replaced by a plurality of screws or A pin (not shown) is attached to the fixing surface 5, but in other embodiments, the first end u may also be a pivoting seat (not shown), wherein the body of the bracket 11 can be The pivoting joint is on the first end 11; alternatively, the first end u may also be a detachable seat or other equivalent fixing element, or even directly inserted and fixed in the fixed surface 5. Further, the first Preferably, the two ends 12 are selectively inserted into the lamp body 2 by means of thread butt joints, welding, screw locking, barb snapping or adhesive bonding to suspend the lamp body 2 on the fixing surface 5 . In addition, the inside of the bracket itself can be passed through a wire 13 to guide the external power source into the lamp body 2. 另一 In another embodiment, the bracket 11 itself can also be selected from a rope or A flexible wire such as a wire. Referring to FIG. 1 again, the lamp body 2 of the first embodiment of the present invention It is selected from a hollow casing, and its shape may be changed according to actual use requirements or decorative design. The lamp body 2 is preferably made of a heat insulating material or a heat conductive material such as plastic or metal, but is not limited thereto. The luminaire body 2 has a chamber 21, a illuminating side 22 and a heat radiating side 23. The chamber 21 is for accommodating the illuminating diode element 3. The illuminating side 22 and the hot side 23 are respectively located Above the chamber 21, 201037863 side 'where the S-spectrum side 22 faces the fixed surface 5, the heat radiating side 23 faces a space opposite to the fixed surface 5 to be insulated. The light-emitting side 22 usually has a plurality of mounting holes 221 or An opening (not shown) for causing the light-emitting diode element 3 to emit light toward the fixed surface 5 via the mounting hole 221 (or opening) to produce a decorative lighting effect. The light-emitting side 22 can also be selected from colored or colorless transparent cover plates, diffusers or flexible plates (not shown) to provide different light and line effects. Further, the heat radiation side 23 is referred to as the other side of the light-emitting side 22, and the heat radiation side 23 is used to bond the heat radiation plate 4. Further, as shown in FIGS. 1 and 2, the light-emitting diode element 3 of the first embodiment of the present invention may be selected from various types of inorganic light-emitting diodes (LEDs). The present invention does not limit its type. However, in order to balance the effects of illumination and electrothermal insulation, the LED component 3 of the present invention preferably has appropriate light extraction efficiency and must be accompanied by sufficient thermal energy, for example, the LED component 3 converts electrical energy. The ratio of light energy to heat energy can be selected to be between 70%: 30% to 50%: 5%. The light-emitting diode element 3 of the present invention may be selected from a light-emitting two-layer that conforms to the general formal lighting standard; but may also be selected from a light-emitting diode sub-product that does not conform to the regular lighting standard, and has a lower The light extraction efficiency generates more waste heat, but is suitable for the composite module of the present invention. In another embodiment, the present invention can also design a light-emitting diode structure such that the ratio of light energy to thermal energy required for month b is produced. For example, as shown in Fig. 2, the light-emitting diode element 3 is usually composed of a p-type semiconductor compound 31 and an N-type semiconductor compound%, but the invention 11 11037863 can make the end face of the P-type semiconductor compound 31 There is also a barrier layer or a hole transport layer (not shown) to generate more heat. Similarly, the end face of the N-type semiconductor compound 32 may have a barrier layer or an electron injection layer (not shown) to generate more heat energy. Alternatively, the present invention may alternatively provide a resistive layer (not shown) between the P-type and N-type semiconductor compounds 31, 32 to generate more thermal energy. Alternatively, at least one of the P-type and N-type semiconductor compounds 31, 32 is selectively doped with a resistive material to generate more thermal energy. When the type is selected and assembled, the LED component 3 can be electrically connected to a substrate 30 by soldering or socket. In the present invention, the substrate 30 is selected from a rigid printed circuit board. The substrate 30 is received in the chamber 21 of the lamp body 2 and electrically connected to the wire 13. The LED component 3 is inserted into the mounting hole 221 or opposite to the mounting hole 221 to emit light toward the fixing surface 5. Further, referring to Fig. 1, the heat radiating plate 4 of the first embodiment of the present invention is a plate made of a heat conductive metal such as aluminum or copper or an alloy material. In the present invention, the heat radiating plate 4 can be selectively combined with the heat radiation side of the lamp body 2 by means of screw locking, barb 2, chute insertion, thread butt welding, welding or adhesive bonding. The combination is not intended to limit the present invention to at least the thermal light side 23' of the harness body but may also extend to each of the luminaire bodies 2 in a certain embodiment. The plate 4 may also be directly from the heat radiation side 23 of the lamp body 2 - again in the present wealth, the Lai (four) board 4 table read good convex formation 12 201037863 to the heat radiation fin 4 the heat radiation fin The 41 series is arranged on the outer surface of the heat radiating plate 4 in an appropriate shape, length, width, and number 4, thereby increasing the heat exchange area. With the above configuration, when the composite module of electroluminescence and heat generation according to the first embodiment of the present invention is used, the light-emitting diode element 3 emits light toward the fixed surface 5 via the light-emitting side 22 of the leg body 2. At the same time, the heat radiating plate 4 disposed on the heat radiating side 23 of the lamp body 2 is heated to reduce the heat generated by the light emitting diode 3 from the space to be cooled (e.g., the indoor space). Thereby, the invention not only provides the wall surface lighting effect, but also provides the electric heating function additionally, and helps to increase the heat dissipation efficiency, thereby increasing the functionality of the lamp and its added value. Referring to FIG. 3, the electroluminescent and heat-generating composite module of the second embodiment of the present invention is similar to the first embodiment of the present invention, but the difference between the two is characterized by: the second embodiment The composite module for illuminating and heating further selectively sets a plurality of accessories, for example, adding a concentrating cover 24 to the illuminating side 22 of the luminaire ◎ to collect the light emitted by the illuminating diode element 3 The fixed surface 5 is in a specific area. Furthermore, the heat radiation side 23 of the lamp body 2 may be additionally provided with a heat collecting cover 25 to collect the heat energy generated by the light emitting diode element 3 via the heat radiation plate 4 and the heat collecting cover 25 at a specific It is intended to keep warm in the space area. Furthermore, the outer surface of the heat radiating plate 4 may alternatively be provided with a temperature display element 42, which may be selected from a display panel or a thermochromic ink. When the temperature display element 42 is selected from the display panel, it is equipped with a temperature circuit (not shown), and after the temperature (4) circuit integrates the temperature of the heat radiation plate 4, the display panel can display the digital temperature value. In order to let the user under the lamp know the instantaneous temperature of the electric heating. Alternatively, when the temperature display element 42 is selected from a thermochromic ink, the thermochromic ink can be formed into a thermometer shape or other decorative pattern shape, and can change color with the temperature of the heat radiation plate 4 to make the underside of the lamp The user knows the instantaneous temperature of the electric heating. Referring to FIG. 4, the composite module of electroluminescence and heat generation according to the third embodiment of the present invention is similar to the first embodiment of the present invention, but the difference between the two is characterized by: the electricity of the third embodiment The illuminating and heating composite module further selects to change the shape of the illuminating body 2, for example, the illuminating side 22 and the heat radiating side 23 of the illuminating body 2 are curved, and the arc length of the illuminating side 22 is smaller than the heat. The arc of the radiation side 23 is long, and the heat radiating plate 4 is also shaped in an arc shape. Thereby, the present invention can concentrate the light emitted from the light-emitting diode element 3 in a specific region of the fixed surface 5 while enlarging the space to be insulated which the heat radiating plate 4 can heat. In order to match the curved shape of the lamp body 2, the substrate 30 of the LED component 3 is preferably selected from a flexible circuit board. In another embodiment, the arc length of the light-emitting side 22 may be greater than the arc length of the heat radiation side 23 (not shown). Thus, the present invention may expand the light-emitting diode element 3 to illuminate the fixed surface. The range of 5, and the heat energy generated by the light-emitting diode element 3 is collected in the specific space to be insulated via the heat wheel plate 4. In still another embodiment, the light-emitting side 22 may be curved, but the heat radiation side 23 may have a flat shape; or the light-emitting side 22 may have a flat shape, but the heat radiation side 23 may be curved. , which are all ways in which this is a possible implementation of 14 201037863. As described above, the illumination is mainly provided by the lighting device of the conventional light-emitting diode, and only the heat energy generated by the light-emitting diode is excluded from the lamp by using the heat-dissipating plate, and the actual heat-dissipating effect is not well added. The invention of FIGS. 1 to 4 hangs the lamp body 2 on the fixing surface 5 (such as a ceiling or a wall) by using the bracket 1 and causes the light-emitting side of the lamp body 2 to face The fixed surface 5' simultaneously faces the heat radiation side 23 of the lamp body 2 and the heat wheel plate 4 toward the space to be insulated, so that the light-emitting body 3 of the light-emitting side 22 can provide a wall-lighting effect and via the heat radiation. The heat radiant panel 4 on the side 23 provides an electric heating function, thereby increasing the functionality of the luminaire and its added value, and contributing to the improvement of heat dissipation efficiency. Furthermore, the light-emitting diode element 3 of the present invention can be selected not only from a light-emitting diode that conforms to the general illumination standard, but also from a light-emitting diode secondary product, which has a lower light extraction efficiency and will More heat is generated, but it is suitable for providing (4) lighting effect and electric heating, thereby reducing the assembly cost of composite lamps. In addition, the present invention can also improve the conversion of the electrical energy of the LED component 3 into thermal energy by changing the material type or layered structure of the P-type, N-type semiconductor compound 3b 32 of the LED component 3. The ratio, in turn, effectively improves the warmth of the lamp. The present invention has been described in its preferred embodiments, and it is not intended to limit the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. 15 201037863 [Simplified description of the drawings] Fig. 1 is a sectional view showing a combination of a composite electromotive and heat-generating module according to the first embodiment of the present invention. Fig. 2 is a view showing the structure of a light-emitting diode element according to a first embodiment of the present invention. Fig. 3 is a sectional view showing the combination of an electroluminescence and heat generation composite mold according to a second embodiment of the present invention. Fig. 4 is a sectional view showing the combination of the electroluminescence and heat generation composite molds of the third embodiment of the present invention. [Main component symbol description] 1 Bracket 11 First end 12 Second end 13 Wire 2 Luminaire 21 Housing 22 Light-emitting side 221 Mounting hole 23 Thermal radiation side 24 Condenser 25 Heat collecting cover 3 Light-emitting diode element 30 Substrate 31 P-type semiconductor compound 32 N-type semiconductor compound 4 Thermal radiation plate 41 Thermal radiation fin 42 Temperature display element 5 Fixed surface 16