TWI392119B - Electroluminescent and thermoelectric composite module - Google Patents
Electroluminescent and thermoelectric composite module Download PDFInfo
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- TWI392119B TWI392119B TW098112401A TW98112401A TWI392119B TW I392119 B TWI392119 B TW I392119B TW 098112401 A TW098112401 A TW 098112401A TW 98112401 A TW98112401 A TW 98112401A TW I392119 B TWI392119 B TW I392119B
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本發明係關於一種電致發光與發熱之複合模組,特別是關於一種兼具照明及保暖效果之發光二極體電致發光與發熱之複合模組。The invention relates to a composite module of electroluminescence and heat generation, in particular to a composite module of a light-emitting diode electroluminescence and heat generation having both illumination and warmth effects.
隨著照明科技的提升,發光二極體(light emitting diode,LED)因具有高亮度、高使用壽命與低耗能等優點而逐漸被大量應用在各種節能燈具之組裝製造上,且其已逐步取代鹵素燈及日光燈等傳統發光照明裝置。一般來說,發光二極體分為無機發光二極體(即俗稱的LED)及有機發光二極體(OLED),而目前應用在照明燈具上的大多屬於無機發光二極體。在構造上,無機發光二極體係由P型及N型半導體化合物所組成,當電子與電洞於P型及N型半導體化合物的介面相結合時,因能階差異將會產生各種不同的能量轉移等物理現象,例如產生光能或熱能。實際上,目前的無機發光二極體的光取出效率並非100%,其係因為部分能量轉變成熱能的形式而造成能量的損耗。再者,當無機發光二極體的溫度因受熱而提高時,則會更進一步降低P型及N型半導體化合物的光取出效率。With the improvement of lighting technology, light emitting diodes (LEDs) have been widely used in the assembly and manufacture of various energy-saving lamps due to their high brightness, high service life and low energy consumption, and they have gradually It replaces traditional lighting fixtures such as halogen lamps and fluorescent lamps. In general, the light-emitting diodes are classified into inorganic light-emitting diodes (also known as LEDs) and organic light-emitting diodes (OLEDs), and most of the current applications in lighting fixtures belong to inorganic light-emitting diodes. Structurally, the inorganic light-emitting diode system is composed of P-type and N-type semiconductor compounds. When electrons and holes are combined in the interface of P-type and N-type semiconductor compounds, different energy levels will be generated due to energy level differences. Physical phenomena such as transfer, such as the generation of light or heat. In fact, the light extraction efficiency of current inorganic light-emitting diodes is not 100%, which is caused by the partial energy conversion into thermal energy. Further, when the temperature of the inorganic light-emitting diode is increased by heat, the light extraction efficiency of the P-type and N-type semiconductor compounds is further lowered.
為了避免溫度升高影響光取出效率,許多照明燈具設計增加散熱裝置。例如,中華民國公告第I298554號發明專利揭示一種具有高散熱功效之LED燈具,其具有一燈具本體,以供容置數個發光二極體於其中,該燈具本體之一基座可固定於天花板或牆壁上,且該燈具本體之基座內部設有數個容室,各容室裝填有助於導熱及散熱的高導熱物質。藉此,將各發光二極體發光時所產生的高溫快速導出,並發散至燈具周圍靠近天花板(或牆壁)的空氣中,以消除因過熱造成發光二極體之發光功率下降,進而影響照明亮度之問題者。在安裝時,該LED燈具利用該燈具本體之基座固設於室內天花板或牆壁上,該發光二極體則朝向下方,以發射光線提供照明效果。惟,該LED燈具係以提供照明功能為主,因此僅將該發光二極體產生之熱能視為廢熱排除到燈具四周,並未善加利用。同時,由於熱能集中在該發光二極體及該燈具本體的基座之間而該基座又貼接於天花板(或牆壁),因此熱能往四周自然對流的實際散熱效果十分有限。In order to avoid temperature rise affecting light extraction efficiency, many lighting fixtures are designed to add heat sinks. For example, the invention patent of the Republic of China Publication No. I298554 discloses an LED lamp having a high heat dissipation effect, which has a lamp body for accommodating a plurality of light-emitting diodes therein, and a base of the lamp body can be fixed to the ceiling Or a wall, and the base of the lamp body is provided with a plurality of chambers, and each chamber is filled with a high thermal conductive material which is helpful for heat conduction and heat dissipation. Thereby, the high temperature generated when each of the light-emitting diodes emits light is quickly led out and diffused into the air around the ceiling (or the wall) of the lamp to eliminate the decrease of the light-emitting power of the light-emitting diode due to overheating, thereby affecting the illumination. The problem of brightness. During installation, the LED luminaire is fixed to the indoor ceiling or wall by the base of the luminaire body, and the illuminating diode is directed downward to emit light to provide illumination. However, the LED lamp is mainly for providing illumination function, so that only the heat energy generated by the light-emitting diode is regarded as waste heat to be excluded from the lamp, and is not utilized well. At the same time, since the thermal energy is concentrated between the light-emitting diode and the base of the lamp body and the base is attached to the ceiling (or the wall), the actual heat dissipation effect of the natural energy convection around the heat is very limited.
再者,中華民國公告第M348199號新型專利揭示一種發光二極體照明模組,其主要係於一散熱板上依序設有一基板、一反射罩及一外蓋,其中該基板上形成有連接線路,以相互連接數個發光二極體,該反射罩上形成有數個反射杯,該反射杯底部可使該基板上各發光二極體穿出,該外蓋為可透光之蓋體,其利用數個彈性扣夾適當夾扣於該散熱板上。在安裝時,該發光二極體照明模組利用該散熱板固設於室內天花板或牆壁上,該發光二極體則朝向下方,以發射光線提供照明效果。惟,該發光二極體照明模組仍以提供照明功能為主,因此僅將該發光二極體產生之熱能視為廢熱利用該散熱板排除到燈具四周,並未善加利用。同時,由於熱能集中在該發光二極體及該散熱板之間而該散熱板又貼接於天花板(或牆壁),因此熱能往四周自然對流的實際散熱效果十分有限。Furthermore, the new patent of the Republic of China No. M348199 discloses a light-emitting diode lighting module, which is mainly provided with a substrate, a reflective cover and an outer cover on a heat dissipation plate, wherein the substrate is formed with a connection. a plurality of light-emitting diodes are connected to each other, and a plurality of reflective cups are formed on the reflective cover. The bottom of the reflective cups can pass through the light-emitting diodes on the substrate, and the outer cover is a light-permeable cover. It is suitably clipped to the heat sink by using a plurality of elastic clips. During installation, the light-emitting diode lighting module is fixed on the indoor ceiling or wall by using the heat-dissipating plate, and the light-emitting diode is directed downward to emit light to provide illumination. However, the light-emitting diode lighting module still mainly provides illumination function, so only the heat energy generated by the light-emitting diode is regarded as waste heat, and the heat-dissipating plate is excluded from the periphery of the lamp, and is not utilized well. At the same time, since the thermal energy is concentrated between the light-emitting diode and the heat dissipation plate and the heat dissipation plate is attached to the ceiling (or the wall), the actual heat dissipation effect of the thermal energy to the surrounding natural convection is very limited.
另一方面,由於上述各種習用發光二極體之照明裝置皆以提供照明功能為主,因此必需使用符合正規照明標準的發光二極體元件,以提供最佳亮度,但此舉不利於降低燈具零件成本,同時上述習用照明裝置也不能用來對天花板或牆壁產生特殊的裝飾性照明效果。目前,業界在生產製造發光二極體期間不可避免的皆會產出一些不符正規照明標準的發光二極體次級品,其可能具有較低的光取出效率並會產生較多的廢熱,但卻具有較低的售價,然而目前市面上並沒有出現可利用該些次級品的照明裝置。On the other hand, since the lighting devices of the above various conventional light-emitting diodes mainly provide illumination functions, it is necessary to use the light-emitting diode components that meet the regular lighting standards to provide optimal brightness, but this is not conducive to reducing the lamps. The cost of parts, while the above-mentioned conventional lighting devices can not be used to produce special decorative lighting effects on the ceiling or wall. At present, the industry inevitably produces some LED dipoles that do not conform to the formal lighting standards during the production of LEDs, which may have lower light extraction efficiency and generate more waste heat, but However, it has a lower selling price, but there are currently no lighting devices available on the market that can utilize these secondary products.
因此,有必要提供一種發光二極體之照明模組,使其能使用發光二極體次級品,並能妥善利用發光二極體產生之熱能,藉以解決習知技術所存在的問題。Therefore, it is necessary to provide a lighting module for a light-emitting diode, which enables the use of a light-emitting diode sub-product, and can properly utilize the heat energy generated by the light-emitting diode, thereby solving the problems of the prior art.
本發明之主要目的在於提供一種電致發光與發熱之複合模組,其係利用支架將燈具本體懸掛於固定表面上,並使燈具本體之發光側朝向固定表面,同時將燈具本體之熱輻射側朝向欲保溫之空間,如此可利用發光側之發光二極體提供壁面打光效果及經由熱輻射側之熱輻射板提供電熱保暖功能,進而增加燈具之功能性及其附加價值,並有助於提升散熱效率。The main object of the present invention is to provide a composite module for electroluminescence and heat generation, which uses a bracket to suspend the lamp body on a fixed surface, and the light emitting side of the lamp body faces the fixed surface, and simultaneously radiates the heat radiation side of the lamp body. Facing the space to be insulated, the light-emitting diode on the light-emitting side can be used to provide a wall-lighting effect and the heat-radiating function through the heat-radiating side of the heat-radiating side, thereby increasing the functionality of the lamp and its added value, and contributing to Improve heat dissipation efficiency.
本發明之次要目的在於提供一種電致發光與發熱之複合模組,其係使用具有較低光取出效率並會產生較多熱能之發光二極體次級品來提供壁面打光效果及電熱保暖功能,進而降低複合燈具組裝成本。A secondary object of the present invention is to provide a composite module of electroluminescence and heat generation, which uses a light-emitting diode sub-product having lower light extraction efficiency and generating more heat energy to provide wall surface lighting effect and electric heating. Warmth function, which reduces the cost of assembly of composite lamps.
本發明之另一目的在於提供一種電致發光與發熱之複合模組,其係藉由改變發光二極體之半導體化合物的材料種類或分層結構,來提高發光二極體電能轉換成熱能的比例,進而提高燈具之電熱保暖效果。Another object of the present invention is to provide a composite module for electroluminescence and heat generation, which is capable of improving the conversion of light-emitting diodes into heat by changing the material type or layered structure of the semiconductor compound of the light-emitting diode. The ratio, in turn, improves the electric heating effect of the lamp.
為達上述之目的,本發明提供一種電致發光與發熱之複合模組,其包含至少一支架、一燈具本體、數個發光二極體元件及一熱輻射板。該支架具有一第一端及一第二端,該第一端用以固定在一固定表面上,及該第二端用以結合於該燈具本體。該燈具本體具有一容室、一發光側及一熱輻射側,其中該發光側朝向該固定表面,該熱輻射側朝向相反於該固定表面之一欲保溫空間。該容室用以容納該發光二極體元件。該發光二極體元件經由該燈具本體之發光側朝向該固定表面發射光線。該熱輻射板至少設置在該燈具本體的熱輻射側,以朝向該欲保溫空間輻射該發光二極體產生的熱能。To achieve the above objective, the present invention provides a composite module of electroluminescence and heat generation, comprising at least one bracket, a lamp body, a plurality of light emitting diode elements, and a heat radiating plate. The bracket has a first end and a second end. The first end is fixed on a fixing surface, and the second end is coupled to the lamp body. The luminaire body has a chamber, a illuminating side and a heat radiating side, wherein the illuminating side faces the fixing surface, and the heat radiating side faces a space opposite to one of the fixing surfaces. The chamber is for accommodating the light emitting diode element. The light emitting diode element emits light toward the fixed surface via a light emitting side of the lamp body. The heat radiation plate is disposed at least on a heat radiation side of the lamp body to radiate heat energy generated by the light emitting diode toward the space to be insulated.
在本發明之一實施例中,該熱輻射板凸設形成至少一熱輻射鰭片。In an embodiment of the invention, the heat radiation plate is convexly formed to form at least one heat radiation fin.
在本發明之一實施例中,該燈具本體之發光側係呈弧形。In an embodiment of the invention, the light emitting side of the lamp body is curved.
在本發明之一實施例中,該燈具本體之熱輻射側及該熱輻射板係呈弧形。In an embodiment of the invention, the heat radiation side of the lamp body and the heat radiation plate are curved.
在本發明之一實施例中,該發光二極體元件結合在該容室內之一印刷電路板或一軟性電路板上。In one embodiment of the invention, the light emitting diode component is incorporated into a printed circuit board or a flexible circuit board within the housing.
在本發明之一實施例中,該燈具本體之發光側另具有一聚光罩。In an embodiment of the invention, the illuminating side of the luminaire body further has a concentrating cover.
在本發明之一實施例中,該燈具本體之熱輻射側另具有一聚熱罩。In an embodiment of the invention, the heat radiating side of the lamp body further has a heat collecting cover.
在本發明之一實施例中,該熱輻射板另具有一溫度顯示元件。In an embodiment of the invention, the heat radiating plate further has a temperature display element.
在本發明之一實施例中,該溫度顯示元件係一顯示器面板或一感溫變色油墨。In an embodiment of the invention, the temperature display element is a display panel or a thermochromic ink.
在本發明之一實施例中,該發光二極體元件具有P型半導體化合物及N型半導體化合物,其將電能轉換成光能與熱能的比例介於70%:30%至50%:50%之間。In an embodiment of the invention, the LED component has a P-type semiconductor compound and an N-type semiconductor compound, and converts electrical energy into a ratio of light energy to thermal energy of 70%: 30% to 50%: 50%. between.
在本發明之一實施例中,該發光二極體元件之P型半導體化合物的端面另具有一阻障層或一電洞傳輸層,以產生熱能。In an embodiment of the invention, the end face of the P-type semiconductor compound of the light-emitting diode element further has a barrier layer or a hole transport layer to generate thermal energy.
在本發明之一實施例中,該發光二極體元件之N型半導體化合物的端面另具有一阻障層或一電子注入層,以產生熱能,In an embodiment of the present invention, the end face of the N-type semiconductor compound of the LED component further has a barrier layer or an electron injection layer to generate thermal energy.
在本發明之一實施例中,該發光二極體元件在P型及N型半導體化合物兩者之間另夾設一電阻層,以產生熱能。In an embodiment of the invention, the light emitting diode element is additionally provided with a resistive layer between the P-type and N-type semiconductor compounds to generate thermal energy.
在本發明之一實施例中,該發光二極體元件在P型及N型半導體化合物兩者之至少一方摻雜一電阻材料,以產生熱能。In one embodiment of the invention, the light emitting diode device is doped with a resistive material on at least one of the P-type and N-type semiconductor compounds to generate thermal energy.
為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本發明較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
請參照第1圖所示,本發明第一實施例之電致發光與發熱之複合模組主要包含至少一支架1、一燈具本體2、數個發光二極體元件3及一熱輻射板(heat radiation plate)4。本發明之電致發光與發熱之複合模組係可固定在一固定表面5上,例如:在本實施例中,該固定表面5係以室內之天花板為例,該複合模組係用以對該固定表面5提供壁面打光效果,以及對燈具附近的欲保溫空間及使用者提供電熱保暖效果。然而,該固定表面5並不限於此,其亦可能是建築物、車輛或其他交通工具之天花板、內部牆壁或外部牆壁等,於此合先敘明。Referring to FIG. 1 , the composite module of electroluminescence and heat generation according to the first embodiment of the present invention mainly comprises at least one bracket 1 , a lamp body 2 , a plurality of light emitting diode elements 3 , and a heat radiation plate ( Heat radiation plate)4. The electroluminescent and heat-generating composite module of the present invention can be fixed on a fixed surface 5, for example, in the embodiment, the fixed surface 5 is exemplified by an indoor ceiling, and the composite module is used for The fixing surface 5 provides a wall surface lighting effect, and provides an electric heating warming effect to the space to be insulated and the user in the vicinity of the lamp. However, the fixed surface 5 is not limited thereto, and may also be a ceiling of a building, a vehicle or other vehicle, an inner wall or an outer wall, etc., which will be described first.
請再參照第1圖所示,本發明第一實施例之支架1係可選自各種適合用於吊燈之支撐構造,且本發明並不限制其長度等尺寸。在本實施例中,該支架1係選自二條中空桿體,其可取材自熱絕緣材質或導熱材質,例如塑膠或金屬,但亦不限於此。該支架1具有一第一端11及一第二端12。在本實施例中,該第一端11較佳係一基座,其可藉由數個螺絲或鐵釘(未繪示)加以固定在該固定表面5上,但在其他實施例中,該第一端11亦可能是一樞接座(未繪示),其中該支架11之桿體可樞轉的結合在該第一端11上;或者,該第一端11亦可能是快拆座或其他等效固定元件,甚至直接插設固定在該固定表面5內。再者,該第二端12較佳係選擇利用螺紋對接、焊接、螺絲鎖固、倒鉤卡掣或膠黏接合等方式插設結合於該燈具本體2上,以將該燈具本體2懸掛於該固定表面5上。另外,該支架11本身之內部則可供一電線13穿設通過,以將外部電源導至該燈具本體2內。在另一實施方式中,該支架11本身亦可選自繩體或電線等可撓性線材。Referring to FIG. 1 again, the stent 1 of the first embodiment of the present invention can be selected from various support structures suitable for use in a chandelier, and the present invention is not limited to the length and the like. In this embodiment, the bracket 1 is selected from two hollow rods, which may be made of a thermal insulating material or a heat conductive material such as plastic or metal, but is not limited thereto. The bracket 1 has a first end 11 and a second end 12. In this embodiment, the first end 11 is preferably a base, which can be fixed on the fixing surface 5 by a plurality of screws or nails (not shown), but in other embodiments, The first end 11 may also be a pivoting seat (not shown), wherein the rod of the bracket 11 is pivotally coupled to the first end 11; alternatively, the first end 11 may also be a quick release seat. Or other equivalent fixing elements, even directly inserted into the fixing surface 5. Furthermore, the second end 12 is preferably inserted into the lamp body 2 by means of thread butt jointing, welding, screw locking, barb snapping or adhesive bonding to suspend the lamp body 2 from The fixing surface 5 is on. In addition, the inside of the bracket 11 itself is allowed to pass through a wire 13 to guide an external power source into the lamp body 2. In another embodiment, the bracket 11 itself may also be selected from a flexible wire such as a rope or a wire.
請再參照第1圖所示,本發明第一實施例之燈具本體2係選自一中空殼體,其形狀可依實際使用需求或裝飾設計而加以改變。該燈具本體2較佳取材自熱絕緣材質或導熱材質,例如塑膠或金屬,但並不限於此。該燈具本體2具有一容室21、一發光側22及一熱輻射側23。該容室21用以容納該發光二極體元件3。該發光側22及熱輻射側23係分別位於該容室21之上下二側,其中該發光側22朝向該固定表面5,該熱輻射側23朝向相反於該固定表面5之一欲保溫空間。該發光側22通常具有數個安裝孔221或一開口(未標示),以便使該發光二極體元件3經由該安裝孔221(或開口)而朝向該固定表面5發射光線,以產生裝飾性的打光照明效果。該發光側22亦可選擇裝設有色或無色之透明蓋板、擴散板或柔光板(未繪示)等配件,以提供不同的光線效果。再者,該熱輻射側23係指背對該發光側22之另一側面,該熱輻射側23用以結合該熱輻射板4。Referring to FIG. 1 again, the lamp body 2 of the first embodiment of the present invention is selected from a hollow casing, and its shape can be changed according to actual use requirements or decorative design. The lamp body 2 is preferably made of a thermal insulating material or a heat conductive material such as plastic or metal, but is not limited thereto. The lamp body 2 has a chamber 21, a light emitting side 22 and a heat radiating side 23. The chamber 21 is for accommodating the LED component 3. The light-emitting side 22 and the heat-radiating side 23 are respectively located on the lower two sides of the chamber 21, wherein the light-emitting side 22 faces the fixed surface 5, and the heat-radiating side 23 faces a space opposite to the fixed surface 5 to be insulated. The light-emitting side 22 usually has a plurality of mounting holes 221 or an opening (not labeled) for causing the light-emitting diode element 3 to emit light toward the fixing surface 5 via the mounting hole 221 (or opening) to produce decorative Lighting effect. The light-emitting side 22 may also be provided with a transparent or colorless transparent cover plate, a diffusion plate or a flexible plate (not shown) to provide different light effects. Furthermore, the heat radiation side 23 refers to the other side facing away from the light-emitting side 22, and the heat radiation side 23 is used to bond the heat radiation plate 4.
請再參照第1及2圖所示,本發明第一實施例之發光二極體元件3係可選自各種型式之無機發光二極體(LED),本發明並未限制其型式,但為了兼顧照明與電熱保溫之雙重效果,本發明選用之發光二極體元件3較佳必需具有適當的光取出效率及必需伴隨產生足夠的熱能,例如該發光二極體元件3將電能轉換成光能與熱能的比例可選擇控制介於70%:30%至50%:50%之間。在一實施例中,本發明之發光二極體元件3可以選自符合一般正規照明標準的發光二極體;但亦可選自不符正規照明標準的發光二極體次級品,其具有較低的光取出效率並會產生較多的廢熱,但適用於本發明之複合模組。在另一實施例中,本發明亦可設計發光二極體構造,使其能產生所需的光能與熱能比例。例如,如第2圖所示,該發光二極體元件3通常係由一P型半導體化合物31及一N型半導體化合物32所組成,但本發明可使該P型半導體化合物31的端面另具有一阻障層或一電洞傳輸層(未繪示),以產生更多熱能。相似的,亦可使該N型半導體化合物32的端面另具有一阻障層或一電子注入層(未繪示),以產生更多熱能。或者,本發明可另外選擇在P型及N型半導體化合物31、32兩者之間夾設一電阻層(未繪示),以產生更多熱能。抑或,在P型及N型半導體化合物31、32兩者之至少一方選擇摻雜一電阻材料,以產生更多熱能。在選定種類並進行組裝時,該發光二極體元件3可藉由焊接或插槽等方式電性連接在一基板30上,在本發明中,該基板30係選自硬質之印刷電路板。在組裝時,該基板30係容置在該燈具本體2之容室21中,並電性連接該電線13。該發光二極體元件3則插設在該安裝孔221內或對位於該安裝孔221,以便朝向該固定表面5發射光線。Referring to FIGS. 1 and 2 again, the light-emitting diode element 3 of the first embodiment of the present invention may be selected from various types of inorganic light-emitting diodes (LEDs), and the present invention is not limited to the type, but Considering the dual effects of illumination and electrothermal insulation, the LED component 3 selected by the present invention preferably has appropriate light extraction efficiency and must be accompanied by sufficient thermal energy, for example, the LED component 3 converts electrical energy into light energy. The ratio of heat to heat can be selected to be between 70%: 30% to 50%: 50%. In an embodiment, the LED component 3 of the present invention may be selected from a light-emitting diode that conforms to a general regular illumination standard; but may also be selected from a light-emitting diode sub-product that does not conform to the regular illumination standard. Low light extraction efficiency and more waste heat, but suitable for the composite module of the present invention. In another embodiment, the present invention can also be designed with a light emitting diode configuration that produces the desired ratio of light energy to thermal energy. For example, as shown in FIG. 2, the light-emitting diode element 3 is usually composed of a P-type semiconductor compound 31 and an N-type semiconductor compound 32, but the present invention allows the end face of the P-type semiconductor compound 31 to have another A barrier layer or a hole transport layer (not shown) to generate more thermal energy. Similarly, the end face of the N-type semiconductor compound 32 may further have a barrier layer or an electron injection layer (not shown) to generate more thermal energy. Alternatively, the present invention may alternatively provide a resistive layer (not shown) between the P-type and N-type semiconductor compounds 31, 32 to generate more thermal energy. Alternatively, at least one of the P-type and N-type semiconductor compounds 31, 32 is selectively doped with a resistive material to generate more thermal energy. When the type is selected and assembled, the LED component 3 can be electrically connected to a substrate 30 by soldering or socket. In the present invention, the substrate 30 is selected from a rigid printed circuit board. The substrate 30 is received in the chamber 21 of the lamp body 2 and electrically connected to the wire 13 during assembly. The LED component 3 is inserted into the mounting hole 221 or opposite to the mounting hole 221 to emit light toward the fixing surface 5.
請再參照第1圖所示,本發明第一實施例之熱輻射板4係由鋁、銅等導熱金屬或合金材質製成之板體。在本發明中,該熱輻射板4係可選擇利用螺絲鎖固、倒鉤卡掣、滑槽嵌入、螺紋對接、焊接或膠黏接合等方式結合在該燈具本體2之熱輻射側23上,該結合方式並非用以限制本發明。該熱輻射板4至少設置在該燈具本體2的熱輻射側23,但亦可能延伸到該燈具本體2的各個側表面。在某一實施方式中,該熱輻射板4亦可能是至少由該燈具本體2之熱輻射側23直接一體成型者。再者,在本發明中,該熱輻射板4的外表面較佳凸設形成至少一熱輻射鰭片41,該熱輻射鰭片41係以適當形狀、長度、寬度及數量排列在該熱輻射板4的外表面,藉以增加熱交換面積。藉由上述構造,當使用本發明第一實施例之電致發光與發熱之複合模組時,該發光二極體元件3經由該燈具本體2之發光側22朝向該固定表面5發射光線。同時,設置在該燈具本體2的熱輻射側23之該熱輻射板4則可以朝向相反於該固定表面5之一欲保溫空間(如室內空間)輻射該發光二極體3產生的熱能。藉此,本發明不但可提供壁面打光效果,更能額外提供電熱保暖功能,並有助於增加散熱效率,進而增加燈具之功能性及其附加價值。Referring to Fig. 1, the heat radiating plate 4 of the first embodiment of the present invention is a plate made of a heat conductive metal such as aluminum or copper or an alloy material. In the present invention, the heat radiation plate 4 can be selectively coupled to the heat radiation side 23 of the lamp body 2 by means of a screw lock, a barb jam, a groove insert, a thread butt joint, a welding or an adhesive joint. This combination is not intended to limit the invention. The heat radiating plate 4 is disposed at least on the heat radiating side 23 of the lamp body 2, but may also extend to the respective side surfaces of the lamp body 2. In an embodiment, the heat radiation plate 4 may also be directly formed integrally by at least the heat radiation side 23 of the lamp body 2. Furthermore, in the present invention, the outer surface of the heat radiating plate 4 is preferably convexly formed to form at least one heat radiating fin 41, and the heat radiating fin 41 is arranged in the heat radiation in an appropriate shape, length, width and number. The outer surface of the plate 4 is used to increase the heat exchange area. With the above configuration, when the composite module of electroluminescence and heat generation according to the first embodiment of the present invention is used, the light-emitting diode element 3 emits light toward the fixed surface 5 via the light-emitting side 22 of the lamp body 2. At the same time, the heat radiating plate 4 disposed on the heat radiating side 23 of the lamp body 2 can radiate heat generated by the light emitting diode 3 toward a space to be insulated (such as an indoor space) opposite to the fixed surface 5. Thereby, the invention not only can provide the wall surface lighting effect, but also can additionally provide the electric heating function, and helps to increase the heat dissipation efficiency, thereby increasing the functionality of the lamp and its added value.
請參照第3圖所示,本發明第二實施例之電致發光與發熱之複合模組係相似於本發明第一實施例,但兩者間差異之特徵在於:該第二實施例之電致發光與發熱之複合模組進一步選擇性設置數個配件,例如:使該燈具本體2之發光側22另增設一聚光罩24,以將該發光二極體元件3發射的光線聚集在該固定表面5的特定區域中。再者,亦可使該燈具本體2之熱輻射側23另增設一聚熱罩25,以將該發光二極體元件3產生的熱能經由該熱輻射板4及聚熱罩25聚集在特定之欲保溫空間區域中。再者,該熱輻射板4的外表面另可選擇設置一溫度顯示元件42,其係可選自一顯示器面板或一感溫變色油墨。當該溫度顯示元件42選自顯示器面板時,其搭配有溫度偵測電路(未繪示),在溫度偵測電路偵測該熱輻射板4之溫度後,即可由顯示器面板顯示出數位溫度數值,以使燈具下方的使用者得知電熱保暖的即時溫度。或者,當該溫度顯示元件42選自感溫變色油墨時,感溫變色油墨可製成溫度計形狀或其他裝飾圖案形狀,且能隨著該熱輻射板4之溫度改變顏色,以使燈具下方的使用者得知電熱保暖的即時溫度。Referring to FIG. 3, the electroluminescent and heat-generating composite module of the second embodiment of the present invention is similar to the first embodiment of the present invention, but the difference between the two is characterized by: the second embodiment The composite module for illuminating and heating further selectively sets a plurality of components, for example, adding a concentrating cover 24 to the illuminating side 22 of the illuminating body 2 to collect the light emitted by the illuminating diode element 3 Fixed in a specific area of the surface 5. Furthermore, a heat collecting cover 25 may be further added to the heat radiating side 23 of the lamp body 2 to collect the heat energy generated by the light emitting diode element 3 via the heat radiating plate 4 and the heat collecting cover 25 in a specific state. Want to keep warm in the space area. Furthermore, the outer surface of the heat radiation plate 4 may alternatively be provided with a temperature display element 42, which may be selected from a display panel or a thermochromic ink. When the temperature display component 42 is selected from the display panel, it is equipped with a temperature detecting circuit (not shown). After the temperature detecting circuit detects the temperature of the heat radiating plate 4, the digital temperature value can be displayed by the display panel. In order to let the user under the lamp know the instantaneous temperature of the electric heating. Alternatively, when the temperature display element 42 is selected from a thermochromic ink, the thermochromic ink can be formed into a thermometer shape or other decorative pattern shape, and can change color with the temperature of the heat radiation plate 4 to make the underside of the lamp The user knows the instantaneous temperature of the electric heating.
請參照第4圖所示,本發明第三實施例之電致發光與發熱之複合模組係相似於本發明第一實施例,但兩者間差異之特徵在於:該第三實施例之電致發光與發熱之複合模組進一步選擇改變該燈具本體2之形狀,例如:使該燈具本體2之發光側22及熱輻射側23呈弧形,並使該發光側22之弧長小於該熱輻射側23之弧長,該熱輻射板4亦對應呈弧形造形。藉此,本發明可將該發光二極體元件3發射的光線聚集在該固定表面5的特定區域中,同時擴大該熱輻射板4所能加熱之欲保溫空間範圍。為了搭配該燈具本體2之彎弧形狀,該發光二極體元件3之基板30較佳選自一軟性電路板。在另一實施例中,亦可使該發光側22之弧長大於該熱輻射側23之弧長(未繪示),藉此,本發明可擴大該發光二極體元件3照明該固定表面5的範圍,並將該發光二極體元件3產生的熱能經由該熱輻射板4聚集在特定之欲保溫空間區域中。在又一實施例中,亦可使該發光側22呈弧狀,但使該熱輻射側23呈平板狀;或者,使該發光側22呈平板狀,但使該熱輻射側23呈弧狀,其皆為本發明可能實施之方式。Referring to FIG. 4, the composite module of electroluminescence and heat generation according to the third embodiment of the present invention is similar to the first embodiment of the present invention, but the difference between the two is characterized by: the electricity of the third embodiment The illuminating and heating composite module further selects to change the shape of the illuminating body 2, for example, the illuminating side 22 and the heat radiating side 23 of the illuminating body 2 are curved, and the arc length of the illuminating side 22 is smaller than the heat. The arc of the radiation side 23 is long, and the heat radiating plate 4 is also shaped in an arc shape. Thereby, the present invention can concentrate the light emitted by the light-emitting diode element 3 in a specific region of the fixed surface 5 while expanding the range of the space to be insulated which the heat radiation plate 4 can heat. In order to match the curved shape of the lamp body 2, the substrate 30 of the LED component 3 is preferably selected from a flexible circuit board. In another embodiment, the arc length of the light-emitting side 22 may be greater than the arc length of the heat radiation side 23 (not shown), thereby expanding the light-emitting diode element 3 to illuminate the fixed surface. The range of 5, and the heat energy generated by the light-emitting diode element 3 is concentrated in the specific space to be insulated via the heat radiation plate 4. In still another embodiment, the light-emitting side 22 may be curved, but the heat radiation side 23 may have a flat shape; or the light-emitting side 22 may have a flat shape, but the heat radiation side 23 may be curved. They are all possible ways of implementing the invention.
如上所述,相較於習用發光二極體之照明裝置皆以提供照明功能為主,僅將該發光二極體產生之熱能視為廢熱利用該散熱板排除到燈具四周,並未善加利用,且其實際散熱效果十分有限等缺點,第1至4圖之本發明藉由利用該支架1將該燈具本體2懸掛於該固定表面5(如天花板或牆壁)上,並使該燈具本體2之發光側22朝向該固定表面5,同時將該燈具本體2之熱輻射側23及熱輻射板4朝向欲保溫之空間,如此可利用該發光側22之發光二極體3提供壁面打光效果及經由該熱輻射側23之熱輻射板4提供電熱保暖功能,進而增加燈具之功能性及其附加價值,並有助於提升散熱效率。再者,本發明之發光二極體元件3不但可選自符合一般正規照明標準的發光二極體,更可選自發光二極體次級品,其雖具有較低光取出效率並會產生較多熱能,但適用於提供壁面打光效果及電熱保暖功能,進而降低複合燈具組裝成本。另外,本發明亦可藉由改變該發光二極體元件3之P型、N型半導體化合物31、32的材料種類或分層結構,來提高該發光二極體元件3之電能轉換成熱能的比例,進而有效提高燈具之電熱保暖效果。As described above, the illumination device is mainly provided for providing the illumination function, and only the thermal energy generated by the LED is regarded as waste heat. The heat dissipation plate is used to exclude the periphery of the lamp, and is not utilized well. The invention of FIGS. 1 to 4 suspends the lamp body 2 on the fixing surface 5 (such as a ceiling or a wall) by using the bracket 1 and makes the lamp body 2 The light-emitting side 22 faces the fixed surface 5, and simultaneously faces the heat-radiating side 23 of the lamp body 2 and the heat-radiating plate 4 toward the space to be insulated, so that the light-emitting diode 3 of the light-emitting side 22 can be used to provide the wall surface lighting effect. And providing the electric heat preservation function through the heat radiation plate 4 of the heat radiation side 23, thereby increasing the functionality of the lamp and its added value, and helping to improve the heat dissipation efficiency. Furthermore, the light-emitting diode element 3 of the present invention can be selected not only from a light-emitting diode conforming to a general regular illumination standard, but also from a light-emitting diode secondary product, which has a lower light extraction efficiency and is generated. More heat, but it is suitable for providing wall lighting effect and electric heating function, thereby reducing the assembly cost of composite lamps. In addition, the present invention can also improve the conversion of the electrical energy of the LED component 3 into thermal energy by changing the material type or layered structure of the P-type and N-type semiconductor compounds 31, 32 of the LED component 3. Proportion, and thus effectively improve the electric heating effect of the lamp.
雖然本發明已以較佳實施例揭露,然其並非用以限制本發明,任何熟習此項技藝之人士,在不脫離本發明之精神和範圍內,當可作各種更動與修飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
1...支架1. . . support
11...第一端11. . . First end
12...第二端12. . . Second end
13...電線13. . . wire
2...燈具本體2. . . Lamp body
21...容室twenty one. . . Room
22...發光側twenty two. . . Illuminated side
221...安裝孔221. . . Mounting holes
23...熱輻射側twenty three. . . Heat radiation side
24...聚光罩twenty four. . . Condenser
25...聚熱罩25. . . Heat collecting hood
3...發光二極體元件3. . . Light-emitting diode component
30...基板30. . . Substrate
31...P型半導體化合物31. . . P-type semiconductor compound
32...N型半導體化合物32. . . N-type semiconductor compound
4...熱輻射板4. . . Thermal radiant panel
41...熱輻射鰭片41. . . Heat radiation fin
42...溫度顯示元件42. . . Temperature display element
5...固定表面5. . . Fixed surface
第1圖:本發明第一實施例之電致發光與發熱之複合模組之組合剖視圖。Fig. 1 is a sectional view showing the combination of a composite module of electroluminescence and heat generation according to a first embodiment of the present invention.
第2圖:本發明第一實施例之發光二極體元件之結構示意圖。Fig. 2 is a schematic view showing the structure of a light-emitting diode element according to a first embodiment of the present invention.
第3圖:本發明第二實施例之電致發光與發熱之複合模組之組合剖視圖。Fig. 3 is a sectional view showing the combination of a composite module of electroluminescence and heat generation according to a second embodiment of the present invention.
第4圖:本發明第三實施例之電致發光與發熱之複合模組之組合剖視圖。Fig. 4 is a sectional view showing the combination of a composite module of electroluminescence and heat generation according to a third embodiment of the present invention.
1...支架1. . . support
11...第一端11. . . First end
12...第二端12. . . Second end
13...電線13. . . wire
2...燈具本體2. . . Lamp body
21...容室twenty one. . . Room
22...發光側twenty two. . . Illuminated side
221...安裝孔221. . . Mounting holes
23...熱輻射側twenty three. . . Heat radiation side
3...發光二極體元件3. . . Light-emitting diode component
30...基板30. . . Substrate
4...熱輻射板4. . . Thermal radiant panel
41...熱輻射鰭片41. . . Heat radiation fin
5...固定表面5. . . Fixed surface
Claims (16)
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TW098112401A TWI392119B (en) | 2009-04-14 | 2009-04-14 | Electroluminescent and thermoelectric composite module |
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Cited By (1)
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TWI603030B (en) * | 2016-12-26 | 2017-10-21 | 機光科技股份有限公司 | Planar oled lamp module |
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US20070189012A1 (en) * | 2003-09-26 | 2007-08-16 | Advanced Thermal Device Inc. | Light emitting diode illumination apparatus and heat dissipating method therefor |
US20080089071A1 (en) * | 2006-10-12 | 2008-04-17 | Chin-Wen Wang | Lamp structure with adjustable projection angle |
US20080278955A1 (en) * | 2007-05-07 | 2008-11-13 | Boyer John Delmore | Led lamp device and method to retrofit a lighting fixture |
US20090009999A1 (en) * | 2007-07-06 | 2009-01-08 | Bily Wang | LED lamp structure and system with high-efficiency heat-dissipating function |
US20090021994A1 (en) * | 2007-07-19 | 2009-01-22 | Macronix International Co., Ltd. | Memory and method for programming the same |
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US20070189012A1 (en) * | 2003-09-26 | 2007-08-16 | Advanced Thermal Device Inc. | Light emitting diode illumination apparatus and heat dissipating method therefor |
US20080089071A1 (en) * | 2006-10-12 | 2008-04-17 | Chin-Wen Wang | Lamp structure with adjustable projection angle |
US20080278955A1 (en) * | 2007-05-07 | 2008-11-13 | Boyer John Delmore | Led lamp device and method to retrofit a lighting fixture |
US20090009999A1 (en) * | 2007-07-06 | 2009-01-08 | Bily Wang | LED lamp structure and system with high-efficiency heat-dissipating function |
US20090021994A1 (en) * | 2007-07-19 | 2009-01-22 | Macronix International Co., Ltd. | Memory and method for programming the same |
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