WO2012176581A1

WO2012176581A1 - Heat-dissipating unit

Info

Publication number: WO2012176581A1
Application number: PCT/JP2012/063601
Authority: WO
Inventors: 祝迫　恭; 光芳永野; 洋志南澤; 祐貢上野
Original assignee: 日本タングステン株式会社
Priority date: 2011-06-18
Filing date: 2012-05-28
Publication date: 2012-12-27
Also published as: JP2013004822A

Abstract

[Problem] To provide a heat-dissipating unit that utilizes a highly deterioration-resistant low-cost intermediary body and is capable of effectively dissipating heat from a heat-generating body while achieving both heat conductivity and insulation. [Solution] This heat-dissipating unit (1) is provided with a heat-dissipating section (5) for dissipating heat conducted from a heat-generating body (2) and an intermediary body (4) for conducting the heat from the heat-generating body (2) to the heat-dissipating section (5). The intermediary body (4) has inorganic particulate phases and inorganic bonded phases arranged around the inorganic particulate phases. The inorganic bonded phases contain an inorganic material that is formed by means of hydrolysis and dehydrogenative polymerization of a metal alkoxide. The metal alkoxide comprises one or more metal elements selected from a group consisting of Al, Mg, Si, Ti, Zr, and Be. The intermediary body (4) is bonded to a surface of the heat-dissipating section (5).

Description

Heat dissipation unit

The present invention is flexibly applied to devices and devices having heating elements such as electronic parts and mechanical parts such as lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment, and efficiently conducts heat from the heating elements to the heat radiating section. However, the present invention relates to a heat radiating unit including an intermediate layer with little use deterioration.

Lighting equipment, electronic equipment, transportation equipment, manufacturing equipment, etc. have various electronic parts and mechanical parts, and these electronic parts and mechanical parts are likely to generate high heat as performance improves and functions expand. It has become. That is, lighting equipment, electronic equipment, transportation equipment, manufacturing equipment, and the like are in a state of having a heating element. For example, recent lighting devices use light-emitting diodes (hereinafter referred to as “LEDs”) for the purpose of energy saving and long life. Although the unit heat generation amount of the LED is small, since one lighting device mounts many LEDs with high density, the heat generation amount of the entire heating element included in the lighting device is large. In addition, the LED can increase the amount of light emitted as the applied current value increases, but naturally, the greater the applied current value, the greater the amount of heat generated. However, a large amount of light is required for the LED.

Also, with the increase in the degree of integration of semiconductor integrated circuits and the widespread use of power devices, electronic equipment, transportation equipment, and the like are equipped with heating elements that generate a large amount of heat. The manufacturing equipment needs to generate high heat depending on the object to be manufactured, and must generate high heat generation in the manufacturing equipment.

Heat generated by a heating element (including a single heating element and a collection of heating elements) that generates such a large amount of heat generation may have adverse effects such as performance deterioration and failure of lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment. give. For this reason, a heat radiating unit or a heat radiating device for radiating heat generated from the heating element is used. The heat radiating unit and the heat radiating device include a heat sink or a heat radiating plate that radiates heat conducted from the heat generating element to the outside, and radiates heat from the heat generating element.

The heat sink and heat sink can finally release the heat conducted from the heating element to the outside. Here, since an electronic component or a mechanical component that becomes a heating element needs to be mounted on a circuit board or a circuit layer, it is difficult to directly mount the heating element on a heat sink or a heat sink. Moreover, it is preferable that a heat sink and a heat sink are metals, such as copper and aluminum, from the height of heat conductivity. However, since it is necessary to mount electronic components, circuit boards, and circuit layers on the surface of the heat sink and heat sink, an insulating layer must be provided between the heat sink and heat sink and the circuit board and circuit layers. . This insulating layer is required to have an insulating function and efficiently conduct heat of the heating element to a heat sink or a heat sink.

Thus, in lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment including electronic parts and mechanical parts that serve as heating elements, a heat dissipation unit having an intermediate body interposed between the heat sink and the heatsink and the heating element is used. It was. An LED package having a heat sink has been proposed (for example, see Patent Document 1), or an intermediate technique has been proposed (for example, see Patent Document 2).

Japanese National Patent Publication No. 11-346029 JP 2009-212495 A

Patent Document 1 discloses a technique for releasing heat from a semiconductor laser chip by thermally connecting the structure of the semiconductor laser chip to a heat sink. However, Patent Document 1 has a complicated semiconductor laser chip and peripheral structure, and is not suitable for heat dissipation of a device on which many heating elements are mounted.

Patent Document 2 discloses a heat dissipating heat dissipating component in which an intermediate (thermal bonding agent) mainly composed of a resin is interposed between a heat generating element and a heat dissipating plate.

As in the technique disclosed in Patent Document 2, an intermediate body interposed between a heating element (for exchanging electrical signals such as electronic components and circuit layers) and a heat radiating plate (including a heat sink) is mainly composed of resin. Often. At present, thermal bonding agents mainly composed of resins have been used and proposed in various ways as intermediates. This is because the resin is a suitable material that achieves both insulation and thermal conductivity. Thus, making the insulating property and thermal conductivity compatible is a necessary condition for heat conduction from the heating element to the heat radiating plate and the like, and there are the following two solutions.

(Direction 1) A thermal bonding agent mainly composed of a resin is used as an intermediate body interposed between a heating element and a heat radiating plate.

(Direction 2) A heat sink or heat sink is formed of a material that has both insulating properties and thermal conductivity.

As in direction 1, when a thermal bonding agent mainly composed of a resin is used as an intermediate, there is a problem that it is easily deteriorated by the heat of the heating element (of course, the heat from the heat radiating plate). Resin is vulnerable to heat due to its characteristics, and the resin deteriorates by repeatedly receiving heat from a heating element exceeding 100 ° C. like LED. Naturally, as the deterioration progresses, it will be damaged, and heat from the heating element cannot be sufficiently conducted to the heat sink or the heat sink, causing problems such as deterioration of the device itself, performance reduction, failure, etc.

On the other hand, as shown in direction 2, AlN-based ceramics are known as materials that can form a heat sink while achieving both insulation and thermal conductivity. However, there are practical applications other than AlN-based ceramics. Is hardly found. The thermal conductivity of this AlN-based ceramic is 180 to 250 W / m · K, and is sufficiently practical as a heat sink or a heat sink in terms of thermal conductivity. In addition, AlN ceramics have an extremely high electrical resistance of 10 ¹⁴ (Ω · cm) and excellent insulating properties. However, AlN-based ceramics are very expensive compared to metals such as copper and aluminum, and are difficult to apply to lighting equipment and electronic equipment that have strict cost requirements.

As described above, an intermediate body that achieves both insulation and thermal conductivity between a heat sink and a heat sink formed of a metal having high thermal conductivity and a heating element is required for lighting equipment and electronic equipment. Of course, the intermediate must also be able to be coupled to a heat sink or heat sink.

Also, if the difference between the thermal expansion coefficient of the heat sink or the heat sink and the thermal expansion coefficient of the intermediate body is large, there is a problem that the intermediate body peels off or causes cracks. In view of the above problems, there is a demand for a heat dissipation unit including an intermediate that satisfies the following requirements.

(Requirement 1) High thermal conductivity.
(Requirement 2) Have insulation according to the necessity of the application location.
(Requirement 3) Securely bond to the metal surface.
(Requirement 4) Sufficient elastic characteristics.
(Requirement 5) Cost is low and resistance to deterioration.

That is, there is a demand for a heat dissipation unit including an intermediate that satisfies these requirements 1 to 5 by an approach different from that of conventional resin and AlN ceramics.

In view of the above problems, the present invention provides a heat dissipation unit that has a low-cost intermediate that is resistant to deterioration and that can efficiently dissipate the heat of a heating element while achieving both thermal conductivity and insulation. Objective.

In view of the above problems, the heat dissipating unit of the present invention includes a heat dissipating part that releases heat conducted from the heating element, and an intermediate that conducts heat from the heating element to the heat dissipating part, and the intermediate is an inorganic particle. And an inorganic binder phase disposed around the phase of the inorganic particles, the inorganic binder phase comprising an inorganic material formed by hydrolysis and dehydration polymerization of a metal alkoxide, and forming a metal alkoxide The element is one or more selected from the group consisting of Al, Mg, Si, Ti, Zr, and Be, and the intermediate is bonded to the surface of the heat dissipation portion.

The heat dissipating unit of the present invention uses an inorganic intermediate formed by hydrolysis and dehydration polymerization of metal alkoxide between the heat generating element and the heat dissipating part. Heat from the body can be conducted to the heat dissipation part. In addition, since it is an intermediate of an inorganic material, it does not deteriorate like a resin. By preventing the intermediate body from being deteriorated, the heat radiating unit itself is prevented from being deteriorated and the performance is lowered. Also, the cost is low.

Moreover, the intermediate of the inorganic material formed by hydrolysis and dehydration polymerization of the metal alkoxide can be applied to the surface of the metal heat radiating part, and in particular, the inorganic material formed by hydrolysis and dehydration polymerization of the metal alkoxide. This intermediate body can be reliably bonded to the surface of the metal heat dissipating part. As a result, the thermal resistance between the heating element and the heat radiating portion is lowered, and the heat of the heating element can be efficiently released.

In addition, the intermediate body has sufficient elastic characteristics (characteristic that does not cause peeling or damage following the thermal expansion of the bonded heat dissipation part or circuit layer). The body is not destroyed or peeled off from the heat dissipation part. In addition, since the intermediate can include inorganic particles, it can exhibit characteristics based on the characteristics of the inorganic particles. For this reason, it has the flexibility of application according to an application.

It is a side view of the thermal radiation unit in Embodiment 1 of this invention. It is a side view of the thermal radiation unit with which LED in Embodiment 1 of this invention was mounted. It is a schematic diagram which shows the structure of the intermediate body in Embodiment 1 of this invention. It is a front view of the intermediate body in Embodiment 1 of this invention. It is a side view which shows the mounting state of the thermal radiation unit in Embodiment 1 of this invention. It is a side view which shows the mounting state of the thermal radiation unit in Embodiment 1 of this invention. It is a side view of the thermal radiation part which has a fin in Embodiment 1 of this invention. It is a block diagram of the illuminating device in Embodiment 2 of this invention. It is a bottom view of the illuminating device in Embodiment 2 of this invention. It is a block diagram of the Example of this invention.

A heat dissipation unit according to a first aspect of the present invention includes a heat dissipating part that releases heat conducted from a heating element, and an intermediate that conducts heat from the heating element to the heat dissipating part. A phase of particles and an inorganic binder phase disposed around the phase of the inorganic particles, the inorganic binder phase including an inorganic material formed by hydrolysis and dehydration polymerization of a metal alkoxide, and forming a metal alkoxide The metal element is one or more selected from the group consisting of Al, Mg, Si, Ti, Zr, and Be, and the intermediate is bonded to the surface of the heat dissipation portion.

With this configuration, the intermediate can achieve both the sufficient elastic properties, binding properties, and insulating properties that the inorganic binder phase generates, and the thermal conductivity that the inorganic particle phase generates. Since this intermediate body can efficiently conduct the heat of the heat generating element to the heat radiating portion, the heat radiating unit can efficiently release the heat of the heat generating element.

In the heat dissipation unit according to the second aspect of the present invention, in addition to the first aspect, the inorganic particles are at least one selected from the group consisting of AlN, cBN, hBN, Al ₂ O ₃ , MgO, diamond and graphite. It is.

This configuration allows the intermediate to have high thermal conductivity while maintaining sufficient elastic properties.

In the heat dissipation unit according to the third invention of the present invention, in addition to the first or second invention, the inorganic particles are 40% by volume or more, preferably 50% by volume or more, with respect to the intermediate, More preferably, it is 70 volume% or more.

With this configuration, the intermediate can reliably have the thermal conductivity generated by the inorganic particles.

In the heat dissipation unit according to the fourth aspect of the present invention, in addition to any of the first to third aspects of the invention, the inorganic particles have a surface length in the intermediate body that is longer than a vertical length in the intermediate body. long.

With this configuration, the intermediate body has high thermal conductivity in the plane direction, and heat can be diffused in the plane direction (in some cases, in the vertical direction) inside the intermediate body. Ability builds up.

In the heat dissipating unit according to the fifth aspect of the present invention, in addition to any of the first to fourth aspects of the invention, the intermediate is formed by being heat-treated at 100 to 300 ° C. after being applied to the surface of the heat dissipating part. Is done.

This configuration ensures that the intermediate is joined to the heat dissipation part.

In the heat dissipation unit according to the sixth aspect of the present invention, in addition to any of the first to fifth aspects, the intermediate body has a shear bonding strength of 100 kPa or more and 1000 times or less of the shear bonding strength of 100 kPa or more. It has the rigidity of and is joined to the heat dissipation part.
With this configuration, the intermediate body exhibits sufficient elastic characteristics even when stress is applied, and can prevent peeling and damage.

In the heat radiating unit according to the seventh aspect of the present invention, in addition to any one of the first to sixth aspects, at least one surface of the intermediate body and the heat radiating portion has a circuit board electrically connected to the heat generating body, and At least one of the circuit layers is provided.

This configuration allows the heat dissipation unit to handle even when the heating element requires an electrical signal.

Hereinafter, embodiments will be described with reference to the drawings.

(Embodiment 1)

Embodiment 1 will be described.

The present invention proposes a heat radiating unit with a new approach of an intermediate that does not use a resin, in contrast to the conventional technology of a heat radiating unit that conducts heat of a heat generating element to a heat radiating portion by an intermediate composed mainly of a resin. The heating element and the heat radiating part are interposed by an intermediate body mainly composed of a resin in order to achieve both insulation and thermal conductivity. Resin is an easy-to-use material, but there are problems with durability and deterioration resistance, and it is difficult to cope with recent heating elements. However, in the current technical development, there is a problem that the performance of the resin is mainly improved and the intermediate is not separated from the resin as the main component.

The present invention is a new heat radiating unit that is completely different from the conventional approach, centering on an intermediate body that interposes a heat generating element and a heat radiating part without using resin as a main component, and having both insulation and heat conductivity. suggest.

(Overview)
An overall outline of the heat dissipation unit of the first embodiment will be described with reference to FIG. 1 is a side view of a heat dissipation unit according to Embodiment 1 of the present invention. FIG. 1 shows a state in which a heat radiating unit 1 and electronic components using the heat radiating unit 1 are mounted.

The heat dissipation unit 1 includes a heat dissipation portion 5 and an intermediate body 4. The heat radiating part 5 releases the heat conducted from the heating element 2 to the outside. For example, when the heat radiating part 5 is exposed to the outside air, the heat radiating part 5 releases the conducted heat to the outside air. Or when the thermal radiation part 5 is combined with another cooling member (for example, a liquid cooling jacket, a cold wind fan, etc.), it discharge | releases heat with respect to this combined cooling member. As the heat dissipating part 5, a metal or alloy heat sink or heat dissipating plate is preferably used.

The intermediate body 4 conducts heat generated by the heating element 2 to the heat radiating portion 5. This intermediate 4 does not contain a resin, which is the mainstream of the prior art, as a main component. The intermediate body 4 has a structure in which an inorganic particle phase and an inorganic binder phase disposed around the inorganic particle phase are combined. Since it is a combination of a phase of inorganic particles and a surrounding inorganic binder phase, it naturally has an insulating property. Further, the phase of the inorganic particles generates high thermal conductivity based on the characteristics of the inorganic particles. For this reason, the intermediate body 4 can achieve both insulation and thermal conductivity. Moreover, since it is a combination of inorganic particles and an inorganic binder phase, the intermediate body 4 has high heat resistance unlike the resin, and the heat generating body 2 is less deteriorated by heat. Thus, the intermediate body 4 having the combination of the phase of the inorganic particles and the inorganic binder phase disposed around the intermediate particle efficiently eliminates the problems of the prior art and efficiently transfers the heat of the heating element 2 to the heat radiating portion 5. Conduct.

(Operation of heat dissipation unit)
The heat radiating unit 1 can mount a heating element 2 such as an electronic component or a mechanical component. Since the heating element 2 operates by exchanging electrical signals, it is mounted on the necessary circuit layer 3. The circuit layer 3 may be a circuit board or a circuit pattern. The heating element 2 operates by exchanging electrical signals, and generates heat by this operation. The generated heat is conducted from the circuit layer 3 to the intermediate body 4. Since the intermediate body 4 has high thermal conductivity based on the properties of the inorganic particles, the heat of the heating element 2 is conducted to the heat radiating portion 5. The heat radiating part 5 can release the conducted heat to the outside air and other cooling members. In particular, the heat dissipating part 5 is formed of a metal or an alloy, so that the received heat can be conducted three-dimensionally and released from the surface to the outside.

The intermediate body 4 needs to prevent leakage of electric signals of the heating element 2 and the circuit layer 3 with respect to the heat radiating portion 5 made of metal or alloy, but the intermediate body 4 has an insulating property. Electric signal leakage can be prevented.

Referring to FIG. 2, a case where the heat dissipation unit 1 is incorporated in a lighting device or an electronic device on which an LED is mounted will be described as an example of the heating element 2. FIG. 2 is a side view of the heat dissipation unit on which the LED according to Embodiment 1 of the present invention is mounted. As an example of the heating element 2, a plurality of LEDs 21 are mounted on the circuit layer 3. In the LED 21, positive and negative electrodes and control signals are connected to the circuit layer 3 by terminals 6 (for example, bumps and grid arrays), thereby performing a light emitting operation. When this light emitting operation is performed, the LED 21 generates heat. In addition, lighting devices and electronic devices often have a plurality of LEDs 21 mounted thereon, and each of the plurality of LEDs generates heat. For this reason, when the heat generation of the plurality of LEDs is integrated, the heat is very large. In addition, in lighting devices and electronic devices in which a small number of LEDs are mounted, a high voltage is applied to the LEDs in order to increase the illuminance. As a result, heat generation is concentrated in a narrow area where a small number of LEDs are mounted. The heat dissipation unit 1 is also suitable for heat dissipation in such a narrow region.

The heat from the plurality of LEDs 21 (heat is also generated from the circuit layer 3) reaches the intermediate body 4, and the intermediate body 4 conducts this heat to the heat radiating portion 5. At this time, the intermediate body 4 does not conduct the electrical signals of the LED 21 and the circuit layer 3 to the heat dissipation portion 5. The heat dissipating unit 5 releases the conducted heat to the outside air and other cooling members. By repeating the conduction through the intermediate body 4 and the heat radiation by the heat radiating unit 5, the heat of the LED is released to the outside, and the performance deterioration and failure of the lighting equipment and the electronic equipment can be prevented.

Next, the details of each part will be described.

(Intermediate)
The intermediate body 4 has an inorganic particle phase and an inorganic binder phase disposed around the inorganic particle phase. This inorganic binder phase is formed by hydrolysis and dehydration polymerization of a metal alkoxide. The metal element forming the metal alkoxide is at least one selected from the group consisting of Al, Mg, Si, Ti, Zr, and Be. The inorganic binder phase has sufficient elastic properties. Here, the sufficient elastic property means that when the intermediate body 4 is joined to the heat radiating part 5 or the circuit layer 3, the intermediate body 4 can be sufficiently separated from the thermal expansion of the heat radiating part 5 or the circuit layer 3 and peeled off. A characteristic that does not cause damage. By having such a sufficient elastic characteristic, the intermediate body 4 can maintain the role of heat conduction following the thermal expansion and contraction of the heat radiating portion 5 and the like to be joined.

Even when an inorganic particle phase is combined with this inorganic binder phase, sufficient elastic properties of the atomic bonds of the inorganic binder phase are maintained, so that the intermediate 4 has sufficient elastic properties. Moreover, since the intermediate body 4 is liquid until it is dried and solidified, it can be applied to the surface of the heat radiating portion 5.

The inorganic binder phase obtained by hydrolysis and dehydration polymerization of metal alkoxide has the following characteristics: (1) sufficient elastic properties, (2) bondability with metal (bondability with heat radiating part 5), and (3) insulation properties. Have everything. The intermediate 4 includes inorganic particles in the inorganic binder phase, but the inorganic binder phase is arranged around the phase of the inorganic particles, so that the characteristics of (1) to (3) are maintained. . That is, the inorganic binder phase obtained by hydrolysis and dehydration polymerization of the metal alkoxide that is the first element of the intermediate 4 gives the intermediate 4 the characteristics (1) to (3).

The intermediate 4 further has a phase of inorganic particles, and the phase of the inorganic particles is surrounded by an inorganic binder phase.

The inorganic particles are at least one selected from the group consisting of AlN, cBN, hBN, Al ₂ O ₃ , MgO, diamond and graphite. In the intermediate, the inorganic binder phase obtained by hydrolysis and dehydration polymerization of the metal alkoxide produces the characteristics (1) to (3) as described above. The intermediate body 4 needs to conduct heat of at least one of the heating element 2 and the circuit layer 3 to the heat radiating portion 5. Although this inorganic binder phase does not have thermal conductivity, the inorganic particles impart high thermal conductivity to the intermediate body 4 based on the characteristics inherent to the material. Of course, the inorganic particles also include ceramic particles.

FIG. 3 is a schematic diagram showing the structure of the intermediate in Embodiment 1 of the present invention. In FIG. 3, a solid line is connected to the periphery of the inorganic particles via the O element. This solid line is the phase of the inorganic particles arranged around the inorganic particles. Since the phase of the inorganic particles is bonded to the inorganic bonded phase, the intermediate 4 causes the properties of the inorganic particles. In addition, since the inorganic binder phase is arranged around the inorganic particles, the above characteristics (1) to (3) generated by the inorganic binder phase are also maintained.

Inorganic particles that are at least one selected from the group consisting of AlN, cBN, hBN, Al ₂ O ₃ , MgO, diamond, and graphite have a property of exhibiting high thermal conductivity. Since these inorganic particles constitute the intermediate body 4 as shown in FIG. 3, the intermediate body 4 exhibits high thermal conductivity. As a result, the intermediate body 4 can efficiently conduct heat of at least one of the heating element 2 and the circuit layer 3 to the heat radiating portion 5. The heat of the circuit layer 3 includes heat generated by the circuit layer 4 itself and heat conducted from the heating element 2. Since the heat of the heating element 2 is efficiently conducted to the heat radiating portion 5, the heat radiating portion 5 can effectively exhibit its ability and can release heat to the outside.

In addition, the inorganic particles that are at least one selected from the group consisting of AlN, cBN, hBN, Al ₂ O ₃ , MgO, diamond, and graphite have high thermal conductivity as their characteristics. Therefore, these are preferably selected.
Each of these inorganic particles has high thermal conductivity characteristics as shown below. Since each of the inorganic particles has a different thermal conductivity, the inorganic particles may be selected in consideration of ease of production, cost, and the like.
AlN: 170 to 250 W / (m ² · K)
cBN: 1300W / (m ² · K)
hBN: 60W / (m ² · K)
Al ₂ O ₃ : 36 W / (m ² · K)
MgO: 42 W / (m ² · K)
Diamond: 2300W / (m ² · K)
Graphite: 230W / (m ² · K)

Of course, since the intermediate 4 is a combination of an inorganic binder phase obtained by hydrolysis and dehydration polymerization of a metal alkoxide and a phase of inorganic particles, the cost is small. For example, the cost can be reduced as compared with the case where the heat radiation portion is formed of AlN ceramics in the prior art. In addition, unlike the resin of the prior art, the intermediate body 4 has heat resistance and sufficient elastic properties, so that deterioration due to heat and aging hardly occurs. This is because the intermediate body 4 has light resistance deterioration characteristics that do not deteriorate against heat resistance and light based on the characteristics of the material.

Thus, by introducing the intermediate 4 due to the bond between the inorganic binder phase obtained by hydrolysis and dehydration polymerization of the metal alkoxide and the phase of the inorganic particles, the performance of the heat radiating part 5 is sufficiently extracted, The heat dissipation unit 1 can efficiently release the heat of the heating element 2.

Further, the inorganic particles are preferably 40% by volume or more with respect to the intermediate 4. It is because the characteristic of an inorganic particle can be produced with respect to the intermediate body 4 because it is 40 volume% or more. On the other hand, when the inorganic particles are less than 40% by volume with respect to the intermediate body 4, the properties of the inorganic particles can hardly be exhibited, and the intermediate body 4 cannot exhibit high thermal conductivity.

It is also preferable that the inorganic particles are 50% by volume or more with respect to the intermediate 4. More preferably, the inorganic particles are 70% by volume or more with respect to the intermediate 4. This is because the thermal conductivity of the inorganic particles contributes strongly to the intermediate body 4 and the thermal conductivity of the intermediate body 4 is increased by having such a ratio.

In addition, it is preferable that the inorganic particles have a longer length in the surface direction in the intermediate body 4 than a length in the vertical direction in the intermediate body 4. FIG. 4 is a front view of the intermediate body according to Embodiment 1 of the present invention. FIG. 4 shows the intermediate body 4 as viewed from above. That is, the surface of FIG. 4 shows the planar direction of the intermediate body 4, and the direction passing through FIG. 4 shows the vertical direction of the intermediate body 4. In addition, the internal structure of the intermediate body 4 is shown as being visible.

Intermediate 4 has inorganic particles 42. In FIG. 4, the elliptical inorganic particles 42 are shown, but the present invention is not limited to the elliptical shape. Further, FIG. 4 shows the inorganic particles 42 large for easy grasping, but it is not necessary to have such a size.

4, it is also preferable that the inorganic particles 42 have a longer length in the plane direction in the intermediate body 4 than a length in the vertical direction in the intermediate body 4. Thus, the heat conductivity in the plane direction of the inorganic particle 42 increases because the length in the plane direction is long. That is, the intermediate body 4 produces high thermal conductivity in the plane direction.

(Other properties of intermediates)
The intermediate body 4 has an inorganic bonding phase obtained by hydrolysis and dehydration polymerization of a metal alkoxide and a phase of inorganic particles. When formed, the intermediate body 4 is liquid or gel-like. That is, in the intermediate body 4, a liquid or gel material just after the production is applied to the surface of the heat radiating portion 5. Alternatively, the liquid or gel-like material immediately after manufacture may be applied to the surface (bottom surface) of the circuit layer 3. After the liquid or gel material is applied, heat treatment is performed at 100 ° C. to 300 ° C. to form the intermediate 4. The material for forming the intermediate body 4 is liquid or gel immediately after production and is solidified by heating and drying, so that it can be joined to the heat radiating part 5 and the circuit layer 3. When joined, the intermediate body 4 is connected to the heat radiating portion 5 with sufficient strength, so that the entire configuration of the heat radiating unit 1 is formed with high strength.

Heating equipment such as a heater is used for heating and drying. The intermediate body 4 formed by coating and heating has high strength and is bonded to the heat radiating portion 5 and the circuit layer 3 and has sufficient elastic properties, so that the intermediate body 4 is subject to peeling or destruction due to thermal expansion or the addition of other stresses. Less.

It is preferable that the intermediate body 4 has a shear bonding strength of 100 kPa or more and a rigidity of 1000 times or less of a shear bonding strength of 100 kPa or more. When the intermediate body 4 has a shear strength of 100 kPa or more and a rigidity of 1000 times or less of a shear bonding strength of 100 kPa or more, the intermediate body 4 bonded to the heat radiation part 5 or the circuit layer 3 is peeled or broken. This is because it is less likely to cause damage. When the shear strength of the intermediate body 4 is smaller than 100 kPa and the rigidity is 1000 times or more of the shear bonding strength of 100 kPa or more, the shear strength becomes insufficient, and is being manufactured, transported, or used. Problems such as peeling or destruction of the intermediate 4 may occur due to heat and external stress. For this reason, it is preferable that the shear strength of the intermediate body 4 is 100 kPa or more and 1000 times or less of the shear bonding strength of 100 kPa or more.

The intermediate body 4 is disposed between the heat generating element 2 (and the circuit layer 3) that generates heat and the heat dissipating part 5 that dissipates heat. That is, it is necessary to take care between the generation of heat and the release of heat, and not only the basic performance such as insulation and thermal conductivity, but also the member to which the intermediate body 4 such as shear strength and rigidity is joined (such as the heat radiating portion 5). Sufficient elastic characteristics that can follow the thermal expansion and contraction of the resin are also required. The intermediate body 4 needs to be processed, manufactured, applied, and bonded so as to ensure these performances. The mixing ratio of the inorganic particles, the coating thickness, the heat treatment temperature and time may be adjusted as necessary.

The intermediate body 4 is a combination of an inorganic binder phase and an inorganic particle phase, unlike a conventional thermal bonding agent mainly composed of a resin (for example, grease). In addition, while realizing each of the thermal conductivity, it is difficult to cause deterioration and damage. Since the intermediate body 4 is configured to conduct the heat from the heat generating element 2 to the heat radiating unit 5, the heat radiating unit 1 can efficiently radiate the heat generating element 2. In particular, since the heating element 2 is various such as an electronic component, a mechanical component, and a semiconductor integrated circuit, the heat dissipation unit 1 can be suitably applied to various fields such as an electronic device and a transportation device.

As described above, the intermediate body 4 includes inorganic particles in addition to the basic functions of sufficient elastic properties, insulating properties, and metal binding properties generated by the inorganic binder phase obtained by hydrolysis and dehydration polymerization of the metal alkoxide. It has the additional function of high thermal conductivity caused by the phase of By appropriately mixing these two phases, the intermediate body 4 can serve as a member capable of conducting the heat of the heating element 2 to the heat radiating portion 5 without causing deterioration like a resin.

(Heating element)
The heating element 2 is a member that generates heat by self-operation or energy supply from others. Includes various electrical parts, electronic parts, mechanical parts, chemical parts, etc. As an example, the heating element 2 includes at least one of a light emitting element, a discrete element, an electronic component, a semiconductor integrated circuit, and a power device. That is, it includes elements used for at least one of lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment.

発光 Light emitting elements, discrete elements, electronic components, etc. operate upon receiving power supply. This operation generates heat. In recent years, lighting devices and electronic devices are mounted with many light emitting elements. For this reason, each light-emitting element such as an LED generates a large amount of heat when many light-emitting elements are gathered even if heat generation and power consumption are small. Alternatively, a discrete element, a semiconductor integrated circuit, and a power device have a higher calorific value due to an improvement in integration degree and performance.

The heat dissipating unit 1 can release the heat of the heat generating element 2 having such a large calorific value through the heat dissipating part 5. At this time, the heat radiating unit 1 may be arranged so as to correspond to each of the plurality of heat generating elements 2, or the heat radiating unit 1 may be arranged so as to correspond to the plurality of heat generating elements 2.

FIG. 5 is a side view showing a mounted state of the heat dissipation unit according to Embodiment 1 of the present invention. FIG. 5 shows a state in which a heat dissipation unit is arranged so as to correspond to each of the former plurality of heating elements. In FIG. 5, the lighting device and the electronic device have a plurality of heating elements 2A to 2D (for convenience of illustration, of course, more heating elements may be provided). The circuit layers 3 corresponding to the heating elements 2A to 2D are common, but of course may be individual. Each of the heat radiating units 1A to 1D is mounted corresponding to each of the heat generating elements 2A to 2D. The heat radiating unit 1A has an intermediate body 4A and a heat radiating portion 5A, and the heat radiating unit 1B has an intermediate body 4B and a heat radiating portion 5B.

The heat dissipation unit 1A mainly releases the heat of the heating element 2A, the heat dissipation unit 1B mainly releases the heat of the heating element 2B, the heat dissipation unit 1C mainly releases the heat of the heating element 2C, and the heat dissipation unit 1D mainly releases the heat of the heating element 2D. The heat is released. By providing the heat dissipation unit 1 corresponding to each of the plurality of heating elements 2, there is an advantage that the heat dissipation effect of the entire heating element 2 is enhanced.

FIG. 6 is a side view showing a mounted state of the heat dissipation unit according to the first embodiment of the present invention. Unlike FIG. 5, FIG. 6 is mounted corresponding to the entire plurality of heating elements 2. For this reason, the intermediate body 4 and the heat radiating portion 5 are provided corresponding to all of the heat generating elements 2A to 2D. The intermediate body 4 conducts heat from the whole of the plurality of heating elements 2A to 2D to the heat radiating section 5. The heat dissipating part 5 emits heat from the plurality of conducted heat generating elements 2A to 2D. Since the heat radiating unit 1 is provided so as to correspond to the plurality of heat generating bodies 2, the heat radiating unit 1 can efficiently radiate heat from the entire heat generating body 2 at a time. Of course, the cost for mounting can also be reduced.

The heating element 2 is densely mounted according to the type and specification of the device to be mounted, or is mounted with a moderate gap. Alternatively, there are a case where all of the plurality of heating elements 2 generate heat uniformly and a case where the heating element 2 which generates heat and the heating element 2 which does not generate heat are switched depending on time and operation. Depending on these differences, the heat dissipating unit 1 is mounted on each heating element 2 as shown in FIG. 5 or mounted so as to correspond to the entirety of the plurality of heating elements 2.

(Circuit layer)
The circuit layer 3 is provided for exchanging electrical signals with the heating element 2 such as an electronic component or a light emitting element. The circuit layer 3 may be a printed board on which wiring for exchanging electrical signals with the heating element 2 is printed, or may be a circuit board on which electrodes and conductive wires are mounted. In the case of a printed circuit board, electrodes and wiring are formed by patterning a metal component by an ink jet format or screen printing. Or metal foil may be vapor-deposited and an electrode and wiring may be formed. Or an electrode and wiring may be formed by plating.

The circuit layer 3 forms electrodes and wirings for exchanging electrical signals in this way, and electrically connects the electrodes and wirings to the heating element 2. Further, the circuit layer 3 is connected to the heating element 2 by a wire as necessary. The wire is formed of a highly conductive material such as gold, platinum, copper, or aluminum.

The circuit layer 3 may be provided at a position facing the heating element 2 or may be provided at a position other than the position facing the heating element 2. This is because the circuit layer 3 is intended to supply an electric signal to the heating element 2 and therefore does not necessarily have to be provided at a position facing the heating element 2.

That is, at least one surface of the intermediate body 4 and the heat radiating portion 5 is provided with at least one of the circuit layer 3 and the circuit board that are electrically connected to the heating element 2. When an electric signal is applied to the heating element 2 or the heating element 2, the circuit layer 3 may or may not be necessary on the bottom surface of the heating element 2. A region laminated on the surface of the heat radiating part 5 may occur.

(Heat dissipation part)
The heat radiating part 5 releases the heat of at least one of the heating element 2 and the circuit layer 3 conducted from the intermediate body 4. Here, the heat source is the heating element 2, but the circuit layer 3 itself may also generate heat, or the heat of the heating element 2 may be received by the circuit layer 3. For this reason, the intermediate body 4 conducts the heat of the heating element 2 and the circuit layer 3. This conducted heat can include a case where the heat is derived from the heating element 2 and a case where the heat is derived from the circuit layer 3.

The heat dissipating part 5 is made of a material having high thermal conductivity such as metal or alloy, and releases the heat conducted by the intermediate body 4 to the outside. As an example of a material having high thermal conductivity, copper or aluminum is preferably employed. This is because these materials have not only high thermal conductivity, but also low cost and high workability.

The heat dissipating part 5 has a plate material or a three-dimensional shape, diffuses the conducted heat in a planar direction or a vertical direction, and releases the heat from the surface to the outside. In order to increase the surface area of the heat radiating portion 5, it is also preferable that the heat radiating portion 5 has a plate shape or has irregularities on the surface. The heat dissipating unit 5 may include various elements such as a heat dissipating plate and a heat sink.

Also, a large number of fins may be provided on the surface. FIG. 7 is a side view of the heat dissipating part having fins in the first embodiment of the present invention. The heat dissipating unit 5 includes a base 51 and fins 52. A large number of fins 52 are attached to the front surface (back surface) of the base 51. When many fins 52 are provided, the surface area of the entire heat dissipating part 5 increases, and the heat dissipating ability of the heat dissipating part 5 increases. Further, the fin 52 forms a narrow space between the adjacent fins 52. The space surrounded by the fins 52 causes air convection due to heat from the base 51. By this air convection, heat conducted to the base 51 and the fins 52 is released to the outside. As described above, the heat dissipating part 5 includes a large number of fins 52, so that the heat dissipating ability of the heat dissipating part 5 is further enhanced.

Further, the heat radiating unit 5 may be not only exposed to the outside air and releasing heat to the outside air but also thermally connecting to the liquid cooling jacket and releasing the heat through the liquid cooling jacket. Or the thermal radiation part 5 may discharge | release the conducted heat by thermally connecting the thermal radiation part 5 to the liquid cooling sheet. Furthermore, the heat radiating unit 5 may move the heat to another place using another member and release it at the moved position. A cooling fan for blowing cooling air to the heat radiating unit 5 may be provided.

The heat dissipating unit 5 is not limited to the various configurations listed here, and may have a heat dissipating structure or system known as a known technique. By providing such a heat radiating part 5, the heat radiating unit 1 can efficiently release the heat of the heating element 2. Of course, since the intermediate body 4 which is not a resin is provided in the heat radiating portion 5 and conducts heat, the heat from the heat generating body 2 efficiently reaches the heat radiating portion 5, so the heat radiating portion 5 regrets its heat radiating performance. It will be able to demonstrate without.

The intermediate body 4 described in the first embodiment can realize heat conduction by adding a certain inorganic particle phase to an inorganic binder phase based on a metal alkoxide. In addition to this heat conduction, it has sufficient elastic properties, insulating properties, high bondability with metals, and excellent durability. By realizing such an intermediate body 4, it is possible to realize the heat radiating unit 1 that releases the heat of various heat generating elements 2.

For this reason, the intermediate body 4 may be distributed or used as a single body.

(Embodiment 2)

Next, the second embodiment will be described. In the second embodiment, a device to which the heat dissipation unit 1 described in the first embodiment is applied will be described.

The heating element to which the heat radiating unit 1 wants to radiate heat is at least one of a light emitting element, a discrete element, an electronic component, a semiconductor integrated circuit, a mechanical component, a power device, and a chemical product. Of course, it is not intended to be limited to those listed here, but is merely exemplary. If it is a heat generating body which generate | occur | produces heat, the thermal radiation unit 1 demonstrated in Embodiment 1 is applied variously.

FIG. 8 is a block diagram of the lighting device according to the second embodiment of the present invention. From the viewpoint of energy saving and environmental protection, a large number of lighting devices 10 on which a large number of LEDs 21 are mounted are used. When a large number of LEDs 21 are mounted, since the individual heat generation is summed, considerable heat is generated. Moreover, in order to make the light emission of LED21 strong, it is necessary to give a big electric current, and also in this case, the heat_generation | fever from LED21 becomes large.

The lighting device 10 has the heat dissipation unit 1 mounted on a plurality of LEDs 21. Moreover, the heat dissipation unit 1 is mounted on each of the plurality of LEDs 21. Of course, the heat radiating unit 1 may be mounted in a form in which the plurality of LEDs 21 are collected. The lighting device 10 includes a housing 11 that stores the LEDs 21 and the like, a control unit 6 that controls the circuit layer 3 (the circuit board is the same), and a power supply 7 that supplies power. The power source 7 supplies power from an external power source (AC power source or the like) to the control unit 6 or the like, or supplies power stored by itself to the control unit 6 or the like. The control unit 6 generates a control signal for controlling the light emission pattern and the light emission amount of the plurality of LEDs 21 and outputs the control signal to the circuit layer 3. The circuit layer 3 gives necessary electric signals to the plurality of LEDs 21 based on this control signal. The plurality of LEDs 21 that have received the electrical signal emit light or turn off according to the characteristics of the electrical signal.

Each of the plurality of LEDs 21A to 21D is provided with heat radiation units 1A to 1D. The heat radiating unit 1A has an intermediate body 4A and a heat radiating portion 5A, and releases the heat of the LED 21A. Similarly, the heat radiating unit 1B includes an intermediate body 4B and a heat radiating portion 5B, and releases the heat of the LED 21B. The same applies to the

heat dissipation units

1C and 1D.

Since the heat dissipation unit 1 is mounted on the plurality of LEDs 21 included in the lighting device 10, the lighting device 10 can suppress heat generation and can prevent performance deterioration and failure. The heat of the LED 21 serving as a heating element is conducted to the heat radiating portion 5 by the intermediate body 4 including an inorganic binder phase obtained by hydrolysis and dehydration polymerization of a metal alkoxide and a phase of inorganic particles. Unlike the resin, the intermediate body 4 is resistant to light degradation and has good heat conduction. For this reason, the intermediate body 4 conducts the heat of the LED 21 to the heat radiating portion 5 reliably and efficiently. The intermediate body 4 is not easily peeled off or damaged by applied heat or stress due to its sufficient elastic properties. For this reason, even when lighting and extinguishing are repeated as in the lighting device 10, deterioration of the heat dissipation unit 1 is reduced.

In FIG. 8, the heat radiation units 1A to 1D are mounted on the LEDs 21A to 21D, respectively, but one heat radiation unit 1A to 1D may be mounted on the entire LEDs 21A to 21D. Or when LED21 is arrange | positioned at matrix form, the thermal radiation unit 1 may be mounted for every row | line | column. FIG. 9 is a bottom view of the lighting apparatus according to Embodiment 2 of the present invention. FIG. 9 shows a state in which the illumination device 10 is seen through from the bottom side.

The lighting device 10 includes LEDs 21 arranged in a matrix. The heat dissipation unit 1 is provided in each row of the matrix-like LEDs. The heat radiating unit 1A releases the heat of the plurality of LEDs 21 mounted in the uppermost row. At this time, the heat radiating unit 1A includes an intermediate body 4 and a heat radiating portion 5. The intermediate body 4 conducts heat of the plurality of LEDs 21 mounted in the uppermost row to the heat radiating portion 5, and the heat radiating portion 5 Release heat to the outside. The same applies to the heat radiation units 1B to 1D provided in the other rows.

The heat dissipation unit 1 is applied not only to the lighting device 10 but also to various electronic devices. For example, the heat dissipation unit 1 is suitably applied to an electronic device in which a heating element 2 that is at least one of a discrete element, an electronic component, a semiconductor integrated circuit, and a power device is mounted.

Electronic devices include, for example, personal computers, server devices, notebook computers, liquid crystal imaging devices, measuring devices, and other devices on which the above-described elements that can become heating elements are mounted. In these electronic devices, the heating element often generates high heat depending on the specification state. Even when a heat radiating member such as a heat sink is provided, the heat from the heating element is often not efficiently conducted to the heat radiating member. When the heat dissipation unit 1 described in the first embodiment is mounted on such an electronic device, the heat of the heating element is conducted to the heat dissipation portion 5 by the intermediate body 4 and released. Since the electronic device also repeatedly generates heat in the same manner as the lighting device 10, the intermediate body 4 that conducts heat from the heating element is greatly stressed. However, since the intermediate body 4 described in the first embodiment has sufficient elastic characteristics and high durability against stress application, it can conduct heat without causing damage or the like. As a result, heat generation of the entire electronic device can be suppressed. Naturally, it is possible to prevent performance deterioration and failure of the electronic device.

Also, the heat dissipation unit 1 can be applied not only to electronic equipment but also to transportation equipment such as aircraft, automobiles and large vehicles. These transportation devices are mounted with various heating elements that generate heat, such as engines and lights. The heat dissipation unit 1 is applied to these heating elements. Also in this case, the intermediate body 4 can efficiently conduct heat to the heat radiating portion 5 without deterioration or the like with high sufficient elastic characteristics. That is, the heat dissipation unit 1 can release the heat of the heating element with high durability. As a result, it is possible to prevent the performance deterioration and failure of the transportation equipment.

The heat dissipation unit 1 is also preferably applied to manufacturing equipment and manufacturing equipment. Some manufacturing equipment and manufacturing equipment use heat. For example, an arc device or an annealing device applies heat to a material to be processed. For this reason, the arc device and the annealing device include a housing. The inside of the housing has heat. The heat dissipating unit 1 is provided on the inner wall of the casing, and can release the internal heat to the outside of the casing or a specific discharge path.

As described above, lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment including the heat dissipation unit 1 can prevent performance deterioration and failure due to heat.

(Example)
An embodiment in which the heat dissipation unit 1 is mounted on the LED substrate on which the LED is mounted will be described. In this case, the heat dissipation unit 1 is a device suitable for releasing heat from the LED. FIG. 10 is a block diagram of an embodiment of the present invention. FIG. 10 shows the LED heat dissipation unit 100 in a transparent state from the bottom. For this reason, in FIG. 10, the intermediate body 4 and the thermal radiation part 5 have overlapped. The heating element is one or a plurality of LEDs 29. However, the present invention is optimally applied to a state where a small number of LEDs that tend to generate large heat in a narrow region are mounted in the narrow region.

The circuit layer 3 is a metal pattern 33 that gives an electric signal to the LED. The intermediate body 4 has an inorganic particle phase and an inorganic binder phase arranged around the inorganic particle phase. Here, the inorganic binder phase is a Si—O network obtained by hydrolysis and dehydration polymerization of a metal alkoxide. By this Si—O network, the inorganic binder phase and the intermediate 4 including the inorganic binder phase have sufficient elastic properties, bondability with metal, and insulation.

The inorganic particles are mainly diamond particles having a particle diameter in the range of 0.01 to 10 μm. Due to the diamond particles falling within the range of 0.01 to 10 μm, the intermediate 4 including the particles has high thermal conductivity. At this time, when the ratio of diamond particles that are inorganic particles is 55% by volume with respect to the intermediate body 4, the thermal conductivity of the intermediate body 4 is 8 W / m · K. When the ratio of the diamond particles is 70% by volume with respect to the intermediate body 4, the thermal conductivity of the intermediate body 4 is 25 W / m · K. When the ratio of diamond particles is 90% by volume with respect to the intermediate body 4, the thermal conductivity of the intermediate body 4 is 400 W / m · K. Thus, the intermediate body 4 in which diamond particles are used as inorganic particles exhibits high thermal conductivity.

Further, the heat radiating portion 5 is a heat sink formed of a copper alloy. In FIG. 10, the shape of the heat sink cannot be clearly shown for the sake of convenience from the bottom, but it may be a commercially available plate shape or a general heat sink provided with fins. Moreover, the intermediate body 4 is reliably couple | bonded with the thermal radiation part 5 which is a metal.

The LED heat radiating unit 100 conducts heat generated by the LED 29 that is a heating element to the heat radiating part 5 through the intermediate body 4. The heat radiating unit 5 releases the conducted heat to the outside. At this time, the intermediate body 4 has high thermal conductivity and characteristics such as sufficient elastic characteristics. As a result, the heat of the LED 29 can be efficiently conducted to the heat radiating portion 5. Of course, the intermediate body 4 does not peel off or be damaged from the heat radiating portion 5 because it has sufficient elastic properties and metal binding properties. Thus, the LED heat dissipation unit 100 can efficiently release the heat of the mounted LED 29.

The heat radiating unit 1 of the present invention is practically used in the LED heat radiating unit 100 and the like in this way.

The heat radiating unit described in the first and second embodiments is an example for explaining the gist of the present invention, and includes modifications and alterations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Heat radiation unit 2 Heat generating body 3 Circuit layer 4 Intermediate body 5 Heat radiation part 6 Control part 7 Power supply 10 Illumination equipment 11 Case

Claims

A heat dissipating part that releases heat conducted from the heating element;
An intermediate that conducts heat from the heating element to the heat radiating portion;
The intermediate has an inorganic particle phase and an inorganic binder phase disposed around the inorganic particle phase;
The inorganic binder phase includes an inorganic material formed by hydrolysis and dehydration polymerization of a metal alkoxide,
The metal element forming the metal alkoxide is at least one selected from the group consisting of Al, Mg, Si, Ti, Zr, and Be,
The intermediate body is a heat dissipation unit bonded to the surface of the heat dissipation portion.
The inorganic particles, AlN, cBN, hBN, Al 2 O 3, MgO, at least one selected from the group of diamond and graphite, the heat dissipation unit according claim 1, wherein.
The said inorganic substance particle | grain is 40 volume% or more with respect to the said intermediate body, Preferably it is 50 volume% or more, More preferably, it is 70 volume% or more, Claim 1 or 2 of Claim 1 or 2 Heat dissipation unit.
The heat dissipation unit according to any one of claims 1 to 3, wherein the inorganic particles have a length in a plane direction of the intermediate body that is longer than a length in a vertical direction of the intermediate body.
The heat radiating unit according to any one of claims 1 to 4, wherein the intermediate body is formed by being heat-treated at 100 to 300 ° C after being applied to a surface of the heat radiating portion.
The intermediate body has a shear bonding strength of 100 kPa or more and a rigidity equal to or less than 1000 times the shear bonding strength of 100 kPa or more, and is bonded to the heat radiating portion. The heat dissipation unit according to any one of the items.
The at least one surface of the said intermediate body and the said thermal radiation part provides at least one of the circuit board and circuit layer which are electrically connected with the said heat generating body, The range of any one of Claim 1-6 Heat dissipation unit.
The heat dissipation unit according to any one of claims 1 to 7, wherein the heating element includes at least one of a light emitting element, a discrete element, an electronic component, a semiconductor integrated circuit, and a power device.
The heat dissipation unit according to any one of claims 1 to 8, wherein the heating element includes an element used for at least one of lighting equipment, electronic equipment, transportation equipment, and manufacturing equipment.
A heating element;
A circuit layer electrically connected to the heating element;
The heat dissipation unit according to any one of claims 1 to 9, wherein the heat dissipation unit is thermally connected to the circuit board.
A control unit for controlling the circuit board,
The lighting device is a light emitting element.
A heating element;
A circuit layer electrically connected to the heating element;
The heat dissipation unit according to any one of claims 1 to 9, wherein the heat dissipation unit is thermally connected to the circuit board.
A control unit for controlling the circuit board,
The heating element is an electronic device that is at least one of a discrete element, an electronic component, a semiconductor integrated circuit, and a power device.