JP2017520908A - 規則的なグリッドの選択的削減による縦型チャネルトランジスタ製造処理 - Google Patents
規則的なグリッドの選択的削減による縦型チャネルトランジスタ製造処理 Download PDFInfo
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- JP2017520908A JP2017520908A JP2016565657A JP2016565657A JP2017520908A JP 2017520908 A JP2017520908 A JP 2017520908A JP 2016565657 A JP2016565657 A JP 2016565657A JP 2016565657 A JP2016565657 A JP 2016565657A JP 2017520908 A JP2017520908 A JP 2017520908A
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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Abstract
Description
Claims (20)
- 縦型デバイスパターン化を提供する方法であって、
第1のリソグラフィ処理を用いて、基板上に第1のセットの複数のグリッド線および第2のセットの複数のグリッド線を含むグリッドを形成する段階と、
第2のリソグラフィ処理を用いて、前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの少なくとも1つを選択的にパターン化することにより縦型デバイスの形状を画定する段階とを備える、方法。 - 前記第1のリソグラフィ処理は、遠紫外線(DUV)リソグラフィを含み、
前記第2のリソグラフィ処理は、電子ビームリソグラフィ、超紫外線(EUV)リソグラフィ、またはこれらの任意の組み合わせを含む、請求項1に記載の方法。 - 前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線は、前記基板に対して選択的な材料を含む、請求項1または2に記載の方法。
- 前記グリッド上に第1のハードマスク層を堆積させる段階と、
前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの前記少なくとも1つの一部を露出させるべく、前記第1のハードマスク層をパターン化する段階とを更に備える、請求項1〜3のいずれか1項に記載の方法。 - 前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの前記少なくとも1つの一部を除去する段階を更に備える、請求項1〜4のいずれか1項に記載の方法。
- 前記縦型デバイスの形状は、トランジスタ、相互接続、トレンチ、またはこれらの任意の組み合わせを含む、請求項1〜5のいずれか1項に記載の方法。
- 前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちのパターン化された少なくとも1つをマスクとして用いて、前記デバイスを形成する段階を更に備える、請求項1〜6のいずれか1項に記載の方法。
- 電子デバイスを製造する方法であって、
基板上に、第1のセットの複数のグリッド線および第2のセットの複数のグリッド線を含むグリッドを形成する段階と、
前記グリッドにわたって第1のハードマスク層を堆積させる段階と、
前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの少なくとも1つの一部を露出させるべく、前記第1のハードマスク層をパターン化する段階とを備える、方法。 - 前記基板の一部を露出させるべく、前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの前記少なくとも1つの前記一部を除去する段階を更に備える、請求項8に記載の方法。
- デバイス形状を形成するべく、パターン化された前記グリッドをマスクとして用いて前記基板の前記一部をエッチングする段階を更に備える、請求項9に記載の方法。
- 前記グリッド上にスペーサを堆積させる段階と、
前記スペーサに隣接するデバイスハードマスクを堆積させる段階と、
前記基板の一部を露出させるべく前記スペーサを除去する段階とを更に備え、
前記第1のハードマスク層は、前記基板の露出された前記一部に堆積される、請求項8〜10のいずれか1項に記載の方法。 - 前記第1のハードマスク層を堆積させる段階および前記第1のハードマスク層をパターン化する段階は、全てのデバイス形状が形成されるまで反復される、請求項8〜11のいずれか1項に記載の方法。
- 前記グリッドは、第1のリソグラフィ処理を用いて形成され、
前記第1のハードマスク層は、第2のリソグラフィ処理を用いてパターン化される、請求項8〜12のいずれか1項に記載の方法。 - パターン化された前記グリッドをマスクとして用いて前記基板をエッチングする段階を更に備える、請求項8〜13のいずれか1項に記載の方法。
- 電子デバイスを製造する装置であって、
基板上に第1のセットの複数のグリッド線および第2のセットの複数のグリッド線を有するグリッドと、
前記グリッドにわたる第1のハードマスク層とを備え、
前記第1のハードマスク層は、前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの少なくとも1つの一部を露出させるべくパターン化される、装置。 - 前記第1のセットの複数のグリッド線および前記第2のセットの複数のグリッド線のうちの前記少なくとも1つの前記一部は、前記基板の一部を露出させる、請求項15に記載の装置。
- 前記基板の前記一部は、デバイス形状を形成するべく、パターン化された前記グリッドをマスクとして用いてエッチングされる、請求項15または16に記載の装置。
- 前記グリッド上のスペーサと、
前記スペーサに隣接するデバイスハードマスクとを更に備え、
前記スペーサは、前記基板の一部を露出させるべく除去され、
前記第1のハードマスク層は、前記基板の露出された前記一部に堆積される、請求項15〜17のいずれか1項に記載の装置。 - 前記グリッドは、第1のリソグラフィ処理を用いて形成され、
前記第1のハードマスク層は、第2のリソグラフィ処理を用いてパターン化される、請求項15〜18のいずれか1項に記載の装置。 - パターン化された前記グリッドは、前記基板上に形成されたデバイス形状を画定するべく、マスクとして用いられる、請求項15〜19のいずれか1項に記載の装置。
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