JP2017518434A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017518434A5 JP2017518434A5 JP2017518607A JP2017518607A JP2017518434A5 JP 2017518434 A5 JP2017518434 A5 JP 2017518434A5 JP 2017518607 A JP2017518607 A JP 2017518607A JP 2017518607 A JP2017518607 A JP 2017518607A JP 2017518434 A5 JP2017518434 A5 JP 2017518434A5
- Authority
- JP
- Japan
- Prior art keywords
- particles
- less
- composition
- composition according
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 18
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 5
- 238000004132 cross linking Methods 0.000 claims 5
- 239000002904 solvent Substances 0.000 claims 4
- -1 Si-H Chemical group 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- 239000010936 titanium Substances 0.000 claims 3
- 229910052719 titanium Inorganic materials 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 239000002923 metal particle Substances 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910000077 silane Inorganic materials 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 229910039444 MoC Inorganic materials 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910002656 O–Si–O Inorganic materials 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000003377 acid catalyst Substances 0.000 claims 1
- 125000002009 alkene group Chemical group 0.000 claims 1
- 150000001345 alkine derivatives Chemical class 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 claims 1
- 239000006229 carbon black Substances 0.000 claims 1
- 239000002646 carbon nanobud Substances 0.000 claims 1
- 229910021394 carbon nanobud Inorganic materials 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910001567 cementite Inorganic materials 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910021389 graphene Inorganic materials 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910001337 iron nitride Inorganic materials 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- SHMLZNJGRQRUSC-UHFFFAOYSA-N oxetane-2-carbonitrile Chemical compound N#CC1CCO1 SHMLZNJGRQRUSC-UHFFFAOYSA-N 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462014138P | 2014-06-19 | 2014-06-19 | |
| FI20145601 | 2014-06-19 | ||
| US62/014,138 | 2014-06-19 | ||
| FI20145601 | 2014-06-19 | ||
| PCT/FI2015/050455 WO2015193556A1 (en) | 2014-06-19 | 2015-06-22 | Composition having siloxane polymer and particle |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017518434A JP2017518434A (ja) | 2017-07-06 |
| JP2017518434A5 true JP2017518434A5 (enExample) | 2018-08-02 |
| JP6885866B2 JP6885866B2 (ja) | 2021-06-16 |
Family
ID=54934915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017518607A Active JP6885866B2 (ja) | 2014-06-19 | 2015-06-22 | シロキサンポリマー及び粒子を有する組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170137601A1 (enExample) |
| EP (1) | EP3158005A1 (enExample) |
| JP (1) | JP6885866B2 (enExample) |
| KR (1) | KR102454572B1 (enExample) |
| CN (1) | CN106612617A (enExample) |
| WO (1) | WO2015193556A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102386997B1 (ko) * | 2015-12-30 | 2022-04-14 | 엘지디스플레이 주식회사 | 투명 접착제 조성물, 투명 접착층 및 이를 포함하는 표시장치 |
| KR101841616B1 (ko) * | 2016-05-18 | 2018-03-23 | 한국과학기술원 | 반도체 나노결정 실록산 복합체 수지 조성물 및 그 제조방법 |
| CN106077688B (zh) * | 2016-05-31 | 2018-04-06 | 安徽工业大学 | 一种Sn@C@g‑C3N4纳米复合物及其制备方法 |
| US10745569B2 (en) * | 2016-10-23 | 2020-08-18 | Sepideh Pourhashem | Anti-corrosion nanocomposite coating |
| US11242883B2 (en) * | 2016-12-22 | 2022-02-08 | Nylok Llc | Fastener sealing material and method |
| KR101962107B1 (ko) * | 2017-08-07 | 2019-03-28 | 한국생산기술연구원 | 나노복합솔더의 제조방법 |
| CN108144635B (zh) * | 2018-01-16 | 2020-06-09 | 开封大学 | 一种石墨相氮化碳-硫化镉复合材料的制备方法 |
| EP3533900A1 (en) | 2018-03-02 | 2019-09-04 | Stichting Nederlandse Wetenschappelijk Onderzoek Instituten | Method and apparatus for forming a patterned layer of carbon |
| WO2019246309A1 (en) * | 2018-06-22 | 2019-12-26 | Indium Corporation | Preventing post reflow interconnect failures in vippo solder joints via utilization of adhesive material |
| CN108690355B (zh) * | 2018-06-26 | 2021-05-14 | 浙江三元电子科技有限公司 | 一种柔性热传导片及其制备方法 |
| CN109860643B (zh) * | 2019-02-22 | 2021-10-19 | 南京工程学院 | 一种芳香重氮盐表面修饰MXene负载铂的氧还原电催化剂及其制备方法 |
| CN109772423B (zh) * | 2019-03-30 | 2021-12-31 | 湖北文理学院 | 一种磷、铋共掺杂的多孔石墨相氮化碳光催化剂及其用途 |
| CN110183661A (zh) * | 2019-06-10 | 2019-08-30 | 中山大学 | 一种高耐热、高导热绝缘材料的制备方法 |
| CN110511669B (zh) * | 2019-07-12 | 2021-10-15 | 广州奥松电子股份有限公司 | 一种有机硅组合物及其固化方法 |
| KR102522180B1 (ko) * | 2019-10-30 | 2023-04-14 | 주식회사 엘지화학 | 열전도성을 갖는 실리콘 수지 조성물 |
| CN110903484B (zh) * | 2019-12-09 | 2022-02-08 | 湖南钰宏新材料科技有限公司 | 一种有机硅改性有机聚硅氮烷及由其制得的高硬度易清洁涂层 |
| WO2022025347A1 (ko) * | 2020-07-31 | 2022-02-03 | (주)디엔테크 | 구리가 함유된 실리콘 고무 조성물 |
| KR102388213B1 (ko) | 2021-12-08 | 2022-04-19 | 주식회사 엠티지 | 용접 대체용 난연성 실란트 조성물 |
| CN115894934A (zh) * | 2022-11-21 | 2023-04-04 | 江南大学 | 一种含磷聚硅氧烷及其制备方法与改性环氧树脂的应用 |
| KR102812184B1 (ko) * | 2023-12-26 | 2025-05-26 | 피씨케이(주) | 연료전지 개스킷용 접착제 조성물 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW555794B (en) * | 2000-02-29 | 2003-10-01 | Shinetsu Chemical Co | Method for the preparation of low specific gravity silicone rubber elastomers |
| JP4471524B2 (ja) * | 2001-03-15 | 2010-06-02 | 信越化学工業株式会社 | ロール成形用液状付加硬化型シリコーンゴム組成物 |
| WO2003040223A2 (en) * | 2001-11-03 | 2003-05-15 | Nanophase Technology Corporation | Nanostructured compositions |
| US7115050B2 (en) * | 2004-08-04 | 2006-10-03 | Acushnet Company | Scratch resistant coating compositions for golf equipment |
| US20060105483A1 (en) * | 2004-11-18 | 2006-05-18 | Leatherdale Catherine A | Encapsulated light emitting diodes and methods of making |
| JP2007039621A (ja) * | 2005-08-02 | 2007-02-15 | Nippon Handa Kk | 熱伝導性シリコーンオイル組成物、放熱剤および電子機器 |
| JP2007270056A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
| US8299198B2 (en) * | 2006-07-21 | 2012-10-30 | Kaneka Corporation | Polysiloxane composition, molded body obtained from the same, and optodevice member |
| JP4514058B2 (ja) * | 2006-08-30 | 2010-07-28 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| US20090088547A1 (en) | 2006-10-17 | 2009-04-02 | Rpo Pty Limited | Process for producing polysiloxanes and use of the same |
| JP2008189917A (ja) * | 2007-01-11 | 2008-08-21 | Sekisui Chem Co Ltd | 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 |
| JP5221122B2 (ja) * | 2007-12-28 | 2013-06-26 | 株式会社朝日ラバー | シリコーン樹脂基材 |
| JP2009256400A (ja) | 2008-04-11 | 2009-11-05 | Shin Etsu Chem Co Ltd | 半導体素子用シリコーン接着剤 |
| KR100980270B1 (ko) * | 2008-07-31 | 2010-09-07 | 한국과학기술원 | Ｌｅｄ 봉지용 실록산 수지 |
| WO2012093910A2 (ko) * | 2011-01-06 | 2012-07-12 | 주식회사 엘지화학 | 경화성 조성물 |
| US20130140083A1 (en) * | 2011-09-20 | 2013-06-06 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheet |
-
2015
- 2015-06-22 EP EP15750795.5A patent/EP3158005A1/en not_active Withdrawn
- 2015-06-22 CN CN201580044427.4A patent/CN106612617A/zh active Pending
- 2015-06-22 WO PCT/FI2015/050455 patent/WO2015193556A1/en not_active Ceased
- 2015-06-22 KR KR1020177001617A patent/KR102454572B1/ko active Active
- 2015-06-22 US US15/319,815 patent/US20170137601A1/en not_active Abandoned
- 2015-06-22 JP JP2017518607A patent/JP6885866B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017518434A5 (enExample) | ||
| Zhang et al. | Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles | |
| TWI425014B (zh) | A thermal polymerization-based initiator system and an adhesive composition | |
| CN110709474B (zh) | 导热性聚有机硅氧烷组合物 | |
| CN102925100B (zh) | 一种高导热性能导电银胶及其制备方法 | |
| US11041064B2 (en) | Addition-cure silicone composition | |
| KR101384914B1 (ko) | 요변성 전도성 조성물 | |
| CN111500093B (zh) | 一种利用不同极性处理剂改性的填料组合物、制备方法和应用 | |
| TW200911890A (en) | Method of changing rheology in filled resin systems using cavitation | |
| JP5895690B2 (ja) | 有機修飾無機充填材の製造方法及び有機修飾無機充填材、並びに熱伝導性シリコーン組成物 | |
| US9631069B1 (en) | Poly (cyclic butylene terephthalate) / silicon dioxide nanocomposite | |
| TWI769994B (zh) | 熱傳導性聚矽氧烷組成物的製造方法 | |
| CN104861910A (zh) | 一种石墨烯包覆无机填料环氧树脂复合胶及其制备方法 | |
| CN105400207A (zh) | 硅酮组合物 | |
| Pang et al. | Improvement of thermal stability of UV curable pressure sensitive adhesive by surface modified silica nanoparticles | |
| CN103205149A (zh) | 散热材料、散热结构及其制备方法 | |
| JP2018531816A (ja) | ３次元印刷材料および３ｄ印刷物品を作成する方法 | |
| JP2024511800A (ja) | 熱伝導性相変化材料とその用途 | |
| CN107250266B (zh) | 聚合物组合物、其制备方法、其用途和包含其的组合物 | |
| Kang et al. | Durable and thermally switchable polysilsesquioxane adhesives via dynamic covalent bonds: effect of a crosslinker on reversible chemistry | |
| KR20150118624A (ko) | 탄소 비결합성 금속 나노입자가 함유된 잉크 기제 제조 방법 및 금속 나노입자가 분산된 잉크 | |
| CN105384932A (zh) | 具有双官能和混合官能封端基的聚酰亚胺的纳米改性骨架 | |
| JP2015526559A (ja) | 液体圧縮成型封止材料 | |
| CN106753210A (zh) | 一种导热粘接硅胶 | |
| Xian et al. | Effect of nanodiamonds and multi‐walled carbon nanotubes in thermoset hybrid fillers system: Rheology, dynamic mechanical analysis, and thermal stability |