JP2018531816A - 3次元印刷材料および3d印刷物品を作成する方法 - Google Patents
3次元印刷材料および3d印刷物品を作成する方法 Download PDFInfo
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- JP2018531816A JP2018531816A JP2018518481A JP2018518481A JP2018531816A JP 2018531816 A JP2018531816 A JP 2018531816A JP 2018518481 A JP2018518481 A JP 2018518481A JP 2018518481 A JP2018518481 A JP 2018518481A JP 2018531816 A JP2018531816 A JP 2018531816A
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- siloxane
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- 238000000034 method Methods 0.000 title claims abstract description 44
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- 239000000203 mixture Substances 0.000 claims description 62
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- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- VQTPBGMQDVXUBG-UHFFFAOYSA-N triethoxy-[3-[(3-methyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(C)COC1 VQTPBGMQDVXUBG-UHFFFAOYSA-N 0.000 description 1
- LQASLKRKZDJCBO-UHFFFAOYSA-N trimethoxy(3-trimethoxysilylpropyl)silane Chemical compound CO[Si](OC)(OC)CCC[Si](OC)(OC)OC LQASLKRKZDJCBO-UHFFFAOYSA-N 0.000 description 1
- OTRIBZPALGOVNZ-UHFFFAOYSA-N trimethoxy(4-trimethoxysilylbutyl)silane Chemical compound CO[Si](OC)(OC)CCCC[Si](OC)(OC)OC OTRIBZPALGOVNZ-UHFFFAOYSA-N 0.000 description 1
- MAFPECYMNWKRHR-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCCC[Si](OC)(OC)OC MAFPECYMNWKRHR-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- MENIETLCJFEARZ-UHFFFAOYSA-N trimethoxy-(1-trimethoxysilylnaphthalen-2-yl)silane Chemical compound C1=CC=CC2=C([Si](OC)(OC)OC)C([Si](OC)(OC)OC)=CC=C21 MENIETLCJFEARZ-UHFFFAOYSA-N 0.000 description 1
- WHONTYJRQLSKKW-UHFFFAOYSA-N trimethoxy-(1-trimethoxysilylphenanthren-2-yl)silane Chemical compound CO[Si](OC)(OC)C1=C(C=2C=CC3=CC=CC=C3C=2C=C1)[Si](OC)(OC)OC WHONTYJRQLSKKW-UHFFFAOYSA-N 0.000 description 1
- YIRZROVNUPFFNZ-UHFFFAOYSA-N trimethoxy-(4-trimethoxysilylphenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=C([Si](OC)(OC)OC)C=C1 YIRZROVNUPFFNZ-UHFFFAOYSA-N 0.000 description 1
- IBAMSHCJLNQXNI-UHFFFAOYSA-N trimethoxy-[3-[(3-methyloxetan-3-yl)methoxy]propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1(C)COC1 IBAMSHCJLNQXNI-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
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Classifications
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
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- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
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- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
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- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- B33Y80/00—Products made by additive manufacturing
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
- C04B26/32—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
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Abstract
Description
以下の組成物例は、例示のために提供するものであり、本発明を限定することを意図しない。
前記導電性材料および電気絶縁性材料は、両方とも、電磁放射または熱により堆積時に硬化するシロキサンポリマーを含む、3次元印刷プロセス。
導電性でシロキサンポリマー材料を含む第2部分とを含む、3D印刷物品。
入射する可視光の少なくとも85%を透過する第2部分とを含み、
前記第1部分と前記第2部分は異なる屈折率を有する、3D印刷物品。
前記部分は波長632.8nmで1.55超の屈折率を有し、0.01未満の光複屈折を有し、例えば、屈折率は1.65以上、例えば1.70〜1.95である、3D印刷物品。
Claims (41)
- 3D印刷物品を形成するように、導電性材料および電気絶縁性材料を同時にまたは連続的に堆積させるステップを含み;
前記導電性材料および電気絶縁性材料は、両方とも、電磁放射または熱により堆積時に硬化するシロキサンポリマーを含む、3次元印刷プロセス。 - 前記導電性シロキサンポリマーは熱により硬化し、前記電気絶縁性シロキサンポリマーはUV光により硬化する、請求項1に記載のプロセス。
- 前記導電性シロキサンポリマーは、熱およびUV光により硬化する、請求項2または3に記載のプロセス。
- 前記導電性シロキサンポリマーは粒子を含む、前述の請求項のいずれかに記載のプロセス。
- 前記粒子は金属粒子である、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサンポリマーは粒子を含む、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサンポリマー中の粒子は、窒化物粒子または酸化物粒子である、前述の請求項のいずれかに記載のプロセス。
- 前記3D印刷物品の電気絶縁性材料と導電性材料の間の熱膨張率の差が10%未満である、前述の請求項のいずれかに記載のプロセス。
- 前記熱膨張率の差が5%未満である、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサン中の粒子は、ケイ素、亜鉛、アルミニウム、イットリウム、イッテルビウム、タングステン、チタンシリコン、チタン、アンチモン、サマリウム、ニッケル、ニッケルコバルト、モリブデン、マグネシウム、マンガン、ランタニド、鉄、インジウムスズ、銅、コバルトアルミニウム、クロム、セシウムまたはカルシウムの酸化物を含む、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサン中の粒子は、シリカ、石英、アルミナ、窒化アルミニウム、シリカで被覆された窒化アルミニウム、硫酸バリウム、三水和アルミナ、または窒化ホウ素を含む、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサン中の粒子は窒化物粒子であり、窒化アルミニウム、窒化タンタル、窒化ホウ素、窒化チタン、窒化銅、窒化モリブデン、窒化タングステン、窒化鉄、窒化ケイ素、窒化インジウム、窒化ガリウム、または窒化炭素を含む、前述の請求項のいずれかに記載のプロセス。
- 前記導電性シロキサン中の粒子は、金、銀、銅、白金、パラジウム、インジウム、鉄、ニッケル、アルミニウム、炭素、コバルト、ストロンチウム、亜鉛、モリブデン、チタニウム、タングステン、銀メッキ銅、銀メッキアルミニウム、ビスマス、スズ、もしくは合金、またはそれらの組み合わせを含む、前述の請求項のいずれかに記載のプロセス。
- 前記導電性シロキサン内に粒子の第1群および粒子の第2群が提供され、前記第1群は、前記第2群とは平均粒子径、形、および/または組成が異なる、前述の請求項のいずれかに記載のプロセス。
- 前記粒子の第1群は500nm超の平均粒子径を有し、前記粒子の第2群は200nm未満の平均粒子径を有する、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサンは粒子を含む、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサンは、粒子の第1群および粒子の第2群を含み、前記第1群は、前記第2群とは平均粒子径、形、および/または組成が異なる、前述の請求項のいずれかに記載のプロセス。
- 前記電気絶縁性シロキサンは可視光に対し透過性であり、その結果、入射する光の少なくとも85%を透過する、前述の請求項のいずれかに記載のプロセス。
- 前記3D物品は、モジュール式のスマートフォン、タブレット、またはラップトップである、前述の請求項のいずれかに記載のプロセス。
- 請求項1〜19のいずれかに記載のプロセスにより形成される物品。
- 電気絶縁性でシロキサンポリマー材料を含む第1部分と;
導電性でシロキサンポリマー材料を含む第2部分とを含む、3D印刷物品。 - 前記第2部分は金属粒子を含む、請求項21に記載の物品。
- 前記第1部分はセラミック粒子を含む、請求項21または22に記載の物品。
- 前記電気絶縁性第1部分は、入射する可視光の少なくとも85%を透過する光透過性部分である、請求項21〜23のいずれかに記載の物品。
- 前記電気絶縁性第1部分は、色の異なるサブ部分を含む、請求項21〜24のいずれかに記載の物品。
- 前記電気絶縁性第1部分は、屈折率が異なる光透過性のサブ部分を含む、請求項21〜25のいずれかに記載の物品。
- 前記電気絶縁性部分は、電気デバイス内の電気的接続である、請求項21〜26のいずれかに記載の物品。
- 前記電気デバイスはスマートフォン、タブレット、またはラップトップである、請求項21〜27のいずれかに記載の物品。
- 前記第1部分と前記第2部分の両方が粒子を含む、請求項21〜28のいずれかに記載の物品。
- 前記第1部分の粒子は、前記第2部分の粒子とは異なる、請求項21〜29のいずれかに記載の物品。
- 中に粒子の第1群と粒子の第2群を有する硬化シロキサン材料を含み、
前記第1群は、前記第2群とは平均粒子径、形、または粒子材料が異なる、3D印刷物品。 - 入射する可視光の少なくとも85%を透過する第1部分と;
入射する可視光の少なくとも85%を透過する第2部分とを含み、
前記第1部分と前記第2部分は異なる屈折率を有する、3D印刷物品。 - 前記第1部分と第2部分は互いに直接接触している、請求項32に記載の物品。
- 光透過性であり、入射する可視光の少なくとも85%を透過する第1部分を含み、前記第1部分は波長632.8nmで1.4未満の屈折率を有し、0.01未満の光複屈折を有する、3D印刷物品。
- 前記屈折率が1.3未満である、請求項34に記載の物品。
- 前記第1部分は粒子を含む、請求項34または35に記載の物品。
- 前記粒子は400nm未満の平均粒子径を有する、請求項34〜36のいずれかに記載の物品。
- 前記粒子は100nm未満の平均粒子径を有する、請求項34〜36のいずれかに記載の物品。
- 入射する可視光の少なくとも85%を透過する光透過性部分を含み、
前記部分は波長632.8nmで1.55超の屈折率を有し、0.01未満の光複屈折を有する、3D印刷物品。 - 前記屈折率が1.65以上である、請求項39に記載の物品。
- 前記屈折率が1.70〜1.95である、請求項39または40に記載の物品。
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US11945935B2 (en) | 2019-05-08 | 2024-04-02 | Saint-Gobain Performance Plastics Corporation | Hydrophilic polymer compositions |
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