JP2017512252A5 - - Google Patents

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Publication number
JP2017512252A5
JP2017512252A5 JP2016552500A JP2016552500A JP2017512252A5 JP 2017512252 A5 JP2017512252 A5 JP 2017512252A5 JP 2016552500 A JP2016552500 A JP 2016552500A JP 2016552500 A JP2016552500 A JP 2016552500A JP 2017512252 A5 JP2017512252 A5 JP 2017512252A5
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JP
Japan
Prior art keywords
substrate
target
laser
incident position
deposition
Prior art date
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Application number
JP2016552500A
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English (en)
Japanese (ja)
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JP2017512252A (ja
JP6674898B2 (ja
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Publication date
Priority claimed from EP14156256.1A external-priority patent/EP2910664B1/en
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Publication of JP2017512252A publication Critical patent/JP2017512252A/ja
Publication of JP2017512252A5 publication Critical patent/JP2017512252A5/ja
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Publication of JP6674898B2 publication Critical patent/JP6674898B2/ja
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JP2016552500A 2014-02-21 2015-02-18 パルスレーザ堆積による材料堆積装置及びその装置を用いた材料堆積方法 Active JP6674898B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14156256.1 2014-02-21
EP14156256.1A EP2910664B1 (en) 2014-02-21 2014-02-21 Device for depositing a material by pulsed laser deposition and a method for depositing a material with the device
PCT/EP2015/053356 WO2015124589A1 (en) 2014-02-21 2015-02-18 Device for depositing a material by pulsed laser deposition and a method for depositing a material with the device

Publications (3)

Publication Number Publication Date
JP2017512252A JP2017512252A (ja) 2017-05-18
JP2017512252A5 true JP2017512252A5 (enExample) 2018-03-29
JP6674898B2 JP6674898B2 (ja) 2020-04-01

Family

ID=50159093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016552500A Active JP6674898B2 (ja) 2014-02-21 2015-02-18 パルスレーザ堆積による材料堆積装置及びその装置を用いた材料堆積方法

Country Status (6)

Country Link
EP (1) EP2910664B1 (enExample)
JP (1) JP6674898B2 (enExample)
KR (1) KR102321884B1 (enExample)
CN (1) CN106029942B (enExample)
TW (1) TWI696717B (enExample)
WO (1) WO2015124589A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105803404A (zh) * 2016-03-25 2016-07-27 武汉华星光电技术有限公司 薄膜沉积组件及薄膜沉积装置
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
WO2019185187A1 (en) * 2018-03-28 2019-10-03 Applied Materials, Inc. Method for vacuum processing of a substrate, and apparatus for vacuum processing of a substrate
EP3916122A1 (en) * 2020-05-28 2021-12-01 Solmates B.V. Method for controlling stress in a substrate during laser deposition
CN117626192A (zh) * 2022-08-10 2024-03-01 中国科学院上海硅酸盐研究所 一种薄膜沉积装置和薄膜沉积方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3914476C1 (enExample) * 1989-05-02 1990-06-21 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
KR100222580B1 (ko) * 1995-12-28 1999-10-01 김덕중 대면적 다이아몬드 박막의 고속증착 제조장치 및 그 제조방법
US6063455A (en) * 1995-10-09 2000-05-16 Institute For Advanced Engineering Apparatus for manufacturing diamond film having a large area and method thereof
US6090207A (en) * 1998-04-02 2000-07-18 Neocera, Inc. Translational target assembly for thin film deposition system
AUPR026100A0 (en) * 2000-09-20 2000-10-12 Tamanyan, Astghik Deposition of thin films by laser ablation
US7879410B2 (en) * 2004-06-09 2011-02-01 Imra America, Inc. Method of fabricating an electrochemical device using ultrafast pulsed laser deposition
FI20050216A0 (fi) * 2005-02-23 2005-02-23 Ruuttu Jari Menetelmä valmistaa timanttia, muita jalokiviä, kuten safiiria, rubiinia jne. ja suorittaa näillä pinnoituksia sekä suorittaa pinnoituksia muilla aineilla, kuten boriideillä, oksideillä, nitrideillä jne.
JP5414279B2 (ja) * 2006-02-23 2014-02-12 ピコデオン エルティーディー オイ 半導体ならびに半導体を生産する装置および方法
ES2378906T3 (es) * 2008-08-25 2012-04-19 Solmates B.V. Método para depositar un material
KR101219225B1 (ko) * 2010-07-15 2013-01-18 국립대학법인 울산과학기술대학교 산학협력단 펄스 레이저 증착장치
TWI433948B (zh) * 2012-01-31 2014-04-11 Univ Nat Chi Nan A radio frequency plasma assisted pulsed laser deposition system and a method for preparing a thin film from its system

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