JP2017510997A5 - - Google Patents

Download PDF

Info

Publication number
JP2017510997A5
JP2017510997A5 JP2016561774A JP2016561774A JP2017510997A5 JP 2017510997 A5 JP2017510997 A5 JP 2017510997A5 JP 2016561774 A JP2016561774 A JP 2016561774A JP 2016561774 A JP2016561774 A JP 2016561774A JP 2017510997 A5 JP2017510997 A5 JP 2017510997A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
lighting device
encapsulant material
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016561774A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017510997A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/024526 external-priority patent/WO2015157178A1/en
Publication of JP2017510997A publication Critical patent/JP2017510997A/ja
Publication of JP2017510997A5 publication Critical patent/JP2017510997A5/ja
Pending legal-status Critical Current

Links

JP2016561774A 2014-04-07 2015-04-06 紫外線発光デバイスおよび方法 Pending JP2017510997A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461976064P 2014-04-07 2014-04-07
US61/976,064 2014-04-07
PCT/US2015/024526 WO2015157178A1 (en) 2014-04-07 2015-04-06 Ultraviolet light-emitting devices and methods

Publications (2)

Publication Number Publication Date
JP2017510997A JP2017510997A (ja) 2017-04-13
JP2017510997A5 true JP2017510997A5 (https=) 2018-05-10

Family

ID=54210491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016561774A Pending JP2017510997A (ja) 2014-04-07 2015-04-06 紫外線発光デバイスおよび方法

Country Status (5)

Country Link
US (3) US9293670B2 (https=)
EP (1) EP3130011A4 (https=)
JP (1) JP2017510997A (https=)
CN (1) CN106104821A (https=)
WO (1) WO2015157178A1 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016503342A (ja) 2012-11-13 2016-02-04 バイオレット ディフェンス テクノロジ インク 紫外光を放出するためのデバイス
US9412911B2 (en) 2013-07-09 2016-08-09 The Silanna Group Pty Ltd Optical tuning of light emitting semiconductor junctions
WO2015157178A1 (en) * 2014-04-07 2015-10-15 Crystal Is, Inc. Ultraviolet light-emitting devices and methods
US11322643B2 (en) 2014-05-27 2022-05-03 Silanna UV Technologies Pte Ltd Optoelectronic device
JP6817072B2 (ja) 2014-05-27 2021-01-20 シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドＳｉｌａｎｎａ Ｕｖ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｐｔｅ Ｌｔｄ 光電子デバイス
CN106415854B (zh) 2014-05-27 2019-10-01 斯兰纳Uv科技有限公司 包括n型和p型超晶格的电子装置
KR102318317B1 (ko) 2014-05-27 2021-10-28 실라나 유브이 테크놀로지스 피티이 리미티드 반도체 구조물과 초격자를 사용하는 진보된 전자 디바이스 구조
US10256378B2 (en) 2015-05-28 2019-04-09 Sumitomo Chemical Company, Limited LED device, LED module and ultraviolet light emitting device
US9540252B1 (en) 2015-06-08 2017-01-10 Rayvio Corporation Ultraviolet disinfection system
US10246348B2 (en) 2015-06-08 2019-04-02 Rayvio Corporation Ultraviolet disinfection system
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
WO2017080461A1 (zh) * 2015-11-10 2017-05-18 亿光电子工业股份有限公司 发光二极管装置与其制作方法
US10381523B2 (en) * 2015-12-30 2019-08-13 Rayvio Corporation Package for ultraviolet emitting devices
WO2017145026A1 (en) 2016-02-23 2017-08-31 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
US10418517B2 (en) 2016-02-23 2019-09-17 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
JP2017157593A (ja) * 2016-02-29 2017-09-07 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法
US10403792B2 (en) 2016-03-07 2019-09-03 Rayvio Corporation Package for ultraviolet emitting devices
CN105982611A (zh) * 2016-04-14 2016-10-05 北京小米移动软件有限公司 自主清洁设备
US20180006203A1 (en) * 2016-07-01 2018-01-04 Rayvio Corporation Ultraviolet emitting device
TWI613254B (zh) 2016-12-13 2018-02-01 Nanya Plastics Corp 一種熱固性樹脂組成物
JP2018097351A (ja) * 2016-12-15 2018-06-21 パナソニックＩｐマネジメント株式会社 発光素子及び発光素子の製造方法
DE112018000619T5 (de) * 2017-01-31 2020-03-05 Crystal Is, Inc. Verfahren und Gehäuse zur Verbesserung der Zuverlässigkeit von Ultraviolettlicht-emittierenden Vorrichtungen
EP3396725B1 (en) 2017-04-25 2021-01-13 Nichia Corporation Light emitting device and method of manufacturing same
TWI751274B (zh) * 2017-06-14 2022-01-01 大陸商光寶光電（常州）有限公司 紫外線發光二極體封裝結構及其製造方法
US12274102B2 (en) * 2017-06-14 2025-04-08 Lite-On Opto Technology (Changzhou) Co., Ltd. Package structure
DE102017120385B4 (de) 2017-09-05 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
DE112018005414T5 (de) 2017-11-10 2020-07-09 Crystal Is, Inc. Große, UV-Transparente Aluminiumnitrid-Einkristalle und Verfahren zu ihrer Herstellung
DE112019003108B4 (de) 2018-06-19 2024-05-23 Crystal Is, Inc. Verfahren zur Verbesserung der Ultraviolett-(UV-)Transparenz eines einkristallinen AlN-Volumenkristalls, einkristalliner AlN Volumenkristall mit verbesserter Ultraviolett-(UV)-Transparenz, Verfahren zur Herstellung von einkristallinem Aluminiumnitrid (AlN), einkristallines Aluminiumnitrid (AlN), AlN-Einkristall, Verwendung eines AlN-Einkristalls für die Herstellung einer lichtemittierende Diode (LED) und polykristalline AlN-Keramik
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
EP3633716A1 (en) * 2018-10-05 2020-04-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Package with embedded electronic component being encapsulated in a pressureless way
US10622514B1 (en) 2018-10-15 2020-04-14 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
EP3905317B1 (en) * 2018-12-26 2022-10-05 NISSAN MOTOR Co., Ltd. Semiconductor device
CN110459663A (zh) * 2019-06-28 2019-11-15 广东晶科电子股份有限公司 一种led器件及其制作方法
CN114667371B (zh) 2019-08-15 2025-05-13 晶化成半导体公司 氮化铝晶体的扩径
CN110690336B (zh) * 2019-10-15 2020-12-25 德润规划设计院(深圳)有限公司 一种节能型led照明装置及其制造方法
CN114761046B (zh) * 2019-10-22 2024-07-30 Uv合伙有限公司 用于uv处理的光学特性和方法
JP7397687B2 (ja) * 2020-01-22 2023-12-13 スタンレー電気株式会社 深紫外光を発する発光装置及びそれを用いた水殺菌装置
US20210338860A1 (en) 2020-05-01 2021-11-04 Uv Innovators, Llc Ultraviolet (uv) light emission device employing visible light for operation guidance, and related methods of use, particularly suited for decontamination
US20220077353A1 (en) * 2020-09-08 2022-03-10 Tek Beng Low Light emitting diode package having a small light emitting surface
JP7185157B2 (ja) * 2020-12-25 2022-12-07 日亜化学工業株式会社 発光モジュール及び発光モジュールの製造方法
US20230129699A1 (en) * 2021-10-22 2023-04-27 Texas Instruments Incorporated Ic package with interface region
JP7445854B2 (ja) * 2021-10-27 2024-03-08 日亜化学工業株式会社 発光モジュール
JP7779762B2 (ja) * 2022-02-21 2025-12-03 スタンレー電気株式会社 半導体発光装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638346B2 (en) 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
DE10308866A1 (de) * 2003-02-28 2004-09-09 Osram Opto Semiconductors Gmbh Beleuchtungsmodul und Verfahren zu dessen Herstellung
JP2005317881A (ja) * 2004-04-30 2005-11-10 Citizen Electronics Co Ltd 発光ダイオード
US20060138443A1 (en) * 2004-12-23 2006-06-29 Iii-N Technology, Inc. Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
EP1964181B1 (en) * 2005-12-22 2019-08-14 (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. Photovoltaic device and method of encapsulating
US7928462B2 (en) 2006-02-16 2011-04-19 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
JP3863174B2 (ja) * 2006-05-08 2006-12-27 東芝電子エンジニアリング株式会社 発光装置
JP2007311707A (ja) * 2006-05-22 2007-11-29 Ushio Inc 紫外線発光素子パッケージ
US7804147B2 (en) * 2006-07-31 2010-09-28 Cree, Inc. Light emitting diode package element with internal meniscus for bubble free lens placement
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
JP4915869B2 (ja) * 2007-10-17 2012-04-11 日東電工株式会社 光半導体装置の製造方法
CA2717676C (en) * 2008-03-20 2017-12-12 Hoeganaes Ab (Publ) Ferromagnetic powder composition and method for its production
KR101639793B1 (ko) * 2008-09-25 2016-07-15 코닌클리케 필립스 엔.브이. 코팅된 발광 장치 및 그 코팅 방법
US20100123386A1 (en) * 2008-11-13 2010-05-20 Maven Optronics Corp. Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices
US20100123356A1 (en) * 2008-11-14 2010-05-20 General Electric Company Resonance mitigation system and method
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
JP5278023B2 (ja) * 2009-02-18 2013-09-04 日亜化学工業株式会社 発光装置の製造方法
DE102009025266B4 (de) * 2009-06-17 2015-08-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
US20110062469A1 (en) * 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element
US8217406B2 (en) 2009-12-02 2012-07-10 Abl Ip Holding Llc Solid state light emitter with pumped nanophosphors for producing high CRI white light
DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
US8299545B2 (en) 2010-01-28 2012-10-30 International Business Machines Corporation Method and structure to improve body effect and junction capacitance
DE102010011428A1 (de) * 2010-03-15 2011-09-15 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP2011204376A (ja) * 2010-03-24 2011-10-13 Stanley Electric Co Ltd 半導体発光装置
JP5622494B2 (ja) * 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
JP2012138435A (ja) * 2010-12-27 2012-07-19 Panasonic Corp 発光素子用パッケージ
CN102683543B (zh) * 2011-03-15 2015-08-12 展晶科技(深圳)有限公司 Led封装结构
KR20120108437A (ko) * 2011-03-24 2012-10-05 삼성전자주식회사 발광소자 패키지
US8962359B2 (en) * 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
JP5956167B2 (ja) * 2012-01-23 2016-07-27 スタンレー電気株式会社 発光装置、車両用灯具及び発光装置の製造方法
US8896010B2 (en) * 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
US20130187540A1 (en) * 2012-01-24 2013-07-25 Michael A. Tischler Discrete phosphor chips for light-emitting devices and related methods
JP5883662B2 (ja) * 2012-01-26 2016-03-15 スタンレー電気株式会社 発光装置
US9240524B2 (en) * 2012-03-05 2016-01-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR20130104628A (ko) * 2012-03-14 2013-09-25 서울반도체 주식회사 Ｌｅｄ 조명 모듈
WO2013147195A1 (ja) * 2012-03-30 2013-10-03 三菱化学株式会社 半導体発光装置、及び照明装置
JP5874532B2 (ja) * 2012-05-21 2016-03-02 Nok株式会社 殺菌装置
US20140105784A1 (en) * 2012-10-15 2014-04-17 Sharp Kabushiki Kaisha Ultraviolet treatment device
JP6275817B2 (ja) 2013-03-15 2018-02-07 クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. 仮像電子及び光学電子装置に対する平面コンタクト
WO2015157178A1 (en) * 2014-04-07 2015-10-15 Crystal Is, Inc. Ultraviolet light-emitting devices and methods

Similar Documents

Publication Publication Date Title
JP2017510997A5 (https=)
US10383963B2 (en) Ultraviolet light-emitting devices and methods
TW200637031A (en) Compact light emitting device package with enhanced heat dissipation and method for making the package
JP2017034218A5 (https=)
CN104167411A (zh) 一种led阵列结构
WO2013053195A1 (zh) 具胶墙的发光二极管封装方法
JP2016092410A (ja) 発光素子パッケージ、及びこれを含む照明システム
JP6800703B2 (ja) 半導体発光装置
JP2016072263A (ja) 発光モジュールおよび照明装置
JP2014072520A5 (https=)
KR20120100626A (ko) 발광소자 패키지 및 그 제조 방법
JP6256700B2 (ja) 発光装置
RU142036U1 (ru) Ультрафиолетовый излучающий диод
JP6155932B2 (ja) 発光装置
KR20160146366A (ko) 발광 다이오드 패키지
JP2018078170A (ja) 半導体発光装置
US20130026515A1 (en) Led package with a fresnel lens
KR20160050341A (ko) 발광 소자 패키지 및 그의 제조 방법
KR101616474B1 (ko) 발광 소자 패키지 및 그의 제조 방법
KR102650690B1 (ko) Uv led 패키지
JP2012089606A (ja) 光装置
KR101466477B1 (ko) 발광 디바이스 제조방법
TWM606056U (zh) 發光二極體的結構
KR101900647B1 (ko) 치과 진료용 조명장치
US20130026902A1 (en) Led package for increasing illumination and spotlighting