JP2017509500A5 - - Google Patents

Download PDF

Info

Publication number
JP2017509500A5
JP2017509500A5 JP2016558346A JP2016558346A JP2017509500A5 JP 2017509500 A5 JP2017509500 A5 JP 2017509500A5 JP 2016558346 A JP2016558346 A JP 2016558346A JP 2016558346 A JP2016558346 A JP 2016558346A JP 2017509500 A5 JP2017509500 A5 JP 2017509500A5
Authority
JP
Japan
Prior art keywords
protrusions
cmp
elongated
front surface
conditioning segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016558346A
Other languages
English (en)
Japanese (ja)
Other versions
JP6542793B2 (ja
JP2017509500A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/021679 external-priority patent/WO2015143278A1/en
Publication of JP2017509500A publication Critical patent/JP2017509500A/ja
Publication of JP2017509500A5 publication Critical patent/JP2017509500A5/ja
Application granted granted Critical
Publication of JP6542793B2 publication Critical patent/JP6542793B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016558346A 2014-03-21 2015-03-20 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ Active JP6542793B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21
PCT/US2015/021679 WO2015143278A1 (en) 2014-03-21 2015-03-20 Chemical mechanical planarization pad conditioner with elongated cutting edges

Publications (3)

Publication Number Publication Date
JP2017509500A JP2017509500A (ja) 2017-04-06
JP2017509500A5 true JP2017509500A5 (enExample) 2018-05-10
JP6542793B2 JP6542793B2 (ja) 2019-07-10

Family

ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016558346A Active JP6542793B2 (ja) 2014-03-21 2015-03-20 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ

Country Status (6)

Country Link
US (1) US10293463B2 (enExample)
JP (1) JP6542793B2 (enExample)
KR (1) KR102304574B1 (enExample)
CN (1) CN106463379B (enExample)
TW (1) TWI666091B (enExample)
WO (1) WO2015143278A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
JP6316460B2 (ja) * 2016-01-08 2018-04-25 バンドー化学株式会社 研磨材
US11370082B2 (en) 2016-04-06 2022-06-28 M Cubed Technologies, Inc. Diamond composite CMP pad conditioner
US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
US20190351527A1 (en) 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12208487B2 (en) * 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
JP7645802B2 (ja) * 2019-02-13 2025-03-14 スリーエム イノベイティブ プロパティズ カンパニー 精密に成形された特徴部を有する研磨要素、同研磨要素から製造された研磨物品、及び同研磨物品の製造方法
KR20210137580A (ko) * 2019-04-09 2021-11-17 엔테그리스, 아이엔씨. 디스크를 위한 세그먼트 설계
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
US6302770B1 (en) * 1998-07-28 2001-10-16 Nikon Research Corporation Of America In-situ pad conditioning for CMP polisher
JP2001157967A (ja) 1999-11-29 2001-06-12 Mitsubishi Materials Corp 単層砥石
KR100387954B1 (ko) 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6390909B2 (en) * 2000-04-03 2002-05-21 Rodel Holdings, Inc. Disk for conditioning polishing pads
JP2002337050A (ja) * 2001-03-13 2002-11-26 Mitsubishi Materials Corp Ｃｍｐコンディショナ
KR20050075280A (ko) 2002-11-19 2005-07-20 가부시키가이샤 이시카와 세이사쿠쇼 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판
US20060130627A1 (en) * 2003-01-15 2006-06-22 Mitsubishi Materials Corporation Cutting tool for soft material
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
CN1938128A (zh) 2004-03-31 2007-03-28 三菱综合材料株式会社 Cmp调节器
US7799375B2 (en) 2004-06-30 2010-09-21 Poco Graphite, Inc. Process for the manufacturing of dense silicon carbide
JP4145273B2 (ja) * 2004-07-14 2008-09-03 株式会社ノリタケスーパーアブレーシブ Ｃｍｐパッドコンディショナー
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
KR101293461B1 (ko) * 2005-08-25 2013-08-07 이시즈카히로시 소결체 연마부가 구비된 공구 및 그 제조 방법
US7300338B2 (en) * 2005-09-22 2007-11-27 Abrasive Technology, Inc. CMP diamond conditioning disk
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
JP4441552B2 (ja) * 2006-07-31 2010-03-31 メゾテクダイヤ株式会社 ダイヤモンドコンディショナ
US20170232576A1 (en) * 2006-11-16 2017-08-17 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
JP2008229820A (ja) * 2007-03-23 2008-10-02 Elpida Memory Inc Ｃｍｐ加工用のドレッサ及びｃｍｐ加工装置並びにｃｍｐ加工用の研磨パッドのドレッシング処理方法
KR20100106328A (ko) * 2007-11-13 2010-10-01 치엔 민 성 Ｃｍｐ 패드 드레서
JP2009241200A (ja) * 2008-03-31 2009-10-22 Mitsubishi Materials Corp Ｃｍｐコンディショナ
EP2474025A2 (en) * 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
JP5871904B2 (ja) 2010-04-12 2016-03-01 イコニクス コーポレーションＩｋｏｎｉｃｓ Ｃｏｒｐｏｒａｔｉｏｎ アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法
CN101972995B (zh) 2010-06-08 2013-05-01 沈阳理工大学 一种仿生表面结构抛光垫及制造方法
CN103688343B (zh) 2011-03-07 2016-09-07 恩特格里公司 化学机械抛光垫修整器
KR101211138B1 (ko) * 2011-03-07 2012-12-11 이화다이아몬드공업 주식회사 연약패드용 컨디셔너 및 그 제조방법
KR101144981B1 (ko) * 2011-05-17 2012-05-11 삼성전자주식회사 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법
JP6468999B2 (ja) 2012-05-04 2019-02-13 インテグリス・インコーポレーテッド 化学機械研磨パッドコンディショナ
TWI564116B (zh) * 2013-08-12 2017-01-01 Sapphire polishing pad dresser with multiple trimmed pellets

Similar Documents

Publication Publication Date Title
US10081747B2 (en) Multilayer abrasive particle
FI3558593T3 (fi) Hiomatuote, jossa on erilaisia hiomahiukkasten joukkoja
WO2011028556A3 (en) Structured abrasive article and method of using the same
US10105897B2 (en) Method for calculating support structures and support elements for attaching a support strut of same
KR20160136404A (ko) 세장형 절삭 에지를 갖는 화학 기계 평탄화 패드 컨디셔너
MX2020013934A (es) Particulas abrasivas con formas particulares y metodos para elaborar las particulas.
JP2017500217A5 (enExample)
RU2016142723A (ru) Абразивное изделие с покрытием
EP3267471A3 (en) Semiconductor device and method of manufacturing the same
JP2011529626A5 (enExample)
TWD178425S (zh) 用於半導體製造設備的電極板
JP2015041700A5 (enExample)
JP2018535104A5 (enExample)
JP2018520895A5 (enExample)
JP2004524697A5 (enExample)
RU2018116019A (ru) Система и способ определения направления и пространственного разнесения траекторий волокон для композитного слоя
WO2005113197A3 (en) Abrasive material and method of forming same
ATE427189T1 (de) Schleifmaterial und herstellungsverfahren dafur
EP3029497A3 (en) Wire grid polarizer, display device including the same, and method of fabricating the same
RU2018146487A (ru) Зимняя шина
JP2016107970A5 (enExample)
CN103281677A (zh) 一种基于移动锚节点的室内三维空间定位系统和方法
RU2017123019A (ru) Пневматическая шина
RU2017102183A (ru) Режущее устройство
JP2017113282A5 (enExample)