JP2014510645A5 - - Google Patents
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- Publication number
- JP2014510645A5 JP2014510645A5 JP2013557810A JP2013557810A JP2014510645A5 JP 2014510645 A5 JP2014510645 A5 JP 2014510645A5 JP 2013557810 A JP2013557810 A JP 2013557810A JP 2013557810 A JP2013557810 A JP 2013557810A JP 2014510645 A5 JP2014510645 A5 JP 2014510645A5
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- pad conditioner
- mechanical polishing
- chemical mechanical
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 15
- 239000000126 substance Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 12
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 229910003460 diamond Inorganic materials 0.000 claims 4
- 239000010432 diamond Substances 0.000 claims 4
- 239000011148 porous material Substances 0.000 claims 4
- 230000005484 gravity Effects 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161449851P | 2011-03-07 | 2011-03-07 | |
| US61/449,851 | 2011-03-07 | ||
| US201161506483P | 2011-07-11 | 2011-07-11 | |
| US61/506,483 | 2011-07-11 | ||
| US201161513294P | 2011-07-29 | 2011-07-29 | |
| US61/513,294 | 2011-07-29 | ||
| PCT/US2012/027916 WO2012122186A2 (en) | 2011-03-07 | 2012-03-06 | Chemical mechanical planarization pad conditioner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014510645A JP2014510645A (ja) | 2014-05-01 |
| JP2014510645A5 true JP2014510645A5 (enExample) | 2015-04-23 |
| JP6133218B2 JP6133218B2 (ja) | 2017-05-24 |
Family
ID=46798753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557810A Active JP6133218B2 (ja) | 2011-03-07 | 2012-03-06 | 化学機械平坦化パッドコンディショナー |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9132526B2 (enExample) |
| EP (1) | EP2684211B1 (enExample) |
| JP (1) | JP6133218B2 (enExample) |
| KR (1) | KR101916492B1 (enExample) |
| CN (1) | CN103688343B (enExample) |
| SG (1) | SG193340A1 (enExample) |
| TW (1) | TWI592258B (enExample) |
| WO (1) | WO2012122186A2 (enExample) |
Families Citing this family (58)
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|---|---|---|---|---|
| US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
| EP2684211B1 (en) * | 2011-03-07 | 2017-01-18 | Entegris, Inc. | Chemical mechanical planarization pad conditioner |
| KR101144981B1 (ko) * | 2011-05-17 | 2012-05-11 | 삼성전자주식회사 | Cmp 패드 컨디셔너 및 상기 cmp 패드 컨디셔너 제조방법 |
| KR101339722B1 (ko) * | 2011-07-18 | 2013-12-10 | 이화다이아몬드공업 주식회사 | Cmp 패드 컨디셔너 |
| JP6715006B2 (ja) * | 2012-08-02 | 2020-07-01 | スリーエム イノベイティブ プロパティズ カンパニー | 精密に成形された構造部を有する研磨物品及びその作製方法 |
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| USD743456S1 (en) | 2012-09-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| KR101392401B1 (ko) * | 2012-11-30 | 2014-05-07 | 이화다이아몬드공업 주식회사 | 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법 |
| US20140295740A1 (en) * | 2013-03-26 | 2014-10-02 | HGST Netherlands B.V. | Ultra fine lapping substrate through use of hard coated material on lapping kinematics |
| USD743455S1 (en) | 2013-03-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| TW201512445A (zh) * | 2013-07-11 | 2015-04-01 | Entegris Inc | 經塗覆之化學機械硏磨之固定環 |
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| WO2015143278A1 (en) | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
| TW201538275A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 平坦化之化學機械研磨修整器 |
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| JP6453666B2 (ja) * | 2015-02-20 | 2019-01-16 | 東芝メモリ株式会社 | 研磨パッドドレッサの作製方法 |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
| TWI595973B (zh) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
| TWI623382B (zh) * | 2015-10-27 | 2018-05-11 | 中國砂輪企業股份有限公司 | Hybrid chemical mechanical polishing dresser |
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| WO2017146677A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| JP2018032745A (ja) * | 2016-08-24 | 2018-03-01 | 東芝メモリ株式会社 | ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法 |
| CN111800997B (zh) * | 2016-09-06 | 2023-08-29 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
| US10471567B2 (en) * | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| CA174231S (en) | 2016-10-21 | 2018-07-10 | 3M Innovative Properties Co | Floor polishing disc |
| US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
| TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
| WO2019026021A1 (en) * | 2017-08-04 | 2019-02-07 | 3M Innovative Properties Company | MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY |
| US10354883B2 (en) * | 2017-10-03 | 2019-07-16 | Mattson Technology, Inc. | Surface treatment of silicon or silicon germanium surfaces using organic radicals |
| US10857651B2 (en) * | 2017-11-20 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus of chemical mechanical polishing and operating method thereof |
| US10654150B2 (en) * | 2017-12-26 | 2020-05-19 | Industrial Technology Research Institute | Grinding disk and method of manufacturing the same |
| WO2019154630A1 (en) * | 2018-02-06 | 2019-08-15 | Asml Netherlands B.V. | System, device and method for reconditioning a substrate support |
| US20190351527A1 (en) * | 2018-05-17 | 2019-11-21 | Entegris, Inc. | Conditioner for chemical-mechanical-planarization pad and related methods |
| EP3843946A1 (en) * | 2018-08-31 | 2021-07-07 | Best Engineered Surface Technologies, LLC | Hybrid cmp conditioning head |
| US11806833B2 (en) | 2018-08-31 | 2023-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical planarization system and a method of using the same |
| WO2020081226A1 (en) | 2018-10-15 | 2020-04-23 | Mattson Technology, Inc. | Ozone for selective hydrophilic surface treatment |
| US10950416B2 (en) | 2018-11-16 | 2021-03-16 | Mattson Technology, Inc. | Chamber seasoning to improve etch uniformity by reducing chemistry |
| US10403492B1 (en) | 2018-12-11 | 2019-09-03 | Mattson Technology, Inc. | Integration of materials removal and surface treatment in semiconductor device fabrication |
| SG11202108831UA (en) * | 2019-02-13 | 2021-09-29 | 3M Innovative Properties Co | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| KR102156997B1 (ko) * | 2019-03-11 | 2020-09-16 | 한양대학교 에리카산학협력단 | Cmp 패드 컨디셔너 및 그 동작 방법 |
| WO2020210311A1 (en) * | 2019-04-09 | 2020-10-15 | Entegris, Inc | Segment designs for discs |
| CN110722456A (zh) * | 2019-10-14 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种抛光垫修整设备和方法 |
| TWI859404B (zh) * | 2020-01-30 | 2024-10-21 | 台灣積體電路製造股份有限公司 | 可攜式清潔裝置 |
| TWI738304B (zh) | 2020-04-23 | 2021-09-01 | 台灣積體電路製造股份有限公司 | 半導體晶圓加工方法及清潔刷頭 |
| CN113050384B (zh) * | 2020-04-23 | 2025-02-18 | 台湾积体电路制造股份有限公司 | 半导体晶圆加工方法及清洁刷头 |
| US20210402563A1 (en) * | 2020-06-26 | 2021-12-30 | Applied Materials, Inc. | Conditioner disk for use on soft or 3d printed pads during cmp |
| TWI768692B (zh) * | 2021-02-01 | 2022-06-21 | 中國砂輪企業股份有限公司 | 化學機械研磨拋光墊修整器及其製造方法 |
| CN113199400A (zh) * | 2021-05-25 | 2021-08-03 | 宁波江丰电子材料股份有限公司 | 一种化学机械研磨抛光垫整修器及其制备方法 |
| JP2024535447A (ja) * | 2021-09-29 | 2024-09-30 | インテグリス・インコーポレーテッド | 両面パッドコンディショナー |
| JP2024547153A (ja) * | 2021-12-31 | 2024-12-26 | スリーエム イノベイティブ プロパティズ カンパニー | パッド調整ブラシ |
| TWI845078B (zh) * | 2022-12-20 | 2024-06-11 | 宋健民 | 一種單晶金字塔鑽石碟 |
| KR102876400B1 (ko) * | 2023-04-24 | 2025-10-24 | 새솔다이아몬드공업 주식회사 | 패드 컨디셔너 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
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| EP2684211B1 (en) * | 2011-03-07 | 2017-01-18 | Entegris, Inc. | Chemical mechanical planarization pad conditioner |
| CN103329253B (zh) * | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
| KR102168330B1 (ko) | 2012-05-04 | 2020-10-22 | 엔테그리스, 아이엔씨. | 초연마 그리트 개선을 갖는 cmp 컨디셔너 패드 |
-
2012
- 2012-03-06 EP EP12754519.2A patent/EP2684211B1/en active Active
- 2012-03-06 JP JP2013557810A patent/JP6133218B2/ja active Active
- 2012-03-06 WO PCT/US2012/027916 patent/WO2012122186A2/en not_active Ceased
- 2012-03-06 SG SG2013067152A patent/SG193340A1/en unknown
- 2012-03-06 US US14/004,152 patent/US9132526B2/en active Active
- 2012-03-06 CN CN201280022237.9A patent/CN103688343B/zh active Active
- 2012-03-06 KR KR1020137025682A patent/KR101916492B1/ko active Active
- 2012-03-07 TW TW101107639A patent/TWI592258B/zh active
-
2015
- 2015-08-20 US US14/831,280 patent/US9616547B2/en active Active
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