CN103688343B - 化学机械抛光垫修整器 - Google Patents

化学机械抛光垫修整器 Download PDF

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Publication number
CN103688343B
CN103688343B CN201280022237.9A CN201280022237A CN103688343B CN 103688343 B CN103688343 B CN 103688343B CN 201280022237 A CN201280022237 A CN 201280022237A CN 103688343 B CN103688343 B CN 103688343B
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protrusions
subset
pad conditioner
substrate
protrusion
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Chinese (zh)
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CN103688343A (zh
Inventor
约瑟夫·史密斯
安德鲁·加尔平
克里斯托弗·沃戈
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Entegris Inc
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Entegris Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN201280022237.9A 2011-03-07 2012-03-06 化学机械抛光垫修整器 Active CN103688343B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201161449851P 2011-03-07 2011-03-07
US61/449,851 2011-03-07
US201161506483P 2011-07-11 2011-07-11
US61/506,483 2011-07-11
US201161513294P 2011-07-29 2011-07-29
US61/513,294 2011-07-29
PCT/US2012/027916 WO2012122186A2 (en) 2011-03-07 2012-03-06 Chemical mechanical planarization pad conditioner

Publications (2)

Publication Number Publication Date
CN103688343A CN103688343A (zh) 2014-03-26
CN103688343B true CN103688343B (zh) 2016-09-07

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CN201280022237.9A Active CN103688343B (zh) 2011-03-07 2012-03-06 化学机械抛光垫修整器

Country Status (8)

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US (2) US9132526B2 (enExample)
EP (1) EP2684211B1 (enExample)
JP (1) JP6133218B2 (enExample)
KR (1) KR101916492B1 (enExample)
CN (1) CN103688343B (enExample)
SG (1) SG193340A1 (enExample)
TW (1) TWI592258B (enExample)
WO (1) WO2012122186A2 (enExample)

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TWI859404B (zh) * 2020-01-30 2024-10-21 台灣積體電路製造股份有限公司 可攜式清潔裝置
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CN113199400A (zh) * 2021-05-25 2021-08-03 宁波江丰电子材料股份有限公司 一种化学机械研磨抛光垫整修器及其制备方法
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Also Published As

Publication number Publication date
SG193340A1 (en) 2013-10-30
KR101916492B1 (ko) 2018-11-07
JP6133218B2 (ja) 2017-05-24
JP2014510645A (ja) 2014-05-01
EP2684211A2 (en) 2014-01-15
US9616547B2 (en) 2017-04-11
EP2684211A4 (en) 2014-08-20
EP2684211B1 (en) 2017-01-18
WO2012122186A2 (en) 2012-09-13
US20140113532A1 (en) 2014-04-24
KR20140036160A (ko) 2014-03-25
US20160074993A1 (en) 2016-03-17
US9132526B2 (en) 2015-09-15
TW201249595A (en) 2012-12-16
CN103688343A (zh) 2014-03-26
WO2012122186A3 (en) 2012-11-08
WO2012122186A4 (en) 2013-01-10
TWI592258B (zh) 2017-07-21

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