JP6133218B2 - 化学機械平坦化パッドコンディショナー - Google Patents
化学機械平坦化パッドコンディショナー Download PDFInfo
- Publication number
- JP6133218B2 JP6133218B2 JP2013557810A JP2013557810A JP6133218B2 JP 6133218 B2 JP6133218 B2 JP 6133218B2 JP 2013557810 A JP2013557810 A JP 2013557810A JP 2013557810 A JP2013557810 A JP 2013557810A JP 6133218 B2 JP6133218 B2 JP 6133218B2
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- protrusion
- pad conditioner
- substrate
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H10P52/00—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161449851P | 2011-03-07 | 2011-03-07 | |
| US61/449,851 | 2011-03-07 | ||
| US201161506483P | 2011-07-11 | 2011-07-11 | |
| US61/506,483 | 2011-07-11 | ||
| US201161513294P | 2011-07-29 | 2011-07-29 | |
| US61/513,294 | 2011-07-29 | ||
| PCT/US2012/027916 WO2012122186A2 (en) | 2011-03-07 | 2012-03-06 | Chemical mechanical planarization pad conditioner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014510645A JP2014510645A (ja) | 2014-05-01 |
| JP2014510645A5 JP2014510645A5 (enExample) | 2015-04-23 |
| JP6133218B2 true JP6133218B2 (ja) | 2017-05-24 |
Family
ID=46798753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557810A Active JP6133218B2 (ja) | 2011-03-07 | 2012-03-06 | 化学機械平坦化パッドコンディショナー |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9132526B2 (enExample) |
| EP (1) | EP2684211B1 (enExample) |
| JP (1) | JP6133218B2 (enExample) |
| KR (1) | KR101916492B1 (enExample) |
| CN (1) | CN103688343B (enExample) |
| SG (1) | SG193340A1 (enExample) |
| TW (1) | TWI592258B (enExample) |
| WO (1) | WO2012122186A2 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
| EP2684211B1 (en) * | 2011-03-07 | 2017-01-18 | Entegris, Inc. | Chemical mechanical planarization pad conditioner |
| KR101144981B1 (ko) * | 2011-05-17 | 2012-05-11 | 삼성전자주식회사 | Cmp 패드 컨디셔너 및 상기 cmp 패드 컨디셔너 제조방법 |
| KR101339722B1 (ko) * | 2011-07-18 | 2013-12-10 | 이화다이아몬드공업 주식회사 | Cmp 패드 컨디셔너 |
| JP6715006B2 (ja) * | 2012-08-02 | 2020-07-01 | スリーエム イノベイティブ プロパティズ カンパニー | 精密に成形された構造部を有する研磨物品及びその作製方法 |
| USD737873S1 (en) | 2012-09-26 | 2015-09-01 | Ebara Corporation | Dresser disk |
| TWD160526S (zh) | 2012-09-26 | 2014-05-11 | 荏原製作所股份有限公司 | 修整器碟片用修整塊 |
| USD743456S1 (en) | 2012-09-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| KR101392401B1 (ko) * | 2012-11-30 | 2014-05-07 | 이화다이아몬드공업 주식회사 | 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법 |
| US20140295740A1 (en) * | 2013-03-26 | 2014-10-02 | HGST Netherlands B.V. | Ultra fine lapping substrate through use of hard coated material on lapping kinematics |
| USD743455S1 (en) | 2013-03-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| TW201512445A (zh) * | 2013-07-11 | 2015-04-01 | Entegris Inc | 經塗覆之化學機械硏磨之固定環 |
| TWI580524B (zh) * | 2014-02-18 | 2017-05-01 | 中國砂輪企業股份有限公司 | 高性能化學機械研磨修整器及其製作方法 |
| WO2015143278A1 (en) | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
| TW201538275A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 平坦化之化學機械研磨修整器 |
| TW201538276A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 非等高度之化學機械研磨修整器 |
| TWI546159B (zh) * | 2014-04-11 | 2016-08-21 | 中國砂輪企業股份有限公司 | 可控制研磨深度之化學機械研磨修整器 |
| CN105364715A (zh) * | 2014-08-11 | 2016-03-02 | 兆远科技股份有限公司 | 抛光修整器 |
| DE102015220090B4 (de) * | 2015-01-14 | 2021-02-18 | Siltronic Ag | Verfahren zum Abrichten von Poliertüchern |
| JP6453666B2 (ja) * | 2015-02-20 | 2019-01-16 | 東芝メモリ株式会社 | 研磨パッドドレッサの作製方法 |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
| TWI595973B (zh) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
| TWI623382B (zh) * | 2015-10-27 | 2018-05-11 | 中國砂輪企業股份有限公司 | Hybrid chemical mechanical polishing dresser |
| WO2017146678A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| WO2017146677A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| JP2018032745A (ja) * | 2016-08-24 | 2018-03-01 | 東芝メモリ株式会社 | ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法 |
| CN111800997B (zh) * | 2016-09-06 | 2023-08-29 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
| US10471567B2 (en) * | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| CA174231S (en) | 2016-10-21 | 2018-07-10 | 3M Innovative Properties Co | Floor polishing disc |
| US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
| TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
| WO2019026021A1 (en) * | 2017-08-04 | 2019-02-07 | 3M Innovative Properties Company | MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY |
| US10354883B2 (en) * | 2017-10-03 | 2019-07-16 | Mattson Technology, Inc. | Surface treatment of silicon or silicon germanium surfaces using organic radicals |
| US10857651B2 (en) * | 2017-11-20 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus of chemical mechanical polishing and operating method thereof |
| US10654150B2 (en) * | 2017-12-26 | 2020-05-19 | Industrial Technology Research Institute | Grinding disk and method of manufacturing the same |
| WO2019154630A1 (en) * | 2018-02-06 | 2019-08-15 | Asml Netherlands B.V. | System, device and method for reconditioning a substrate support |
| US20190351527A1 (en) * | 2018-05-17 | 2019-11-21 | Entegris, Inc. | Conditioner for chemical-mechanical-planarization pad and related methods |
| EP3843946A1 (en) * | 2018-08-31 | 2021-07-07 | Best Engineered Surface Technologies, LLC | Hybrid cmp conditioning head |
| US11806833B2 (en) | 2018-08-31 | 2023-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical planarization system and a method of using the same |
| WO2020081226A1 (en) | 2018-10-15 | 2020-04-23 | Mattson Technology, Inc. | Ozone for selective hydrophilic surface treatment |
| US10950416B2 (en) | 2018-11-16 | 2021-03-16 | Mattson Technology, Inc. | Chamber seasoning to improve etch uniformity by reducing chemistry |
| US10403492B1 (en) | 2018-12-11 | 2019-09-03 | Mattson Technology, Inc. | Integration of materials removal and surface treatment in semiconductor device fabrication |
| SG11202108831UA (en) * | 2019-02-13 | 2021-09-29 | 3M Innovative Properties Co | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| KR102156997B1 (ko) * | 2019-03-11 | 2020-09-16 | 한양대학교 에리카산학협력단 | Cmp 패드 컨디셔너 및 그 동작 방법 |
| WO2020210311A1 (en) * | 2019-04-09 | 2020-10-15 | Entegris, Inc | Segment designs for discs |
| CN110722456A (zh) * | 2019-10-14 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种抛光垫修整设备和方法 |
| TWI859404B (zh) * | 2020-01-30 | 2024-10-21 | 台灣積體電路製造股份有限公司 | 可攜式清潔裝置 |
| TWI738304B (zh) | 2020-04-23 | 2021-09-01 | 台灣積體電路製造股份有限公司 | 半導體晶圓加工方法及清潔刷頭 |
| CN113050384B (zh) * | 2020-04-23 | 2025-02-18 | 台湾积体电路制造股份有限公司 | 半导体晶圆加工方法及清洁刷头 |
| US20210402563A1 (en) * | 2020-06-26 | 2021-12-30 | Applied Materials, Inc. | Conditioner disk for use on soft or 3d printed pads during cmp |
| TWI768692B (zh) * | 2021-02-01 | 2022-06-21 | 中國砂輪企業股份有限公司 | 化學機械研磨拋光墊修整器及其製造方法 |
| CN113199400A (zh) * | 2021-05-25 | 2021-08-03 | 宁波江丰电子材料股份有限公司 | 一种化学机械研磨抛光垫整修器及其制备方法 |
| JP2024535447A (ja) * | 2021-09-29 | 2024-09-30 | インテグリス・インコーポレーテッド | 両面パッドコンディショナー |
| JP2024547153A (ja) * | 2021-12-31 | 2024-12-26 | スリーエム イノベイティブ プロパティズ カンパニー | パッド調整ブラシ |
| TWI845078B (zh) * | 2022-12-20 | 2024-06-11 | 宋健民 | 一種單晶金字塔鑽石碟 |
| KR102876400B1 (ko) * | 2023-04-24 | 2025-10-24 | 새솔다이아몬드공업 주식회사 | 패드 컨디셔너 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4706416A (en) * | 1987-01-12 | 1987-11-17 | Kottas Robert P | Tool for removing residues |
| US5186973A (en) | 1990-09-13 | 1993-02-16 | Diamonex, Incorporated | HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films |
| AU654588B2 (en) | 1991-10-30 | 1994-11-10 | De Beers Industrial Diamond Division (Proprietary) Limited | Tool insert |
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| US9199357B2 (en) * | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6054183A (en) | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
| JPH1158232A (ja) * | 1997-08-26 | 1999-03-02 | Toshiba Ceramics Co Ltd | ドレッシング工具及びその製造方法 |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| KR19990081117A (ko) * | 1998-04-25 | 1999-11-15 | 윤종용 | 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법 |
| TW467802B (en) * | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
| KR100387954B1 (ko) * | 1999-10-12 | 2003-06-19 | (주) 휴네텍 | 연마패드용 컨디셔너와 이의 제조방법 |
| US7201645B2 (en) * | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
| US6419553B2 (en) * | 2000-01-04 | 2002-07-16 | Rodel Holdings, Inc. | Methods for break-in and conditioning a fixed abrasive polishing pad |
| US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| US6632127B1 (en) | 2001-03-07 | 2003-10-14 | Jerry W. Zimmer | Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same |
| US20020182401A1 (en) | 2001-06-01 | 2002-12-05 | Lawing Andrew Scott | Pad conditioner with uniform particle height |
| JP2003053665A (ja) * | 2001-08-10 | 2003-02-26 | Mitsubishi Materials Corp | ドレッサー |
| JP3744877B2 (ja) * | 2002-04-15 | 2006-02-15 | 株式会社ノリタケスーパーアブレーシブ | Cmp加工用ドレッサ |
| US6872127B2 (en) * | 2002-07-11 | 2005-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd | Polishing pad conditioning disks for chemical mechanical polisher |
| AU2003284410A1 (en) | 2002-11-19 | 2004-06-15 | Ishikawa Seisakusho, Ltd. | Pixel control element selection transfer method, pixel control element mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate |
| JP4277553B2 (ja) * | 2003-01-15 | 2009-06-10 | 三菱マテリアル株式会社 | 軟質材加工用工具 |
| US20050025973A1 (en) | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| US7799375B2 (en) | 2004-06-30 | 2010-09-21 | Poco Graphite, Inc. | Process for the manufacturing of dense silicon carbide |
| KR100636793B1 (ko) | 2004-12-13 | 2006-10-23 | 이화다이아몬드공업 주식회사 | Cmp 패드용 컨디셔너 |
| US9138862B2 (en) * | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8678878B2 (en) * | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| KR100723436B1 (ko) * | 2005-12-29 | 2007-05-30 | 삼성전자주식회사 | 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치 |
| US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
| KR20100106328A (ko) * | 2007-11-13 | 2010-10-01 | 치엔 민 성 | Cmp 패드 드레서 |
| JP5502987B2 (ja) * | 2009-03-24 | 2014-05-28 | サンーゴバン アブレイシブズ,インコーポレイティド | 化学機械平坦化パッドコンディショナとして使用するための研磨工具 |
| MY155563A (en) * | 2009-06-02 | 2015-10-30 | Saint Gobain Abrasives Inc | Corrosion-resistant cmp conditioning tools and methods for making and using same |
| KR101091030B1 (ko) | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
| JP5871904B2 (ja) | 2010-04-12 | 2016-03-01 | イコニクス コーポレーションIkonics Corporation | アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 |
| TW201246342A (en) * | 2010-12-13 | 2012-11-16 | Saint Gobain Abrasives Inc | Chemical mechanical planarization (CMP) pad conditioner and method of making |
| US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
| EP2684211B1 (en) * | 2011-03-07 | 2017-01-18 | Entegris, Inc. | Chemical mechanical planarization pad conditioner |
| CN103329253B (zh) * | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
| KR102168330B1 (ko) | 2012-05-04 | 2020-10-22 | 엔테그리스, 아이엔씨. | 초연마 그리트 개선을 갖는 cmp 컨디셔너 패드 |
-
2012
- 2012-03-06 EP EP12754519.2A patent/EP2684211B1/en active Active
- 2012-03-06 JP JP2013557810A patent/JP6133218B2/ja active Active
- 2012-03-06 WO PCT/US2012/027916 patent/WO2012122186A2/en not_active Ceased
- 2012-03-06 SG SG2013067152A patent/SG193340A1/en unknown
- 2012-03-06 US US14/004,152 patent/US9132526B2/en active Active
- 2012-03-06 CN CN201280022237.9A patent/CN103688343B/zh active Active
- 2012-03-06 KR KR1020137025682A patent/KR101916492B1/ko active Active
- 2012-03-07 TW TW101107639A patent/TWI592258B/zh active
-
2015
- 2015-08-20 US US14/831,280 patent/US9616547B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20160074993A1 (en) | 2016-03-17 |
| EP2684211A4 (en) | 2014-08-20 |
| TWI592258B (zh) | 2017-07-21 |
| EP2684211B1 (en) | 2017-01-18 |
| KR20140036160A (ko) | 2014-03-25 |
| US9132526B2 (en) | 2015-09-15 |
| JP2014510645A (ja) | 2014-05-01 |
| EP2684211A2 (en) | 2014-01-15 |
| US20140113532A1 (en) | 2014-04-24 |
| US9616547B2 (en) | 2017-04-11 |
| WO2012122186A4 (en) | 2013-01-10 |
| KR101916492B1 (ko) | 2018-11-07 |
| WO2012122186A3 (en) | 2012-11-08 |
| SG193340A1 (en) | 2013-10-30 |
| CN103688343A (zh) | 2014-03-26 |
| CN103688343B (zh) | 2016-09-07 |
| TW201249595A (en) | 2012-12-16 |
| WO2012122186A2 (en) | 2012-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6133218B2 (ja) | 化学機械平坦化パッドコンディショナー | |
| US10293463B2 (en) | Chemical mechanical planarization pad conditioner with elongated cutting edges | |
| EP2025459B1 (en) | Layered-filament lattice for chemical mechanical polishing | |
| US8622787B2 (en) | CMP pad dressers with hybridized abrasive surface and related methods | |
| KR101091030B1 (ko) | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 | |
| EP2025457A2 (en) | Interconnected-multi-element-lattice polishing pad | |
| KR101392401B1 (ko) | 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법 | |
| KR20100133415A (ko) | 비평면 cvd 다이아몬드 코팅된 cmp pad 컨디셔너 및 제조 방법 | |
| WO2013166516A1 (en) | Cmp conditioner pads with superabrasive grit enhancement | |
| CN110871407A (zh) | 抛光垫修整器及化学机械平坦化的方法 | |
| US20150017884A1 (en) | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods | |
| US20190351527A1 (en) | Conditioner for chemical-mechanical-planarization pad and related methods | |
| TWI735795B (zh) | 拋光墊修整器及化學機械平坦化的方法 | |
| KR101178281B1 (ko) | 감소된 마찰력을 갖는 패드 컨디셔너 | |
| JP2008246617A (ja) | 軟質材加工用回転工具 | |
| Tsai et al. | PCD dresser for dressing CMP polyurethane pads |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150306 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150306 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151110 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160205 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160510 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160802 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161031 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161227 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170328 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170419 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6133218 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |