KR101916492B1 - 화학 및 기계적 평탄화 패드 컨디셔너 - Google Patents

화학 및 기계적 평탄화 패드 컨디셔너 Download PDF

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KR101916492B1
KR101916492B1 KR1020137025682A KR20137025682A KR101916492B1 KR 101916492 B1 KR101916492 B1 KR 101916492B1 KR 1020137025682 A KR1020137025682 A KR 1020137025682A KR 20137025682 A KR20137025682 A KR 20137025682A KR 101916492 B1 KR101916492 B1 KR 101916492B1
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protrusions
substrate
subset
delete delete
pad conditioner
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Korean (ko)
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KR20140036160A (ko
Inventor
조셉 스미스
앤드류 갤핀
크리스토퍼 워고
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엔테그리스, 아이엔씨.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020137025682A 2011-03-07 2012-03-06 화학 및 기계적 평탄화 패드 컨디셔너 Active KR101916492B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201161449851P 2011-03-07 2011-03-07
US61/449,851 2011-03-07
US201161506483P 2011-07-11 2011-07-11
US61/506,483 2011-07-11
US201161513294P 2011-07-29 2011-07-29
US61/513,294 2011-07-29
PCT/US2012/027916 WO2012122186A2 (en) 2011-03-07 2012-03-06 Chemical mechanical planarization pad conditioner

Publications (2)

Publication Number Publication Date
KR20140036160A KR20140036160A (ko) 2014-03-25
KR101916492B1 true KR101916492B1 (ko) 2018-11-07

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KR1020137025682A Active KR101916492B1 (ko) 2011-03-07 2012-03-06 화학 및 기계적 평탄화 패드 컨디셔너

Country Status (8)

Country Link
US (2) US9132526B2 (enExample)
EP (1) EP2684211B1 (enExample)
JP (1) JP6133218B2 (enExample)
KR (1) KR101916492B1 (enExample)
CN (1) CN103688343B (enExample)
SG (1) SG193340A1 (enExample)
TW (1) TWI592258B (enExample)
WO (1) WO2012122186A2 (enExample)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140120724A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Composite conditioner and associated methods
JP6133218B2 (ja) * 2011-03-07 2017-05-24 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
KR101144981B1 (ko) * 2011-05-17 2012-05-11 삼성전자주식회사 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법
KR101339722B1 (ko) * 2011-07-18 2013-12-10 이화다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너
SG11201500802TA (en) * 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
USD737873S1 (en) 2012-09-26 2015-09-01 Ebara Corporation Dresser disk
TWD160526S (zh) 2012-09-26 2014-05-11 荏原製作所股份有限公司 修整器碟片用修整塊
USD743456S1 (en) 2012-09-26 2015-11-17 Ebara Corporation Dresser disk
KR101392401B1 (ko) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법
USD743455S1 (en) 2013-03-26 2015-11-17 Ebara Corporation Dresser disk
US20140295740A1 (en) * 2013-03-26 2014-10-02 HGST Netherlands B.V. Ultra fine lapping substrate through use of hard coated material on lapping kinematics
WO2015006745A1 (en) * 2013-07-11 2015-01-15 Entegris, Inc. Refurbishable coated cmp conditioner, method of making same and integrated system for use in chemical mechanical planarization
TWI580524B (zh) * 2014-02-18 2017-05-01 中國砂輪企業股份有限公司 高性能化學機械研磨修整器及其製作方法
WO2015143278A1 (en) * 2014-03-21 2015-09-24 Entegris, Inc. Chemical mechanical planarization pad conditioner with elongated cutting edges
TW201538275A (zh) * 2014-04-08 2015-10-16 Kinik Co 平坦化之化學機械研磨修整器
TW201538276A (zh) * 2014-04-08 2015-10-16 Kinik Co 非等高度之化學機械研磨修整器
TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
CN105364715A (zh) * 2014-08-11 2016-03-02 兆远科技股份有限公司 抛光修整器
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
JP6453666B2 (ja) * 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
TWI595973B (zh) * 2015-06-01 2017-08-21 China Grinding Wheel Corp Chemical mechanical polishing dresser and its manufacturing method
TWI623382B (zh) * 2015-10-27 2018-05-11 中國砂輪企業股份有限公司 Hybrid chemical mechanical polishing dresser
WO2017146677A1 (en) * 2016-02-23 2017-08-31 Intel Corporation Conditioning disks for chemical mechanical polishing
WO2017146678A1 (en) * 2016-02-23 2017-08-31 Intel Corporation Conditioning disks for chemical mechanical polishing
JP2018032745A (ja) * 2016-08-24 2018-03-01 東芝メモリ株式会社 ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法
CN107801366B (zh) * 2016-09-06 2020-07-17 拓自达电线株式会社 电磁波屏蔽膜
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
CA174231S (en) 2016-10-21 2018-07-10 3M Innovative Properties Co Floor polishing disc
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
US12208483B2 (en) * 2017-08-04 2025-01-28 3M Innovative Properties Company Microreplicated polishing surface with enhanced co-planarity
US10804109B2 (en) * 2017-10-03 2020-10-13 Mattson Technology, Inc. Surface treatment of silicon and carbon containing films by remote plasma with organic precursors
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US10654150B2 (en) * 2017-12-26 2020-05-19 Industrial Technology Research Institute Grinding disk and method of manufacturing the same
CN111699439A (zh) * 2018-02-06 2020-09-22 Asml荷兰有限公司 用于修复衬底支撑件的系统、装置和方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
KR20210075984A (ko) * 2018-08-31 2021-06-23 베스트 엔지니어드 서피스 테크놀로지스, 엘엘씨 하이브리드 cmp 컨디셔닝 헤드
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
US11495456B2 (en) 2018-10-15 2022-11-08 Beijing E-Town Semiconductor Technology, Co., Ltd Ozone for selective hydrophilic surface treatment
CN112335017B (zh) 2018-11-16 2024-06-18 玛特森技术公司 腔室上光以通过减少化学成分改善刻蚀均匀性
US10403492B1 (en) 2018-12-11 2019-09-03 Mattson Technology, Inc. Integration of materials removal and surface treatment in semiconductor device fabrication
SG11202108831UA (en) * 2019-02-13 2021-09-29 3M Innovative Properties Co Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
KR102156997B1 (ko) * 2019-03-11 2020-09-16 한양대학교 에리카산학협력단 Cmp 패드 컨디셔너 및 그 동작 방법
KR20210137580A (ko) * 2019-04-09 2021-11-17 엔테그리스, 아이엔씨. 디스크를 위한 세그먼트 설계
CN110722456A (zh) * 2019-10-14 2020-01-24 西安奕斯伟硅片技术有限公司 一种抛光垫修整设备和方法
TWI859404B (zh) * 2020-01-30 2024-10-21 台灣積體電路製造股份有限公司 可攜式清潔裝置
TWI738304B (zh) 2020-04-23 2021-09-01 台灣積體電路製造股份有限公司 半導體晶圓加工方法及清潔刷頭
CN113050384B (zh) * 2020-04-23 2025-02-18 台湾积体电路制造股份有限公司 半导体晶圆加工方法及清洁刷头
WO2021262602A1 (en) * 2020-06-26 2021-12-30 Applied Materials, Inc. Conditioner disk for use on soft or 3d printed pads during cmp
TWI768692B (zh) * 2021-02-01 2022-06-21 中國砂輪企業股份有限公司 化學機械研磨拋光墊修整器及其製造方法
CN113199400A (zh) * 2021-05-25 2021-08-03 宁波江丰电子材料股份有限公司 一种化学机械研磨抛光垫整修器及其制备方法
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー
WO2023129567A1 (en) * 2021-12-31 2023-07-06 3M Innovative Properties Company Pad conditioning brush
TWI845078B (zh) * 2022-12-20 2024-06-11 宋健民 一種單晶金字塔鑽石碟
KR102876400B1 (ko) * 2023-04-24 2025-10-24 새솔다이아몬드공업 주식회사 패드 컨디셔너
CN116652825B (zh) * 2023-07-24 2023-11-10 北京寰宇晶科科技有限公司 一种金刚石cmp抛光垫修整器及其制备方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4706416A (en) * 1987-01-12 1987-11-17 Kottas Robert P Tool for removing residues
US5186973A (en) 1990-09-13 1993-02-16 Diamonex, Incorporated HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films
CA2081631A1 (en) 1991-10-30 1993-05-01 Cornelius Phaal Tool insert
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
US9199357B2 (en) * 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US6054183A (en) 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
JPH1158232A (ja) * 1997-08-26 1999-03-02 Toshiba Ceramics Co Ltd ドレッシング工具及びその製造方法
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
TW467802B (en) 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (ko) * 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
US7201645B2 (en) 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6419553B2 (en) * 2000-01-04 2002-07-16 Rodel Holdings, Inc. Methods for break-in and conditioning a fixed abrasive polishing pad
US6821189B1 (en) * 2000-10-13 2004-11-23 3M Innovative Properties Company Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
US6632127B1 (en) 2001-03-07 2003-10-14 Jerry W. Zimmer Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same
US20020182401A1 (en) 2001-06-01 2002-12-05 Lawing Andrew Scott Pad conditioner with uniform particle height
JP2003053665A (ja) * 2001-08-10 2003-02-26 Mitsubishi Materials Corp ドレッサー
JP3744877B2 (ja) * 2002-04-15 2006-02-15 株式会社ノリタケスーパーアブレーシブ Ｃｍｐ加工用ドレッサ
US6872127B2 (en) * 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
KR20050075280A (ko) 2002-11-19 2005-07-20 가부시키가이샤 이시카와 세이사쿠쇼 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판
JP4277553B2 (ja) * 2003-01-15 2009-06-10 三菱マテリアル株式会社 軟質材加工用工具
US20050025973A1 (en) 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7799375B2 (en) 2004-06-30 2010-09-21 Poco Graphite, Inc. Process for the manufacturing of dense silicon carbide
KR100636793B1 (ko) 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
US9138862B2 (en) * 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
KR100723436B1 (ko) 2005-12-29 2007-05-30 삼성전자주식회사 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
WO2009064677A2 (en) * 2007-11-13 2009-05-22 Chien-Min Sung Cmp pad dressers
SG174351A1 (en) * 2009-03-24 2011-10-28 Saint Gobain Abrasives Inc Abrasive tool for use as a chemical mechanical planarization pad conditioner
CN102484054A (zh) * 2009-06-02 2012-05-30 圣戈班磨料磨具有限公司 耐腐蚀性cmp修整工件及其制造和使用方法
KR101091030B1 (ko) 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
SG184460A1 (en) 2010-04-12 2012-11-29 Ikonics Corp Photoresist film and methods for abrasive etching and cutting
TW201246342A (en) * 2010-12-13 2012-11-16 Saint Gobain Abrasives Inc Chemical mechanical planarization (CMP) pad conditioner and method of making
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP6133218B2 (ja) * 2011-03-07 2017-05-24 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
WO2012162430A2 (en) * 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
CN110328616A (zh) 2012-05-04 2019-10-15 恩特格里斯公司 具有超硬磨料增强的化学机械平坦化修整器衬垫

Also Published As

Publication number Publication date
WO2012122186A2 (en) 2012-09-13
US20160074993A1 (en) 2016-03-17
TWI592258B (zh) 2017-07-21
WO2012122186A4 (en) 2013-01-10
EP2684211A2 (en) 2014-01-15
WO2012122186A3 (en) 2012-11-08
CN103688343A (zh) 2014-03-26
US9132526B2 (en) 2015-09-15
US20140113532A1 (en) 2014-04-24
SG193340A1 (en) 2013-10-30
TW201249595A (en) 2012-12-16
US9616547B2 (en) 2017-04-11
JP6133218B2 (ja) 2017-05-24
JP2014510645A (ja) 2014-05-01
EP2684211A4 (en) 2014-08-20
CN103688343B (zh) 2016-09-07
KR20140036160A (ko) 2014-03-25
EP2684211B1 (en) 2017-01-18

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