JP2009061584A5 - - Google Patents

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Publication number
JP2009061584A5
JP2009061584A5 JP2008209141A JP2008209141A JP2009061584A5 JP 2009061584 A5 JP2009061584 A5 JP 2009061584A5 JP 2008209141 A JP2008209141 A JP 2008209141A JP 2008209141 A JP2008209141 A JP 2008209141A JP 2009061584 A5 JP2009061584 A5 JP 2009061584A5
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JP
Japan
Prior art keywords
polishing
average
contact area
texture
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008209141A
Other languages
English (en)
Japanese (ja)
Other versions
JP5317574B2 (ja
JP2009061584A (ja
Filing date
Publication date
Priority claimed from US11/839,874 external-priority patent/US7530887B2/en
Application filed filed Critical
Publication of JP2009061584A publication Critical patent/JP2009061584A/ja
Publication of JP2009061584A5 publication Critical patent/JP2009061584A5/ja
Application granted granted Critical
Publication of JP5317574B2 publication Critical patent/JP5317574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008209141A 2007-08-16 2008-08-15 濡れ制御を備えたケミカルメカニカル研磨パッド Active JP5317574B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/839,874 US7530887B2 (en) 2007-08-16 2007-08-16 Chemical mechanical polishing pad with controlled wetting
US11/839,874 2007-08-16

Publications (3)

Publication Number Publication Date
JP2009061584A JP2009061584A (ja) 2009-03-26
JP2009061584A5 true JP2009061584A5 (enExample) 2013-07-11
JP5317574B2 JP5317574B2 (ja) 2013-10-16

Family

ID=40032591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008209141A Active JP5317574B2 (ja) 2007-08-16 2008-08-15 濡れ制御を備えたケミカルメカニカル研磨パッド

Country Status (7)

Country Link
US (1) US7530887B2 (enExample)
EP (1) EP2025456A3 (enExample)
JP (1) JP5317574B2 (enExample)
KR (1) KR101508013B1 (enExample)
CN (1) CN101367203B (enExample)
SG (1) SG150468A1 (enExample)
TW (1) TWI453812B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
CN101774160B (zh) * 2010-03-01 2011-05-11 南京航空航天大学 冰粒型固结磨料抛光垫及快速制备方法和装置
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
SG11202007923QA (en) 2018-02-23 2020-09-29 International Test Solutions Inc Novel material and hardware to automatically clean flexible electronic web rolls
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN112757154B (zh) * 2021-01-22 2024-05-10 湖北鼎汇微电子材料有限公司 一种抛光垫
CN112809548A (zh) * 2021-02-24 2021-05-18 合肥铨得合半导体有限责任公司 一种调整pu材料研磨垫亲疏水性的方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578628A (en) * 1985-06-25 1996-11-26 Glaxo Group Limited Medicaments for the treatment of nausea and vomiting
JPH04201181A (ja) * 1990-11-30 1992-07-22 Ichikawa Woolen Textile Co Ltd 研磨用フェルト
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6103376A (en) * 1996-08-22 2000-08-15 Eastman Chemical Company Bundles of fibers useful for moving liquids at high fluxes and acquisition/distribution structures that use the bundles
US6610903B1 (en) * 1998-12-18 2003-08-26 Kimberly-Clark Worldwide, Inc. Materials for fluid management in personal care products
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
TWI222390B (en) * 2001-11-13 2004-10-21 Toyo Boseki Polishing pad and its production method
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
EP1694466A1 (en) * 2003-09-15 2006-08-30 Psiloquest, Inc. A polishing pad for chemical mechanical polishing
JP2005131179A (ja) * 2003-10-31 2005-05-26 Sanyo Product Co Ltd 遊技機
JP2006289561A (ja) * 2005-04-12 2006-10-26 Renesas Technology Corp 研磨パッドおよび研磨装置
US7604529B2 (en) * 2006-02-16 2009-10-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7503833B2 (en) * 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
JP4798713B2 (ja) * 2007-03-26 2011-10-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7828634B2 (en) * 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing

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