SG150468A1 - Chemical mechanical polishing pad with controlled wetting - Google Patents

Chemical mechanical polishing pad with controlled wetting

Info

Publication number
SG150468A1
SG150468A1 SG200806009-7A SG2008060097A SG150468A1 SG 150468 A1 SG150468 A1 SG 150468A1 SG 2008060097 A SG2008060097 A SG 2008060097A SG 150468 A1 SG150468 A1 SG 150468A1
Authority
SG
Singapore
Prior art keywords
chemical mechanical
mechanical polishing
polishing pad
controlled wetting
wetting
Prior art date
Application number
SG200806009-7A
Other languages
English (en)
Inventor
Bo Jiang
Gregory P Muldowney
Ravichandra V Palaparthi
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of SG150468A1 publication Critical patent/SG150468A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200806009-7A 2007-08-16 2008-08-13 Chemical mechanical polishing pad with controlled wetting SG150468A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/839,874 US7530887B2 (en) 2007-08-16 2007-08-16 Chemical mechanical polishing pad with controlled wetting

Publications (1)

Publication Number Publication Date
SG150468A1 true SG150468A1 (en) 2009-03-30

Family

ID=40032591

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200806009-7A SG150468A1 (en) 2007-08-16 2008-08-13 Chemical mechanical polishing pad with controlled wetting

Country Status (7)

Country Link
US (1) US7530887B2 (enExample)
EP (1) EP2025456A3 (enExample)
JP (1) JP5317574B2 (enExample)
KR (1) KR101508013B1 (enExample)
CN (1) CN101367203B (enExample)
SG (1) SG150468A1 (enExample)
TW (1) TWI453812B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
CN101774160B (zh) * 2010-03-01 2011-05-11 南京航空航天大学 冰粒型固结磨料抛光垫及快速制备方法和装置
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
SG11202007923QA (en) 2018-02-23 2020-09-29 International Test Solutions Inc Novel material and hardware to automatically clean flexible electronic web rolls
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN112757154B (zh) * 2021-01-22 2024-05-10 湖北鼎汇微电子材料有限公司 一种抛光垫
CN112809548A (zh) * 2021-02-24 2021-05-18 合肥铨得合半导体有限责任公司 一种调整pu材料研磨垫亲疏水性的方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578628A (en) * 1985-06-25 1996-11-26 Glaxo Group Limited Medicaments for the treatment of nausea and vomiting
JPH04201181A (ja) * 1990-11-30 1992-07-22 Ichikawa Woolen Textile Co Ltd 研磨用フェルト
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6103376A (en) * 1996-08-22 2000-08-15 Eastman Chemical Company Bundles of fibers useful for moving liquids at high fluxes and acquisition/distribution structures that use the bundles
US6610903B1 (en) * 1998-12-18 2003-08-26 Kimberly-Clark Worldwide, Inc. Materials for fluid management in personal care products
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
TWI222390B (en) * 2001-11-13 2004-10-21 Toyo Boseki Polishing pad and its production method
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
EP1694466A1 (en) * 2003-09-15 2006-08-30 Psiloquest, Inc. A polishing pad for chemical mechanical polishing
JP2005131179A (ja) * 2003-10-31 2005-05-26 Sanyo Product Co Ltd 遊技機
JP2006289561A (ja) * 2005-04-12 2006-10-26 Renesas Technology Corp 研磨パッドおよび研磨装置
US7604529B2 (en) * 2006-02-16 2009-10-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7503833B2 (en) * 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
JP4798713B2 (ja) * 2007-03-26 2011-10-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7828634B2 (en) * 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing

Also Published As

Publication number Publication date
KR20090018008A (ko) 2009-02-19
CN101367203A (zh) 2009-02-18
KR101508013B1 (ko) 2015-04-03
TW200910444A (en) 2009-03-01
CN101367203B (zh) 2010-11-17
JP5317574B2 (ja) 2013-10-16
US7530887B2 (en) 2009-05-12
EP2025456A2 (en) 2009-02-18
EP2025456A3 (en) 2015-06-17
TWI453812B (zh) 2014-09-21
US20090047876A1 (en) 2009-02-19
JP2009061584A (ja) 2009-03-26

Similar Documents

Publication Publication Date Title
SG150468A1 (en) Chemical mechanical polishing pad with controlled wetting
EP2025454A3 (en) Improved chemical mechanical polishing pad and methods of making and using same
EP2025460A3 (en) Improved chemical mechanical polishing pad and methods of making and using same
TW200709894A (en) Multi-layer polishing pad material for CMP
SG150466A1 (en) Interpenetrating network for chemical mechanical polishing
WO2010123744A3 (en) Cmp porous pad with particles in a polymeric matrix
WO2009041422A1 (ja) 研磨パッド
NZ586833A (en) Interface pad for use between an abrasive article and a support tool
JP2006518632A5 (enExample)
EP2040878A4 (en) POLISHING BUFFER WHICH SURFACE COMPRISES MICROILLONS
IL201028A (en) A metal layer polishing pad and a metal layer polishing method that uses it
MY150905A (en) Polishing pad
MX2009000576A (es) Articulo abrasivo sin respaldo.
TW200740464A (en) Cleaning and/or polishing compositions and methods for use thereof
EP2202031A3 (en) High-rate polishing method
MY195662A (en) Method for Manufacturing Magnetic-Disk Substrate, and Polishing Pad
MY149715A (en) Method of polishing nickel-phosphorous
PH12012000019A1 (en) Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk
MY158719A (en) Polishing composition for nickel-phosphorous memory disks
WO2011159536A3 (en) A splicing technique for fixed abrasives used in chemical mechanical planarization
SG155822A1 (en) Manufacturing method of glass substrate for magnetic disc
TW200531784A (en) Chemical mechanical polishing pad
WO2012005939A3 (en) Closed-loop control of cmp slurry flow
EP2128896A3 (en) Method of polishing silicon wafer
TW200701303A (en) A substrate and a method for polishing a substrate