KR101508013B1 - 습윤 조절된 화학적 기계적 연마 패드 - Google Patents

습윤 조절된 화학적 기계적 연마 패드 Download PDF

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KR101508013B1
KR101508013B1 KR20080080147A KR20080080147A KR101508013B1 KR 101508013 B1 KR101508013 B1 KR 101508013B1 KR 20080080147 A KR20080080147 A KR 20080080147A KR 20080080147 A KR20080080147 A KR 20080080147A KR 101508013 B1 KR101508013 B1 KR 101508013B1
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South Korea
Prior art keywords
abrasive
average
polishing
contact area
elements
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Korean (ko)
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KR20090018008A (ko
Inventor
보 지앙
그레고리 피. 멀다우니
라비찬드라 브이. 팔라파티
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR20080080147A 2007-08-16 2008-08-14 습윤 조절된 화학적 기계적 연마 패드 Active KR101508013B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/839,874 US7530887B2 (en) 2007-08-16 2007-08-16 Chemical mechanical polishing pad with controlled wetting
US11/839,874 2007-08-16

Publications (2)

Publication Number Publication Date
KR20090018008A KR20090018008A (ko) 2009-02-19
KR101508013B1 true KR101508013B1 (ko) 2015-04-03

Family

ID=40032591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20080080147A Active KR101508013B1 (ko) 2007-08-16 2008-08-14 습윤 조절된 화학적 기계적 연마 패드

Country Status (7)

Country Link
US (1) US7530887B2 (enExample)
EP (1) EP2025456A3 (enExample)
JP (1) JP5317574B2 (enExample)
KR (1) KR101508013B1 (enExample)
CN (1) CN101367203B (enExample)
SG (1) SG150468A1 (enExample)
TW (1) TWI453812B (enExample)

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US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
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US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
CN101774160B (zh) * 2010-03-01 2011-05-11 南京航空航天大学 冰粒型固结磨料抛光垫及快速制备方法和装置
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
SG11202007923QA (en) 2018-02-23 2020-09-29 International Test Solutions Inc Novel material and hardware to automatically clean flexible electronic web rolls
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN112757154B (zh) * 2021-01-22 2024-05-10 湖北鼎汇微电子材料有限公司 一种抛光垫
CN112809548A (zh) * 2021-02-24 2021-05-18 合肥铨得合半导体有限责任公司 一种调整pu材料研磨垫亲疏水性的方法

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KR20090017992A (ko) * 2007-08-16 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학적 기계적 연마를 위한 적층된-필라멘트 격자
KR20090017994A (ko) * 2007-08-16 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 상호연결된-다중-요소-격자 연마 패드
KR20090017993A (ko) * 2007-08-15 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학적 기계적 연마를 위한 상호침투 망상조직

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JPH04201181A (ja) * 1990-11-30 1992-07-22 Ichikawa Woolen Textile Co Ltd 研磨用フェルト
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MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
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US6610903B1 (en) * 1998-12-18 2003-08-26 Kimberly-Clark Worldwide, Inc. Materials for fluid management in personal care products
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
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US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
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KR20090017993A (ko) * 2007-08-15 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학적 기계적 연마를 위한 상호침투 망상조직
KR20090017992A (ko) * 2007-08-16 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학적 기계적 연마를 위한 적층된-필라멘트 격자
KR20090017994A (ko) * 2007-08-16 2009-02-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 상호연결된-다중-요소-격자 연마 패드

Also Published As

Publication number Publication date
KR20090018008A (ko) 2009-02-19
CN101367203A (zh) 2009-02-18
TW200910444A (en) 2009-03-01
CN101367203B (zh) 2010-11-17
JP5317574B2 (ja) 2013-10-16
US7530887B2 (en) 2009-05-12
EP2025456A2 (en) 2009-02-18
EP2025456A3 (en) 2015-06-17
TWI453812B (zh) 2014-09-21
SG150468A1 (en) 2009-03-30
US20090047876A1 (en) 2009-02-19
JP2009061584A (ja) 2009-03-26

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