CN106463379B - 具有细长切割边缘的化学机械平坦化垫调节器 - Google Patents

具有细长切割边缘的化学机械平坦化垫调节器 Download PDF

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Publication number
CN106463379B
CN106463379B CN201580026005.4A CN201580026005A CN106463379B CN 106463379 B CN106463379 B CN 106463379B CN 201580026005 A CN201580026005 A CN 201580026005A CN 106463379 B CN106463379 B CN 106463379B
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CN
China
Prior art keywords
protrusions
elongated
substrate
elongated protrusions
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580026005.4A
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English (en)
Chinese (zh)
Other versions
CN106463379A (zh
Inventor
安德鲁·加尔平
丹尼尔·韦尔斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of CN106463379A publication Critical patent/CN106463379A/zh
Application granted granted Critical
Publication of CN106463379B publication Critical patent/CN106463379B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201580026005.4A 2014-03-21 2015-03-20 具有细长切割边缘的化学机械平坦化垫调节器 Expired - Fee Related CN106463379B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21
PCT/US2015/021679 WO2015143278A1 (en) 2014-03-21 2015-03-20 Chemical mechanical planarization pad conditioner with elongated cutting edges

Publications (2)

Publication Number Publication Date
CN106463379A CN106463379A (zh) 2017-02-22
CN106463379B true CN106463379B (zh) 2019-08-06

Family

ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580026005.4A Expired - Fee Related CN106463379B (zh) 2014-03-21 2015-03-20 具有细长切割边缘的化学机械平坦化垫调节器

Country Status (6)

Country Link
US (1) US10293463B2 (enExample)
JP (1) JP6542793B2 (enExample)
KR (1) KR102304574B1 (enExample)
CN (1) CN106463379B (enExample)
TW (1) TWI666091B (enExample)
WO (1) WO2015143278A1 (enExample)

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US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
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US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12687790B2 (en) * 2018-07-27 2026-07-21 Asml Netherlands B.V. Tool for modifying a support surface
US12208487B2 (en) * 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
WO2020165759A1 (en) * 2019-02-13 2020-08-20 3M Innovative Properties Company Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
SG11202111151XA (en) * 2019-04-09 2021-11-29 Entegris Inc Segment designs for discs
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー

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Also Published As

Publication number Publication date
JP6542793B2 (ja) 2019-07-10
JP2017509500A (ja) 2017-04-06
TW201600241A (zh) 2016-01-01
CN106463379A (zh) 2017-02-22
US10293463B2 (en) 2019-05-21
US20170095903A1 (en) 2017-04-06
KR102304574B1 (ko) 2021-09-27
WO2015143278A1 (en) 2015-09-24
TWI666091B (zh) 2019-07-21
KR20160136404A (ko) 2016-11-29

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Granted publication date: 20190806