TWI666091B - 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 - Google Patents

化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 Download PDF

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Publication number
TWI666091B
TWI666091B TW104109176A TW104109176A TWI666091B TW I666091 B TWI666091 B TW I666091B TW 104109176 A TW104109176 A TW 104109176A TW 104109176 A TW104109176 A TW 104109176A TW I666091 B TWI666091 B TW I666091B
Authority
TW
Taiwan
Prior art keywords
elongated
protrusions
elongated protrusions
chemical mechanical
substrate
Prior art date
Application number
TW104109176A
Other languages
English (en)
Chinese (zh)
Other versions
TW201600241A (zh
Inventor
Andrew GALPIN
安德魯 葛平
Daniel Wells
丹尼爾 威爾斯
Original Assignee
Entegris, Inc.
美商恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris, Inc., 美商恩特葛瑞斯股份有限公司 filed Critical Entegris, Inc.
Publication of TW201600241A publication Critical patent/TW201600241A/zh
Application granted granted Critical
Publication of TWI666091B publication Critical patent/TWI666091B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H10P52/402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW104109176A 2014-03-21 2015-03-23 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 TWI666091B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21

Publications (2)

Publication Number Publication Date
TW201600241A TW201600241A (zh) 2016-01-01
TWI666091B true TWI666091B (zh) 2019-07-21

Family

ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104109176A TWI666091B (zh) 2014-03-21 2015-03-23 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器

Country Status (6)

Country Link
US (1) US10293463B2 (enExample)
JP (1) JP6542793B2 (enExample)
KR (1) KR102304574B1 (enExample)
CN (1) CN106463379B (enExample)
TW (1) TWI666091B (enExample)
WO (1) WO2015143278A1 (enExample)

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US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12208487B2 (en) 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
SG11202108831UA (en) * 2019-02-13 2021-09-29 3M Innovative Properties Co Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
WO2020210311A1 (en) * 2019-04-09 2020-10-15 Entegris, Inc Segment designs for discs
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
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US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー

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Also Published As

Publication number Publication date
KR20160136404A (ko) 2016-11-29
US20170095903A1 (en) 2017-04-06
CN106463379A (zh) 2017-02-22
KR102304574B1 (ko) 2021-09-27
TW201600241A (zh) 2016-01-01
US10293463B2 (en) 2019-05-21
CN106463379B (zh) 2019-08-06
WO2015143278A1 (en) 2015-09-24
JP6542793B2 (ja) 2019-07-10
JP2017509500A (ja) 2017-04-06

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