JP2015041700A5 - - Google Patents
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- Publication number
- JP2015041700A5 JP2015041700A5 JP2013172218A JP2013172218A JP2015041700A5 JP 2015041700 A5 JP2015041700 A5 JP 2015041700A5 JP 2013172218 A JP2013172218 A JP 2013172218A JP 2013172218 A JP2013172218 A JP 2013172218A JP 2015041700 A5 JP2015041700 A5 JP 2015041700A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- surface roughness
- height
- region
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 83
- 230000003746 surface roughness Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 4
- 238000012935 Averaging Methods 0.000 claims 1
- 238000004439 roughness measurement Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013172218A JP6010511B2 (ja) | 2013-08-22 | 2013-08-22 | 研磨パッドの表面粗さ測定方法 |
| KR1020140107747A KR101680938B1 (ko) | 2013-08-22 | 2014-08-19 | 연마 패드의 표면 거칠기 측정 방법 |
| US14/463,214 US9393670B2 (en) | 2013-08-22 | 2014-08-19 | Measuring method of surface roughness of polishing pad |
| CN201410414805.0A CN104422408B (zh) | 2013-08-22 | 2014-08-21 | 研磨垫的表面粗糙度测定方法和测定装置，及cmp方法 |
| TW103128748A TWI573659B (zh) | 2013-08-22 | 2014-08-21 | 研磨墊之表面粗糙度測定方法、cmp方法、研磨墊之表面粗糙度測定裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013172218A JP6010511B2 (ja) | 2013-08-22 | 2013-08-22 | 研磨パッドの表面粗さ測定方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015041700A JP2015041700A (ja) | 2015-03-02 |
| JP2015041700A5 true JP2015041700A5 (enExample) | 2016-09-01 |
| JP6010511B2 JP6010511B2 (ja) | 2016-10-19 |
Family
ID=52480785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013172218A Active JP6010511B2 (ja) | 2013-08-22 | 2013-08-22 | 研磨パッドの表面粗さ測定方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9393670B2 (enExample) |
| JP (1) | JP6010511B2 (enExample) |
| KR (1) | KR101680938B1 (enExample) |
| CN (1) | CN104422408B (enExample) |
| TW (1) | TWI573659B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9685342B2 (en) * | 2014-12-11 | 2017-06-20 | GlobalFoundries, Inc. | Wafer processing apparatuses and methods of operating the same |
| JP6809779B2 (ja) * | 2015-08-25 | 2021-01-06 | 株式会社フジミインコーポレーテッド | 研磨パッド、研磨パッドのコンディショニング方法、パッドコンディショニング剤、それらの利用 |
| JP7023455B2 (ja) * | 2017-01-23 | 2022-02-22 | 不二越機械工業株式会社 | ワーク研磨方法およびワーク研磨装置 |
| KR102683416B1 (ko) * | 2017-02-15 | 2024-07-23 | 삼성전자주식회사 | 화학 기계적 연마 장치 |
| US10675732B2 (en) | 2017-04-18 | 2020-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for CMP pad conditioning |
| CN107292051A (zh) * | 2017-07-07 | 2017-10-24 | 湘潭大学 | 一种硬质合金刀片化学机械抛光表面粗糙度的预测方法 |
| US11059145B2 (en) * | 2017-08-10 | 2021-07-13 | Tokyo Electron Limited | Dressing apparatus and dressing method for substrate rear surface polishing member |
| JP6948878B2 (ja) | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| CN109702650A (zh) * | 2017-10-26 | 2019-05-03 | 长鑫存储技术有限公司 | 研磨垫修整方法、化学机械研磨方法及装置 |
| KR102580487B1 (ko) * | 2018-06-18 | 2023-09-21 | 주식회사 케이씨텍 | 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법 |
| US10926523B2 (en) * | 2018-06-19 | 2021-02-23 | Sensel, Inc. | Performance enhancement of sensors through surface processing |
| US11359906B2 (en) | 2020-05-29 | 2022-06-14 | Ta Liang Technology Co., Ltd. | Method, system and apparatus for uniformed surface measurement |
| US11759909B2 (en) * | 2020-06-19 | 2023-09-19 | Sk Enpulse Co., Ltd. | Polishing pad, preparation method thereof and method for preparing semiconductor device using same |
| US20230390882A1 (en) * | 2022-06-06 | 2023-12-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System, control method and apparatus for chemical mechanical polishing |
| US20230411227A1 (en) * | 2022-06-17 | 2023-12-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing tool and methods of operation |
| CN115388817B (zh) * | 2022-10-27 | 2023-03-24 | 山东微晶自动化有限公司 | 基于图像处理分析实现铸造件打磨质量检测的方法 |
| CN115890473A (zh) * | 2022-12-15 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | 抛光设备及抛光垫检测方法 |
| CN116372781B (zh) * | 2023-04-20 | 2023-11-07 | 山东欣立得光电科技有限公司 | 一种led屏幕衬底自动化清洗抛光系统 |
| JP2024178702A (ja) * | 2023-06-13 | 2024-12-25 | 株式会社Sumco | 研磨パッドのドレッシング条件設定方法、ウェーハの片面研磨方法、ウェーハの製造方法、研磨パッドのドレッシング条件設定装置およびウェーハの片面研磨装置 |
| CN120326444B (zh) * | 2025-06-20 | 2025-08-19 | 嘉兴翼波精密制造有限公司 | 基于视觉识别的精密制造抛光方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5708506A (en) * | 1995-07-03 | 1998-01-13 | Applied Materials, Inc. | Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process |
| JPH1086056A (ja) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | 研磨パッドの管理方法及び装置 |
| JP3632500B2 (ja) * | 1999-05-21 | 2005-03-23 | 株式会社日立製作所 | 回転加工装置 |
| WO2003082524A1 (en) * | 2002-03-25 | 2003-10-09 | Thomas West, Inc | Smooth pads for cmp and polishing substrates |
| TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
| US7235488B2 (en) * | 2002-08-28 | 2007-06-26 | Micron Technology, Inc. | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
| US6872132B2 (en) * | 2003-03-03 | 2005-03-29 | Micron Technology, Inc. | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| US7018269B2 (en) | 2003-06-18 | 2006-03-28 | Lam Research Corporation | Pad conditioner control using feedback from a measured polishing pad roughness level |
| JP2005347568A (ja) * | 2004-06-03 | 2005-12-15 | Ebara Corp | 基板研磨方法及び基板研磨装置 |
| US7183213B2 (en) * | 2003-07-17 | 2007-02-27 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
| JP4206318B2 (ja) * | 2003-09-17 | 2009-01-07 | 三洋電機株式会社 | 研磨パッドのドレッシング方法及び製造装置 |
| JP2005260185A (ja) | 2004-03-15 | 2005-09-22 | Nitta Haas Inc | 研磨パッド |
| EP1588803A1 (en) | 2004-04-21 | 2005-10-26 | JSR Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method |
| JP2005333121A (ja) | 2004-04-21 | 2005-12-02 | Jsr Corp | 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法 |
| JP4756583B2 (ja) * | 2005-08-30 | 2011-08-24 | 株式会社東京精密 | 研磨パッド、パッドドレッシング評価方法、及び研磨装置 |
| TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| KR101738885B1 (ko) * | 2010-04-20 | 2017-06-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 폴리싱 패드 프로파일들을 위한 폐쇄-루프 제어 |
| TW201246342A (en) * | 2010-12-13 | 2012-11-16 | Saint Gobain Abrasives Inc | Chemical mechanical planarization (CMP) pad conditioner and method of making |
| KR101144981B1 (ko) * | 2011-05-17 | 2012-05-11 | 삼성전자주식회사 | Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법 |
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2013
- 2013-08-22 JP JP2013172218A patent/JP6010511B2/ja active Active
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2014
- 2014-08-19 KR KR1020140107747A patent/KR101680938B1/ko active Active
- 2014-08-19 US US14/463,214 patent/US9393670B2/en active Active
- 2014-08-21 CN CN201410414805.0A patent/CN104422408B/zh active Active
- 2014-08-21 TW TW103128748A patent/TWI573659B/zh active