JP2017506432A5 - - Google Patents

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Publication number
JP2017506432A5
JP2017506432A5 JP2016550585A JP2016550585A JP2017506432A5 JP 2017506432 A5 JP2017506432 A5 JP 2017506432A5 JP 2016550585 A JP2016550585 A JP 2016550585A JP 2016550585 A JP2016550585 A JP 2016550585A JP 2017506432 A5 JP2017506432 A5 JP 2017506432A5
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JP
Japan
Prior art keywords
terminal
chip
fet
pad surface
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016550585A
Other languages
English (en)
Japanese (ja)
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JP2017506432A (ja
JP6509885B2 (ja
Filing date
Publication date
Priority claimed from US14/173,147 external-priority patent/US9184121B2/en
Priority claimed from US14/481,204 external-priority patent/US9171828B2/en
Application filed filed Critical
Publication of JP2017506432A publication Critical patent/JP2017506432A/ja
Publication of JP2017506432A5 publication Critical patent/JP2017506432A5/ja
Application granted granted Critical
Publication of JP6509885B2 publication Critical patent/JP6509885B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016550585A 2014-02-05 2015-02-05 半導体チップの端子を有するｄｃ−ｄｃコンバータ Active JP6509885B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US14/173,147 US9184121B2 (en) 2014-02-05 2014-02-05 Stacked synchronous buck converter having chip embedded in outside recess of leadframe
US14/173,147 2014-02-05
US14/481,204 US9171828B2 (en) 2014-02-05 2014-09-09 DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
US14/481,204 2014-09-09
PCT/US2015/014655 WO2015120173A1 (en) 2014-02-05 2015-02-05 Dc-dc converter having terminals of semiconductor chips

Publications (3)

Publication Number Publication Date
JP2017506432A JP2017506432A (ja) 2017-03-02
JP2017506432A5 true JP2017506432A5 (enExample) 2018-03-15
JP6509885B2 JP6509885B2 (ja) 2019-05-08

Family

ID=53755485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016550585A Active JP6509885B2 (ja) 2014-02-05 2015-02-05 半導体チップの端子を有するｄｃ−ｄｃコンバータ

Country Status (5)

Country Link
US (4) US9171828B2 (enExample)
EP (1) EP3130009B1 (enExample)
JP (1) JP6509885B2 (enExample)
CN (2) CN110911377B (enExample)
WO (1) WO2015120173A1 (enExample)

Families Citing this family (16)

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US8426952B2 (en) * 2011-01-14 2013-04-23 International Rectifier Corporation Stacked half-bridge package with a common conductive leadframe
JP6265415B2 (ja) * 2014-01-24 2018-01-24 住友電工デバイス・イノベーション株式会社 増幅装置
US9171828B2 (en) * 2014-02-05 2015-10-27 Texas Instruments Incorporated DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
US20170018487A1 (en) * 2015-07-15 2017-01-19 Broadcom Corporation Thermal enhancement for quad flat no lead (qfn) packages
JP6011737B1 (ja) * 2016-03-14 2016-10-19 富士電機株式会社 降圧チョッパ回路
JP6011736B1 (ja) * 2016-03-14 2016-10-19 富士電機株式会社 昇圧チョッパ回路
FR3073080B1 (fr) * 2017-10-26 2021-01-08 St Microelectronics Srl Circuit integre en boitier qfn
CN108345712B (zh) * 2018-01-10 2021-10-15 杭州士兰集成电路有限公司 计算半导体器件的频率与电流关系的方法和装置
US11476232B2 (en) 2019-03-25 2022-10-18 Analog Devices International Unlimited Company Three-dimensional packaging techniques for power FET density improvement
JP6709313B1 (ja) * 2019-05-31 2020-06-10 アオイ電子株式会社 半導体装置および半導体装置の製造方法
US11024564B2 (en) 2019-06-19 2021-06-01 Texas Instruments Incorporated Packaged electronic device with film isolated power stack
US11742267B2 (en) * 2020-10-12 2023-08-29 Toyota Motor Engineering And Manufacturing North America, Inc. Power electronics assembly having flipped chip transistors
EP4057341A1 (en) * 2021-03-12 2022-09-14 Nexperia B.V. Packaged half-bridge circuit
DE102021133665A1 (de) 2021-12-17 2023-06-22 Infineon Technologies Ag Halbleitervorrichtung mit einem Premolded-Leadframe und einem Halbleiterpackage
US12261101B2 (en) * 2022-06-28 2025-03-25 Alpha And Omega Semiconductor International Lp Semiconductor package having wettable lead flanks and tie bars and method of making the same
IT202300006201A1 (it) * 2023-03-30 2024-09-30 St Microelectronics Int Nv Modulo di potenza multi-livello con effetti parassitici ridotti

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JPH11260996A (ja) * 1998-03-16 1999-09-24 Matsushita Electron Corp 光学半導体装置とその製造方法
JP2002252322A (ja) * 2001-02-21 2002-09-06 Sony Corp 電子部品実装基板及びその製造方法
US7579697B2 (en) 2002-07-15 2009-08-25 International Rectifier Corporation Arrangement for high frequency application
US6946740B2 (en) 2002-07-15 2005-09-20 International Rectifier Corporation High power MCM package
DE112006001663T5 (de) * 2005-06-30 2008-05-08 Fairchild Semiconductor Corp. Halbleiterchip-Gehäuse und Verfahren zur Herstellung desselben
US20090194857A1 (en) * 2008-02-01 2009-08-06 Yong Liu Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same
US7952204B2 (en) * 2008-04-14 2011-05-31 Fairchild Semiconductor Corporation Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same
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US8358014B2 (en) * 2009-05-28 2013-01-22 Texas Instruments Incorporated Structure and method for power field effect transistor
CN102169873B (zh) * 2010-02-25 2013-12-11 万国半导体有限公司 一种应用于功率切换器电路的半导体封装结构
US20110210708A1 (en) * 2010-03-01 2011-09-01 Texas Instruments Incorporated High Frequency Power Supply Module Having High Efficiency and High Current
US8513784B2 (en) * 2010-03-18 2013-08-20 Alpha & Omega Semiconductor Incorporated Multi-layer lead frame package and method of fabrication
JP5099243B2 (ja) * 2010-04-14 2012-12-19 株式会社デンソー 半導体モジュール
US20120200281A1 (en) * 2011-02-07 2012-08-09 Texas Instruments Incorporated Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
US20120228696A1 (en) 2011-03-07 2012-09-13 Texas Instruments Incorporated Stacked die power converter
US9165865B2 (en) 2011-04-07 2015-10-20 Texas Instruments Incorporated Ultra-thin power transistor and synchronous buck converter having customized footprint
US8299588B1 (en) * 2011-07-07 2012-10-30 Texas Instruments Incorporated Structure and method for uniform current distribution in power supply module
US8760872B2 (en) * 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink
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US8883567B2 (en) 2012-03-27 2014-11-11 Texas Instruments Incorporated Process of making a stacked semiconductor package having a clip
JP5924110B2 (ja) * 2012-05-11 2016-05-25 株式会社ソシオネクスト 半導体装置、半導体装置モジュールおよび半導体装置の製造方法
US20140063744A1 (en) * 2012-09-05 2014-03-06 Texas Instruments Incorporated Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance
US8976561B2 (en) * 2012-11-14 2015-03-10 Power Integrations, Inc. Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
US9214415B2 (en) * 2013-04-11 2015-12-15 Texas Instruments Incorporated Integrating multi-output power converters having vertically stacked semiconductor chips
US9171828B2 (en) * 2014-02-05 2015-10-27 Texas Instruments Incorporated DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
US9184121B2 (en) * 2014-02-05 2015-11-10 Texas Instruments Incorporated Stacked synchronous buck converter having chip embedded in outside recess of leadframe

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