JP2017506432A - 半導体チップの端子を有するdc−dcコンバータ - Google Patents
半導体チップの端子を有するdc−dcコンバータ Download PDFInfo
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- JP2017506432A JP2017506432A JP2016550585A JP2016550585A JP2017506432A JP 2017506432 A JP2017506432 A JP 2017506432A JP 2016550585 A JP2016550585 A JP 2016550585A JP 2016550585 A JP2016550585 A JP 2016550585A JP 2017506432 A JP2017506432 A JP 2017506432A
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- power supply
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/1576—Iron [Fe] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/181—Encapsulation
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Abstract
Description
Claims (10)
- 電力供給システムであって、
複数のリードと、第1及び第2のパッド表面を有するパッドとを備えたクワッドフラットノーリード(QFN)タイプのリードフレームであって、前記第1のパッド表面が、窪んだ部分及び窪んでいない部分を有し、前記窪んだ部分が、複数の半導体チップを取り付けるために適した深さ及びアウトラインを有し、前記パッドが、前記電力供給システムのスイッチノード端子に結びつけられ得る、前記QFNタイプのリードフレーム、
第1の電界効果トランジスタ(FET)チップであって、前記第1のFETチップが、前記第1のパッド表面の前記窪んだ部分に取り付けられる前記第1のFETチップのドレイン端子を有し、更に、前記第1のFETチップのソース端子、及び前記第1のパッド表面の前記窪んでいない部分と共面であるゲート端子を有し、前記第1のFETチップの前記ソース端子が、前記電力供給システムの接地された出力端子としてボード端子に結びつけられ得る、前記第1のFETチップ、及び
第2のFETチップであって、前記第2のFETチップが、前記第1のパッド表面の前記窪んだ部分に取り付けられる前記第2のFETチップのソース端子を有し、更に、前記第2のFETチップのドレイン端子、及び前記第1のパッド表面の前記窪んでいない部分と共面であるゲート端子を有し、前記第2のFETチップの前記ドレイン端子が、前記電力供給システムの入力端子としてボード端子に結びつけられ得る、前記第2のFETチップ、
を含む、電力供給システム。 - 請求項1に記載の電力供給システムであって、更に、前記第2のパッド表面に取り付けられるドライバとコントローラのチップを含む、電力供給システム。
- 請求項2に記載の電力供給システムであって、前記ドライバとコントローラのチップが、ボンディングワイヤによって前記リードフレームのそれぞれのリードに結びつけられる複数の端子を有する、電力供給システム。
- 請求項3に記載の電力供給システムであって、更に、前記ドライバとコントローラのチップ、前記ボンディングワイヤ、及び前記パッドとリードの前記第2の表面を封止する一方で、前記第1のパッド表面及び前記複数のリードの少なくとも幾つかを封止されないまま残す、パッケージを含む、電力供給システム。
- 請求項1に記載の電力供給システムであって、前記第1のFETチップが、ローサイドトランジスタとして機能するドレインFETを含む、電力供給システム。
- 請求項5に記載の電力供給システムであって、前記第2のFETチップが、ハイサイドトランジスタとして機能するソースダウンFETを含む、電力供給システム。
- 電力供給システムを製造する方法であって、前記方法が、
リードと第1及び第2の表面を備えたパッドとを有するリードフレームを提供することであって、前記第1の表面が、半導体チップを取り付けるために適した深さ及びアウトラインを有する窪んだ部分を有すること、
前記パッドの前記第2の表面上にドライバとコントローラのチップを取り付けること、
ボンディングワイヤを用いて前記ドライバとコントローラのチップの端子をそれぞれのリードへ接続すること、
前記ドライバとコントローラのチップ、前記ボンディングワイヤ、及び前記第2のパッド表面をパッケージング化合物に封止する一方、前記第1のパッド表面を封止されないまま残すこと、
その後、第1の電界効果トランジスタ(FET)チップを、前記第1のFETチップのソース端子及びゲート端子が、前記第1のパッド表面の窪んでいない部分と共面であるように、そのドレイン端子で前記第1のパッド表面の前記窪んだ部分に取り付けること、及び
第2のFETチップを、前記第2のFETチップのドレイン端子及びゲート端子が前記第1のパッド表面の前記窪んでいない部分と共面であるように、そのソース端子で前記第1のパッド表面の前記窪んだ部分に取り付けること、
を含む、方法。 - 請求項7に記載の方法であって、更に、前記パッドを前記電力供給システムのスイッチノード端子に接続するプロセス、前記第1のFETチップの前記ソース端子を前記電力供給システムの接地された出力端子としてボード端子に接続するプロセス、及び前記第2のFETチップの前記ドレイン端子を前記電力供給システムの入力端子としてボード端子に接続するプロセスを含む、方法。
- 請求項7に記載の方法であって、前記取り付けるプロセスが、導電性接着材、及びz軸導体を備えた重合体の化合物を含むグループから選択される取り付け材料を用いる、方法。
- 請求項7に記載の方法であって、前記リードフレームが、クワッドフラットノーリード(QFN)又はスモールアウトラインノーリード(SON)タイプの構成を有する、方法。
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