JP2017511976A5 - - Google Patents

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Publication number
JP2017511976A5
JP2017511976A5 JP2016553573A JP2016553573A JP2017511976A5 JP 2017511976 A5 JP2017511976 A5 JP 2017511976A5 JP 2016553573 A JP2016553573 A JP 2016553573A JP 2016553573 A JP2016553573 A JP 2016553573A JP 2017511976 A5 JP2017511976 A5 JP 2017511976A5
Authority
JP
Japan
Prior art keywords
chip
power supply
supply system
terminal
fet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016553573A
Other languages
English (en)
Japanese (ja)
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JP2017511976A (ja
JP6534677B2 (ja
Filing date
Publication date
Priority claimed from US14/185,502 external-priority patent/US9136256B2/en
Application filed filed Critical
Publication of JP2017511976A publication Critical patent/JP2017511976A/ja
Publication of JP2017511976A5 publication Critical patent/JP2017511976A5/ja
Application granted granted Critical
Publication of JP6534677B2 publication Critical patent/JP6534677B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016553573A 2014-02-20 2015-02-20 スタックされたチップ及びインターポーザを備えた部分的に薄化されたリードフレームを有するコンバータ Active JP6534677B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/185,502 2014-02-20
US14/185,502 US9136256B2 (en) 2014-02-20 2014-02-20 Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips
PCT/US2015/016739 WO2015127159A1 (en) 2014-02-20 2015-02-20 Converter having partially thinned leadframe with stacked chips and interposer

Publications (3)

Publication Number Publication Date
JP2017511976A JP2017511976A (ja) 2017-04-27
JP2017511976A5 true JP2017511976A5 (enExample) 2018-04-05
JP6534677B2 JP6534677B2 (ja) 2019-06-26

Family

ID=53798782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016553573A Active JP6534677B2 (ja) 2014-02-20 2015-02-20 スタックされたチップ及びインターポーザを備えた部分的に薄化されたリードフレームを有するコンバータ

Country Status (5)

Country Link
US (2) US9136256B2 (enExample)
EP (1) EP3108503B1 (enExample)
JP (1) JP6534677B2 (enExample)
CN (1) CN106030788B (enExample)
WO (1) WO2015127159A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
US10312184B2 (en) 2015-11-04 2019-06-04 Texas Instruments Incorporated Semiconductor systems having premolded dual leadframes
US20200135632A1 (en) * 2018-10-24 2020-04-30 Texas Instruments Incorporated Die isolation on a substrate
CN109545697B (zh) * 2018-12-26 2024-06-18 桂林电子科技大学 半导体封装方法及半导体封装结构
US10964629B2 (en) 2019-01-18 2021-03-30 Texas Instruments Incorporated Siderail with mold compound relief

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3609684B2 (ja) * 2000-03-28 2005-01-12 三洋電機株式会社 半導体装置およびその製造方法
US7335972B2 (en) 2003-11-13 2008-02-26 Sandia Corporation Heterogeneously integrated microsystem-on-a-chip
DE102005055761B4 (de) * 2005-11-21 2008-02-07 Infineon Technologies Ag Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben
US20080036078A1 (en) 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US8263434B2 (en) 2009-07-31 2012-09-11 Stats Chippac, Ltd. Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP
US20120326287A1 (en) * 2011-06-27 2012-12-27 National Semiconductor Corporation Dc/dc convertor power module package incorporating a stacked controller and construction methodology
US20120200281A1 (en) * 2011-02-07 2012-08-09 Texas Instruments Incorporated Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
US20120228696A1 (en) * 2011-03-07 2012-09-13 Texas Instruments Incorporated Stacked die power converter
US8669650B2 (en) * 2011-03-31 2014-03-11 Alpha & Omega Semiconductor, Inc. Flip chip semiconductor device
US9508633B2 (en) 2011-08-22 2016-11-29 Texas Instruments Incorporated High performance power transistor having ultra-thin package
US20130082383A1 (en) 2011-10-03 2013-04-04 Texas Instruments Incorporated Electronic assembly having mixed interface including tsv die
US9184122B2 (en) * 2012-06-06 2015-11-10 Stats Chippac Ltd. Integrated circuit packaging system with interposer and method of manufacture thereof

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