CN106030788B - 具有具堆叠芯片的经部分薄化引线框架及内插件的转换器 - Google Patents

具有具堆叠芯片的经部分薄化引线框架及内插件的转换器 Download PDF

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Publication number
CN106030788B
CN106030788B CN201580008988.9A CN201580008988A CN106030788B CN 106030788 B CN106030788 B CN 106030788B CN 201580008988 A CN201580008988 A CN 201580008988A CN 106030788 B CN106030788 B CN 106030788B
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chip
fet
pad
height
traces
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CN201580008988.9A
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English (en)
Chinese (zh)
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CN106030788A (zh
Inventor
拉吉夫·丁卡尔·乔希
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Texas Instruments Inc
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Texas Instruments Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dc-Dc Converters (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201580008988.9A 2014-02-20 2015-02-20 具有具堆叠芯片的经部分薄化引线框架及内插件的转换器 Active CN106030788B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/185,502 US9136256B2 (en) 2014-02-20 2014-02-20 Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips
US14/185,502 2014-02-20
PCT/US2015/016739 WO2015127159A1 (en) 2014-02-20 2015-02-20 Converter having partially thinned leadframe with stacked chips and interposer

Publications (2)

Publication Number Publication Date
CN106030788A CN106030788A (zh) 2016-10-12
CN106030788B true CN106030788B (zh) 2019-03-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580008988.9A Active CN106030788B (zh) 2014-02-20 2015-02-20 具有具堆叠芯片的经部分薄化引线框架及内插件的转换器

Country Status (5)

Country Link
US (2) US9136256B2 (enExample)
EP (1) EP3108503B1 (enExample)
JP (1) JP6534677B2 (enExample)
CN (1) CN106030788B (enExample)
WO (1) WO2015127159A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
US10312184B2 (en) 2015-11-04 2019-06-04 Texas Instruments Incorporated Semiconductor systems having premolded dual leadframes
US20200135632A1 (en) * 2018-10-24 2020-04-30 Texas Instruments Incorporated Die isolation on a substrate
CN109545697B (zh) * 2018-12-26 2024-06-18 桂林电子科技大学 半导体封装方法及半导体封装结构
US10964629B2 (en) 2019-01-18 2021-03-30 Texas Instruments Incorporated Siderail with mold compound relief

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070132079A1 (en) * 2005-11-21 2007-06-14 Ralf Otremba Power Semiconductor Component With Semiconductor Chip Stack In A Bridge Circuit And Method For Producing The Same
US20120228696A1 (en) * 2011-03-07 2012-09-13 Texas Instruments Incorporated Stacked die power converter
US20120248539A1 (en) * 2011-03-31 2012-10-04 Xiaotian Zhang Flip chip semiconductor device
US20120326287A1 (en) * 2011-06-27 2012-12-27 National Semiconductor Corporation Dc/dc convertor power module package incorporating a stacked controller and construction methodology
US20130328216A1 (en) * 2012-06-06 2013-12-12 Wei Qiang Jin Integrated circuit packaging system with interposer and method of manufacture thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3609684B2 (ja) * 2000-03-28 2005-01-12 三洋電機株式会社 半導体装置およびその製造方法
US7335972B2 (en) 2003-11-13 2008-02-26 Sandia Corporation Heterogeneously integrated microsystem-on-a-chip
US20080036078A1 (en) 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US8263434B2 (en) 2009-07-31 2012-09-11 Stats Chippac, Ltd. Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP
US20120200281A1 (en) * 2011-02-07 2012-08-09 Texas Instruments Incorporated Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
US9508633B2 (en) 2011-08-22 2016-11-29 Texas Instruments Incorporated High performance power transistor having ultra-thin package
US20130082383A1 (en) 2011-10-03 2013-04-04 Texas Instruments Incorporated Electronic assembly having mixed interface including tsv die

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070132079A1 (en) * 2005-11-21 2007-06-14 Ralf Otremba Power Semiconductor Component With Semiconductor Chip Stack In A Bridge Circuit And Method For Producing The Same
US20120228696A1 (en) * 2011-03-07 2012-09-13 Texas Instruments Incorporated Stacked die power converter
US20120248539A1 (en) * 2011-03-31 2012-10-04 Xiaotian Zhang Flip chip semiconductor device
US20120326287A1 (en) * 2011-06-27 2012-12-27 National Semiconductor Corporation Dc/dc convertor power module package incorporating a stacked controller and construction methodology
US20130328216A1 (en) * 2012-06-06 2013-12-12 Wei Qiang Jin Integrated circuit packaging system with interposer and method of manufacture thereof

Also Published As

Publication number Publication date
WO2015127159A1 (en) 2015-08-27
US20150348890A1 (en) 2015-12-03
CN106030788A (zh) 2016-10-12
EP3108503B1 (en) 2019-04-10
US9355946B2 (en) 2016-05-31
US9136256B2 (en) 2015-09-15
US20150235999A1 (en) 2015-08-20
JP6534677B2 (ja) 2019-06-26
JP2017511976A (ja) 2017-04-27
EP3108503A4 (en) 2017-11-22
EP3108503A1 (en) 2016-12-28

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