JP2017500393A - 室温硬化性シリコーンゴム組成物およびその用途 - Google Patents

室温硬化性シリコーンゴム組成物およびその用途 Download PDF

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Publication number
JP2017500393A
JP2017500393A JP2016535251A JP2016535251A JP2017500393A JP 2017500393 A JP2017500393 A JP 2017500393A JP 2016535251 A JP2016535251 A JP 2016535251A JP 2016535251 A JP2016535251 A JP 2016535251A JP 2017500393 A JP2017500393 A JP 2017500393A
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Prior art keywords
group
silicone rubber
component
room temperature
rubber composition
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JP2016535251A
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Japanese (ja)
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JP2017500393A5 (enExample
Inventor
春美 小玉
春美 小玉
正之 大西
正之 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of JP2017500393A publication Critical patent/JP2017500393A/ja
Publication of JP2017500393A5 publication Critical patent/JP2017500393A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C08K5/57—Organo-tin compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2016535251A 2013-12-27 2014-12-25 室温硬化性シリコーンゴム組成物およびその用途 Pending JP2017500393A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013272670 2013-12-27
JP2013272670 2013-12-27
PCT/JP2014/006474 WO2015098119A1 (en) 2013-12-27 2014-12-25 Room-temperature-curable silicone rubber composition, and the use thereof

Related Child Applications (1)

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JP2019190062A Division JP6855548B2 (ja) 2013-12-27 2019-10-17 室温硬化性シリコーンゴム組成物およびその用途

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JP2017500393A true JP2017500393A (ja) 2017-01-05
JP2017500393A5 JP2017500393A5 (enExample) 2018-02-01

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JP2019190062A Active JP6855548B2 (ja) 2013-12-27 2019-10-17 室温硬化性シリコーンゴム組成物およびその用途

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US (1) US10072151B2 (enExample)
EP (1) EP3087144B1 (enExample)
JP (2) JP2017500393A (enExample)
KR (1) KR101884177B1 (enExample)
CN (2) CN105874010A (enExample)
TW (1) TWI653293B (enExample)
WO (1) WO2015098119A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022542537A (ja) * 2019-06-21 2022-10-05 ダウ シリコーンズ コーポレーション チキソトロピック性の硬化性シリコーン組成物の製造方法
WO2025075201A1 (ja) * 2023-10-06 2025-04-10 Ａｇｃ株式会社 組成物、表面処理剤、物品、及び物品の製造方法
WO2025075200A1 (ja) * 2023-10-06 2025-04-10 Ａｇｃ株式会社 組成物、表面処理剤、物品、及び物品の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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GB201604971D0 (en) 2016-03-23 2016-05-04 Dow Corning Moisture curable compositions
EP3575373B1 (en) * 2017-01-30 2025-02-19 Dow Toray Co., Ltd. Coating agent for concrete structure
CN109777342A (zh) * 2018-12-29 2019-05-21 江苏创景科技有限公司 一种用于双组分有机硅灌封胶的固化促进剂及其应用
US11254838B2 (en) 2019-03-29 2022-02-22 Ppg Industries Ohio, Inc. Single component hydrophobic coating
KR102679282B1 (ko) 2019-06-21 2024-07-01 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
CN112011309A (zh) * 2020-09-04 2020-12-01 忍嘉有机硅新材料(东莞)有限公司 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法
WO2025205911A1 (ja) * 2024-03-29 2025-10-02 ナミックス株式会社 硬化性樹脂組成物、接着剤組成物、硬化物、半導体装置及び電子部品

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JPS62212488A (ja) * 1986-03-03 1987-09-18 ダウ・コ−ニング・コ−ポレ−シヨン 一液型シリコ−ン・シ−ラント
JPH02133490A (ja) * 1988-09-26 1990-05-22 Dow Corning Corp シリコーンシーラント製造方法
JP2000169713A (ja) * 1998-12-10 2000-06-20 Dow Corning Corp 室温加硫シリコ―ン組成物の製造法
JP2001192641A (ja) * 2000-01-06 2001-07-17 Dow Corning Toray Silicone Co Ltd シーリング材組成物
JP2012219113A (ja) * 2011-04-04 2012-11-12 Dow Corning Toray Co Ltd 室温硬化性シリコーンゴム組成物

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JP4799835B2 (ja) 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP4811562B2 (ja) 2005-05-13 2011-11-09 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP5025917B2 (ja) * 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP5015476B2 (ja) 2006-03-01 2012-08-29 東レ・ダウコーニング株式会社 電極・電気回路の保護剤組成物
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JPS62212488A (ja) * 1986-03-03 1987-09-18 ダウ・コ−ニング・コ−ポレ−シヨン 一液型シリコ−ン・シ−ラント
JPH02133490A (ja) * 1988-09-26 1990-05-22 Dow Corning Corp シリコーンシーラント製造方法
JP2000169713A (ja) * 1998-12-10 2000-06-20 Dow Corning Corp 室温加硫シリコ―ン組成物の製造法
JP2001192641A (ja) * 2000-01-06 2001-07-17 Dow Corning Toray Silicone Co Ltd シーリング材組成物
JP2012219113A (ja) * 2011-04-04 2012-11-12 Dow Corning Toray Co Ltd 室温硬化性シリコーンゴム組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022542537A (ja) * 2019-06-21 2022-10-05 ダウ シリコーンズ コーポレーション チキソトロピック性の硬化性シリコーン組成物の製造方法
JP7675026B2 (ja) 2019-06-21 2025-05-12 ダウ シリコーンズ コーポレーション チキソトロピック性の硬化性シリコーン組成物の製造方法
WO2025075201A1 (ja) * 2023-10-06 2025-04-10 Ａｇｃ株式会社 組成物、表面処理剤、物品、及び物品の製造方法
WO2025075200A1 (ja) * 2023-10-06 2025-04-10 Ａｇｃ株式会社 組成物、表面処理剤、物品、及び物品の製造方法

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KR20160103070A (ko) 2016-08-31
EP3087144A1 (en) 2016-11-02
WO2015098119A1 (en) 2015-07-02
CN113736089A (zh) 2021-12-03
US10072151B2 (en) 2018-09-11
CN105874010A (zh) 2016-08-17
US20170029622A1 (en) 2017-02-02
JP6855548B2 (ja) 2021-04-07
EP3087144A4 (en) 2017-08-02
TWI653293B (zh) 2019-03-11
KR101884177B1 (ko) 2018-08-02
JP2020007571A (ja) 2020-01-16
EP3087144B1 (en) 2018-09-19
TW201529733A (zh) 2015-08-01

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