TWI653293B - 可室溫固化之聚矽氧橡膠組合物及其用途 - Google Patents
可室溫固化之聚矽氧橡膠組合物及其用途 Download PDFInfo
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- TWI653293B TWI653293B TW103145955A TW103145955A TWI653293B TW I653293 B TWI653293 B TW I653293B TW 103145955 A TW103145955 A TW 103145955A TW 103145955 A TW103145955 A TW 103145955A TW I653293 B TWI653293 B TW I653293B
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- rubber composition
- silicone rubber
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- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08K5/57—Organo-tin compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013-272670 | 2013-12-27 | ||
| JP2013272670 | 2013-12-27 |
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| TW201529733A TW201529733A (zh) | 2015-08-01 |
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| GB201604971D0 (en) | 2016-03-23 | 2016-05-04 | Dow Corning | Moisture curable compositions |
| EP3575373B1 (en) * | 2017-01-30 | 2025-02-19 | Dow Toray Co., Ltd. | Coating agent for concrete structure |
| CN109777342A (zh) * | 2018-12-29 | 2019-05-21 | 江苏创景科技有限公司 | 一种用于双组分有机硅灌封胶的固化促进剂及其应用 |
| US11254838B2 (en) | 2019-03-29 | 2022-02-22 | Ppg Industries Ohio, Inc. | Single component hydrophobic coating |
| KR102679282B1 (ko) | 2019-06-21 | 2024-07-01 | 다우 실리콘즈 코포레이션 | 열 전도성 실리콘 조성물 |
| CN113950511B (zh) * | 2019-06-21 | 2024-01-16 | 美国陶氏有机硅公司 | 用于制备触变可固化有机硅组合物的方法 |
| CN112011309A (zh) * | 2020-09-04 | 2020-12-01 | 忍嘉有机硅新材料(东莞)有限公司 | 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法 |
| WO2025075201A1 (ja) * | 2023-10-06 | 2025-04-10 | Ａｇｃ株式会社 | 組成物、表面処理剤、物品、及び物品の製造方法 |
| WO2025075200A1 (ja) * | 2023-10-06 | 2025-04-10 | Ａｇｃ株式会社 | 組成物、表面処理剤、物品、及び物品の製造方法 |
| WO2025205911A1 (ja) * | 2024-03-29 | 2025-10-02 | ナミックス株式会社 | 硬化性樹脂組成物、接着剤組成物、硬化物、半導体装置及び電子部品 |
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| JPS5541702A (en) | 1978-09-18 | 1980-03-24 | Hitachi Ltd | Glass film coating method for semiconductor |
| US4711928A (en) * | 1986-03-03 | 1987-12-08 | Dow Corning Corporation | Moisture cured one-part RTV silicone sealant |
| US4871827A (en) * | 1986-03-03 | 1989-10-03 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| US4652624A (en) * | 1986-03-03 | 1987-03-24 | Dow Corning Corporation | Room-temperature-curing silicone sealants |
| US4888404A (en) * | 1986-03-03 | 1989-12-19 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| US4898910A (en) * | 1988-09-26 | 1990-02-06 | Dow Corning Corporation | Modulus control in silicone sealant |
| JPH07113083A (ja) | 1993-10-15 | 1995-05-02 | Nippon Steel Chem Co Ltd | コ−クス製造方法およびコ−クス炉の炉蓋 |
| US5340899A (en) * | 1993-11-22 | 1994-08-23 | Dow Corning Corporation | Method for the preparation of polydimethylsiloxanes having low reactivity endgroups and high reactivity endgroups wherein the polydimethylsiloxanes contain ethylene chain linkages |
| EP0802222A1 (en) * | 1996-04-18 | 1997-10-22 | Dow Corning Corporation | Method of adhesion improvement for silicone compositions |
| US5948854A (en) * | 1997-09-25 | 1999-09-07 | Dow Corning S.A. | Alkoxy-functional RTV compositions with increased green strength and increased storage stability |
| US6132664A (en) * | 1997-12-23 | 2000-10-17 | Dow Corning Corporation | Method of forming a seal in a confined configuration with an alkoxy-functional RTV composition |
| US6008284A (en) * | 1997-12-23 | 1999-12-28 | Dow Corning Corporation | Fast curing alkoxy-functional RTV compositions |
| EP1002837B1 (en) | 1998-11-20 | 2003-06-11 | Dow Corning Toray Silicone Company, Ltd. | Room-temperature curable silicone rubber composition |
| JP4494543B2 (ja) * | 1998-11-20 | 2010-06-30 | 東レ・ダウコーニング株式会社 | 室温硬化性シリコーンゴム組成物 |
| EP1008613A3 (en) * | 1998-12-10 | 2001-03-28 | Dow Corning Corporation | Process for preparing room temperature vulcanizing silicone compositions |
| JP5101762B2 (ja) | 1999-11-29 | 2012-12-19 | 東レ・ダウコーニング株式会社 | 室温硬化性シリコーンゴム組成物 |
| JP2001192641A (ja) * | 2000-01-06 | 2001-07-17 | Dow Corning Toray Silicone Co Ltd | シーリング材組成物 |
| JP2003049072A (ja) * | 2001-05-30 | 2003-02-21 | Dow Corning Toray Silicone Co Ltd | 室温硬化性シリコーンゴム組成物 |
| JP4733937B2 (ja) | 2004-07-09 | 2011-07-27 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
| KR101166034B1 (ko) | 2004-07-09 | 2012-07-19 | 다우 코닝 도레이 캄파니 리미티드 | 실온 경화성 오가노폴리실록산 조성물, 및 전기 또는 전자기기 |
| JP4799835B2 (ja) | 2004-07-09 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
| JP4811562B2 (ja) | 2005-05-13 | 2011-11-09 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP5025917B2 (ja) * | 2005-06-15 | 2012-09-12 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物 |
| JP5015476B2 (ja) | 2006-03-01 | 2012-08-29 | 東レ・ダウコーニング株式会社 | 電極・電気回路の保護剤組成物 |
| JP2012219113A (ja) * | 2011-04-04 | 2012-11-12 | Dow Corning Toray Co Ltd | 室温硬化性シリコーンゴム組成物 |
| JP5930826B2 (ja) * | 2012-04-18 | 2016-06-08 | 株式会社Adeka | ポリシロキサン化合物および湿気硬化性樹脂組成物 |
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| KR20160103070A (ko) | 2016-08-31 |
| EP3087144A1 (en) | 2016-11-02 |
| WO2015098119A1 (en) | 2015-07-02 |
| CN113736089A (zh) | 2021-12-03 |
| US10072151B2 (en) | 2018-09-11 |
| CN105874010A (zh) | 2016-08-17 |
| US20170029622A1 (en) | 2017-02-02 |
| JP6855548B2 (ja) | 2021-04-07 |
| EP3087144A4 (en) | 2017-08-02 |
| KR101884177B1 (ko) | 2018-08-02 |
| JP2020007571A (ja) | 2020-01-16 |
| EP3087144B1 (en) | 2018-09-19 |
| TW201529733A (zh) | 2015-08-01 |
| JP2017500393A (ja) | 2017-01-05 |
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