JP2017118100A - 絶縁樹脂シート及びこれを備えたプリント回路基板 - Google Patents
絶縁樹脂シート及びこれを備えたプリント回路基板 Download PDFInfo
- Publication number
- JP2017118100A JP2017118100A JP2016204252A JP2016204252A JP2017118100A JP 2017118100 A JP2017118100 A JP 2017118100A JP 2016204252 A JP2016204252 A JP 2016204252A JP 2016204252 A JP2016204252 A JP 2016204252A JP 2017118100 A JP2017118100 A JP 2017118100A
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- layer
- inorganic filler
- adhesion auxiliary
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 104
- 239000011347 resin Substances 0.000 title claims abstract description 104
- 239000000945 filler Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims description 31
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 31
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 230000000704 physical effect Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- SQSPRWMERUQXNE-UHFFFAOYSA-N Guanylurea Chemical compound NC(=N)NC(N)=O SQSPRWMERUQXNE-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011134 resol-type phenolic resin Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- -1 that is Chemical compound 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
回路基板に多量の充填材が絶縁層に含まれていても、回路と絶縁層との間の接着力が低下しないプリント回路基板構造を提供する。
【解決手段】
本発明は、絶縁樹脂シート及びこれを備えたプリント回路基板を提供する。本発明の一実施例に係るプリント回路基板は、第1絶縁性樹脂及び充填材を含む絶縁樹脂層と、絶縁樹脂層に積層され、第2絶縁性樹脂及び感光性物質を含む接着補助層と、接着補助層に結合した回路パターンと、を含む。
【選択図】図1
Description
12 第1絶縁性樹脂
14、24 充填材
20 接着補助層
22 第2絶縁性樹脂
30 回路パターン
Claims (16)
- 第1絶縁性樹脂及び充填材を含む絶縁樹脂層と、
前記絶縁樹脂層に積層され、感光性物質を備えた第2絶縁性樹脂含む接着補助層と、
前記接着補助層に結合した回路パターンと、
を含むプリント回路基板。 - 前記感光性物質は、光重合性物質及び光重合開始剤を含む請求項1に記載のプリント回路基板。
- 前記第2絶縁性樹脂は、熱硬化性樹脂をさらに含む請求項2に記載のプリント回路基板。
- 前記第2絶縁性樹脂は、エポキシ樹脂及び前記エポキシ樹脂の硬化剤を含む請求項3に記載のプリント回路基板。
- 前記充填材は、無機充填材を含む請求項1から請求項4のいずれか1項に記載のプリント回路基板。
- 前記接着補助層は、無機充填材をさらに含み、
前記接着補助層の無機充填材は、前記絶縁樹脂層の無機充填材よりも平均粒子の大きさが小さい請求項5に記載のプリント回路基板。 - 前記接着補助層は、無機充填材をさらに含み、
前記接着補助層の無機充填材の含有量は、前記絶縁樹脂層の無機充填材の含有量よりも低い請求項5に記載のプリント回路基板。 - 第1絶縁性樹脂及び充填材を含む絶縁樹脂層と、
前記絶縁樹脂層に積層され、感光性物質を備えた第2絶縁性樹脂を含む接着補助層と、を含む絶縁樹脂シート。 - 前記接着補助層の前記感光性物質は、一部硬化された請求項8に記載の絶縁樹脂シート。
- 前記感光性物質は、光重合性物質及び光重合開始剤を含む請求項8または請求項9に記載の絶縁樹脂シート。
- 前記第2絶縁性樹脂は、熱硬化性樹脂をさらに含む請求項8から請求項10のいずれか1項に記載の絶縁樹脂シート。
- 前記第2絶縁性樹脂は、エポキシ樹脂及び前記エポキシ樹脂の硬化剤を含む請求項11に記載の絶縁樹脂シート。
- 前記充填材は、無機充填材を含む請求項8から請求項12のいずれか1項に記載の絶縁樹脂シート。
- 前記接着補助層は、無機充填材をさらに含み、
前記接着補助層の無機充填材は、前記絶縁樹脂層の無機充填材よりも平均粒子の大きさが小さい請求項13に記載の絶縁樹脂シート。 - 前記接着補助層は、無機充填材をさらに含み、
前記接着補助層の無機充填材の含有量は、前記絶縁樹脂層の無機充填材の含有量より低い請求項13に記載の絶縁樹脂シート。 - 前記接着補助層を支持するキャリアフィルム(carrier film)をさらに含む請求項8から請求項15のいずれか1項に記載の絶縁樹脂シート。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0185254 | 2015-12-23 | ||
KR1020150185254A KR102460757B1 (ko) | 2015-12-23 | 2015-12-23 | 절연수지 시트 및 이를 구비한 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017118100A true JP2017118100A (ja) | 2017-06-29 |
JP7019900B2 JP7019900B2 (ja) | 2022-02-16 |
Family
ID=59207459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016204252A Active JP7019900B2 (ja) | 2015-12-23 | 2016-10-18 | 絶縁樹脂シート及びこれを備えたプリント回路基板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7019900B2 (ja) |
KR (1) | KR102460757B1 (ja) |
CN (1) | CN106912159B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11548264B2 (en) | 2018-04-17 | 2023-01-10 | Sekisui Chemical Co., Ltd. | Insulation sheet, laminate, and substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268380A (ja) * | 1993-03-16 | 1994-09-22 | Ibiden Co Ltd | プリント配線板 |
JPH0711449A (ja) * | 1993-06-24 | 1995-01-13 | Daiabondo Kogyo Kk | メッキ用接着剤組成物 |
JP2015164160A (ja) * | 2014-02-28 | 2015-09-10 | 国立大学法人東京工業大学 | 半導体装置及びその製造方法 |
JP2015188073A (ja) * | 2014-03-13 | 2015-10-29 | 積水化学工業株式会社 | 多層絶縁フィルム、多層基板の製造方法及び多層基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3452674B2 (ja) * | 1995-02-09 | 2003-09-29 | 日立化成工業株式会社 | 高剛性銅張積層板の製造方法 |
JP4061096B2 (ja) * | 2002-03-18 | 2008-03-12 | 大日本印刷株式会社 | 金属箔積層シートの製造方法 |
JP5821856B2 (ja) | 2010-11-18 | 2015-11-24 | 日立化成株式会社 | 多層樹脂シート及び樹脂シート積層体 |
KR20130070164A (ko) * | 2011-12-19 | 2013-06-27 | 삼성전기주식회사 | 수지기재 및 그 제조방법 |
JP6353184B2 (ja) * | 2012-07-26 | 2018-07-04 | 味の素株式会社 | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 |
CN106077651A (zh) | 2016-05-11 | 2016-11-09 | 宁海县大雅精密机械有限公司 | 内置孔道结构的零件制备方法 |
-
2015
- 2015-12-23 KR KR1020150185254A patent/KR102460757B1/ko active IP Right Grant
-
2016
- 2016-10-18 JP JP2016204252A patent/JP7019900B2/ja active Active
- 2016-10-20 CN CN201610915179.2A patent/CN106912159B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268380A (ja) * | 1993-03-16 | 1994-09-22 | Ibiden Co Ltd | プリント配線板 |
JPH0711449A (ja) * | 1993-06-24 | 1995-01-13 | Daiabondo Kogyo Kk | メッキ用接着剤組成物 |
JP2015164160A (ja) * | 2014-02-28 | 2015-09-10 | 国立大学法人東京工業大学 | 半導体装置及びその製造方法 |
JP2015188073A (ja) * | 2014-03-13 | 2015-10-29 | 積水化学工業株式会社 | 多層絶縁フィルム、多層基板の製造方法及び多層基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20170075505A (ko) | 2017-07-03 |
CN106912159A (zh) | 2017-06-30 |
KR102460757B1 (ko) | 2022-10-31 |
JP7019900B2 (ja) | 2022-02-16 |
CN106912159B (zh) | 2019-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3084352B2 (ja) | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 | |
JPH09130052A (ja) | 多層プリント配線板用アンダーコート剤 | |
JP2005276873A5 (ja) | ||
JP2011199232A (ja) | プリント配線板及びその製造方法 | |
JP7019900B2 (ja) | 絶縁樹脂シート及びこれを備えたプリント回路基板 | |
JP6149498B2 (ja) | 紫外線硬化性シート材料、紫外線硬化性ドライフィルム、紫外線硬化性ビルドアップ用絶縁材料 | |
JP2006259268A (ja) | 感光性樹脂組成物ならびにこれを用いた多層プリント配線板の製造方法 | |
JP5847754B2 (ja) | 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板 | |
JP2000104033A (ja) | 多層プリント配線板用層間絶縁接着剤及び多層プリント板の製造方法 | |
JP2015122472A (ja) | ビルドアップ絶縁フィルム、それを用いた電子部品内蔵型印刷回路基板、及びその製造方法 | |
JPWO2021261469A5 (ja) | ||
JP2004287267A (ja) | 永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板 | |
TWI457625B (zh) | 光波導的製造方法 | |
JP2018072814A (ja) | 多層感光性フィルム | |
JP2012063737A (ja) | フォトレジスト及びこれを用いるプリント基板の製造方法 | |
JPS6180236A (ja) | ソルダ−レジスト形成用感光性フイルム | |
JP2018067688A (ja) | 導体回路を有する構造体の製造方法、感光性樹脂組成物及び感光性樹脂フィルム、並びに熱硬化性樹脂組成物及び熱硬化性樹脂フィルム | |
JP4978663B2 (ja) | 立体的回路基板の製造方法 | |
JP2001230553A (ja) | 多層プリント配線板用接着剤フィルム | |
JP2004004263A (ja) | ソルダーレジスト組成物、ドライフィルム、およびレジストパターンの形成方法 | |
JPH04279341A (ja) | 紫外線硬化樹脂フィルム | |
JPH08157566A (ja) | 光・熱硬化型アンダーコート材及び多層プリント配線板の製造方法 | |
JP2017111415A (ja) | 感光性樹脂組成物、該組成物で製造された絶縁フィルム、及び該絶縁フィルムを備えたプリント回路基板 | |
JPH11100409A (ja) | 熱又は光により硬化可能な樹脂組成物及びそれを用いたフィルム、積層板 | |
JPS6113690A (ja) | 相互接続回路板の製造法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191016 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200414 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210315 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210601 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210728 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220111 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7019900 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |