JP2017108112A - 水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置 - Google Patents

水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置 Download PDF

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JP2017108112A
JP2017108112A JP2016198583A JP2016198583A JP2017108112A JP 2017108112 A JP2017108112 A JP 2017108112A JP 2016198583 A JP2016198583 A JP 2016198583A JP 2016198583 A JP2016198583 A JP 2016198583A JP 2017108112 A JP2017108112 A JP 2017108112A
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Japan
Prior art keywords
wafer
processing chamber
buffer gas
cassette
vertical
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JP2016198583A
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Japanese (ja)
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JP2017108112A5 (enExample
Inventor
ジェームズ・ステファン・バン・ゴッホ
Stephen Van Gogh James
キャンディ・クリストファーセン
Kristoffersen Candi
モーセン・サレク
Salek Mohsen
ブランドン・セン
Senn Brandon
ハーミート・シン
Harmeet Singh
デレク・ジョン・ウィトコウィッキ
John Witkowicki Derek
リチャード・エム．・ブランク
M Blank Richard
リチャード・ハワード・グールド
Howard Gould Richard
エフレイン・キレス
Quiles Efrain
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Lam Research Corp
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Lam Research Corp
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Publication of JP2017108112A5 publication Critical patent/JP2017108112A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6512—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
JP2016198583A 2015-10-12 2016-10-07 水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置 Pending JP2017108112A (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201562240404P 2015-10-12 2015-10-12
US62/240,404 2015-10-12
US201662286241P 2016-01-22 2016-01-22
US62/286,241 2016-01-22
US15/285,843 US10515834B2 (en) 2015-10-12 2016-10-05 Multi-station tool with wafer transfer microclimate systems
US15/285,843 2016-10-05

Publications (2)

Publication Number Publication Date
JP2017108112A true JP2017108112A (ja) 2017-06-15
JP2017108112A5 JP2017108112A5 (enExample) 2020-01-23

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JP2016198583A Pending JP2017108112A (ja) 2015-10-12 2016-10-07 水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置

Country Status (5)

Country Link
US (1) US10515834B2 (enExample)
JP (1) JP2017108112A (enExample)
KR (1) KR20170054226A (enExample)
CN (1) CN107068601B (enExample)
TW (1) TW201727798A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140130A (ja) * 2018-02-06 2019-08-22 ローツェ株式会社 薄板状基板保持装置、及び保持装置を備える搬送ロボット
JP2020004839A (ja) * 2018-06-28 2020-01-09 株式会社日立ハイテクマニファクチャ＆サービス 半導体ワーク搬送装置
WO2020012669A1 (ja) * 2018-07-13 2020-01-16 ローツェ株式会社 局所パージ機能を有する搬送装置
JP2020161601A (ja) * 2019-03-26 2020-10-01 キヤノン株式会社 搬送装置、搬送方法、リソグラフィ装置、リソグラフィシステム、および物品製造方法
JP2020203338A (ja) * 2019-06-17 2020-12-24 株式会社ディスコ 加工装置
JP2022505473A (ja) * 2018-10-26 2022-01-14 アプライド マテリアルズ インコーポレイテッド 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法
JP2023173972A (ja) * 2022-05-27 2023-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6099945B2 (ja) * 2012-11-22 2017-03-22 東京エレクトロン株式会社 蓋開閉機構、遮蔽機構及び容器の内部パージ方法
US10354908B2 (en) 2016-11-29 2019-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor tool with a shield
JP7084385B2 (ja) * 2017-05-11 2022-06-14 ローツェ株式会社 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット
JP6930224B2 (ja) * 2017-05-31 2021-09-01 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍへの置換ガスの導入方法
US10566216B2 (en) 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
US10403539B2 (en) * 2017-08-04 2019-09-03 Kawasaki Jukogyo Kabushiki Kaisha Robot diagnosing method
CN108336002A (zh) * 2018-03-16 2018-07-27 德淮半导体有限公司 清扫装置及清扫晶圆的方法、机械臂
US11121014B2 (en) * 2018-06-05 2021-09-14 Asm Ip Holding B.V. Dummy wafer storage cassette
WO2019232741A1 (en) * 2018-06-07 2019-12-12 Acm Research (Shanghai) Inc. Apparatus and method for cleaning semiconductor wafers
US12272583B2 (en) 2018-06-18 2025-04-08 Lam Research Corporation Reduced footprint wafer handling platform
US11244844B2 (en) 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
JP7261000B2 (ja) * 2018-12-03 2023-04-19 キヤノン株式会社 容器、処理装置、異物除去方法、および物品の製造方法
JP7320369B2 (ja) * 2019-04-17 2023-08-03 株式会社アルバック 基板処理装置
US11929273B2 (en) * 2019-08-30 2024-03-12 Taiwan Semiconductor Manufacturing Company Limited Semiconductor fabrication system and method
JP7741818B2 (ja) * 2020-05-29 2025-09-18 エルピーイー ソシエタ ペル アチオニ オーバーヘッドスクリーンを有する基板を取り扱うためのツール、並びに関連する取り扱い方法及びエピタキシャル反応器
US12002696B2 (en) 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
CN111958615A (zh) * 2020-08-19 2020-11-20 西安奕斯伟硅片技术有限公司 一种用于搬送晶圆的组件及方法
KR102610837B1 (ko) * 2020-12-29 2023-12-06 세메스 주식회사 기판과 기판을 접합하기 위한 기판 접합 설비에서의 기판 보관 및 정렬 장치
US12021058B2 (en) * 2021-01-29 2024-06-25 Pink Gmbh Thermosysteme System and method for connecting electronic assemblies
US12278124B2 (en) * 2021-10-28 2025-04-15 Applied Materials, Inc. Model-based controlled load lock pumping scheme
KR102699857B1 (ko) * 2023-04-17 2024-08-28 주식회사 동양기술 이상 감지 청정 유지 시스템

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092335A (ja) * 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
JP2004281580A (ja) * 2003-03-13 2004-10-07 Seiko Epson Corp 搬送装置及び搬送方法
JP2006228808A (ja) * 2005-02-15 2006-08-31 Seiko Epson Corp 基板搬送装置、基板搬送方法及び半導体製造装置
JP2007273510A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置およびその製造方法
JP2010232522A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2013531363A (ja) * 2010-04-30 2013-08-01 株式会社テラセミコン 基板処理装置

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105216A (en) * 1960-12-19 1963-09-24 Waters Mfg Inc Potentiomerter
US4306655A (en) * 1980-04-07 1981-12-22 Smith Richard D Holder or container for tape cartridges
US4453785A (en) * 1980-04-07 1984-06-12 Smith Richard D Modular cabinet for different video game cartridges, cassettes, and instruction booklets
US5080549A (en) 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
US5255970A (en) * 1992-05-26 1993-10-26 Theosabrata Yos S Storage cabinet
US6645355B2 (en) * 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US5720387A (en) * 1997-01-15 1998-02-24 Pantech International Inc. Compact disk storage compartment
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US20010048866A1 (en) 1997-12-01 2001-12-06 Fumio Sakiya Container and loader for substrate
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
US6427096B1 (en) 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US8348583B2 (en) 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
JP3559213B2 (ja) 2000-03-03 2004-08-25 株式会社半導体先端テクノロジーズ ロードポート及びそれを用いた生産方式
US6652212B2 (en) 2000-05-02 2003-11-25 Ckd Corporation Cylinder, load port using it, and production system
US6540467B1 (en) * 2001-06-18 2003-04-01 Lsi Logic Corporation Apparatus and method of semiconductor wafer protection
JP4219579B2 (ja) * 2001-07-24 2009-02-04 東京エレクトロン株式会社 ウエハ移載システム及びウエハ移載方法、並びに無人搬送車システム
JP4669643B2 (ja) 2001-09-17 2011-04-13 ローツェ株式会社 ウエハマッピング装置およびそれを備えたロードポート
WO2003026002A1 (en) * 2001-09-18 2003-03-27 Murata Kikai Kabushiki Kaisha Automatic guided vehicle
US7315373B2 (en) 2001-11-14 2008-01-01 Rorze Corporation Wafer positioning method and device, wafer process system, and wafer seat rotation axis positioning method for wafer positioning device
JP2003170384A (ja) 2001-12-04 2003-06-17 Rorze Corp 平板状物の搬送用スカラ型ロボットおよび平板状物の処理システム
WO2003049181A1 (en) 2001-12-04 2003-06-12 Rorze Corporation Device for temporariily loading, keeping and unloading a container
JP4260423B2 (ja) 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
JP4354675B2 (ja) 2002-06-04 2009-10-28 ローツェ株式会社 薄板状電子部品クリーン移載装置および薄板状電子製品製造システム
JPWO2003105216A1 (ja) * 2002-06-07 2005-10-13 平田機工株式会社 容器搬送システム
US6929299B2 (en) * 2002-08-20 2005-08-16 Asm America, Inc. Bonded structures for use in semiconductor processing environments
KR100497820B1 (ko) 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
TWI248920B (en) 2003-03-21 2006-02-11 Rorze Systems Corp Apparatus for cutting glass plate
AU2003221083A1 (en) 2003-03-25 2004-10-18 Rorze Corporation Robot simulation device, and robot simulation program
WO2005008762A1 (ja) 2003-07-17 2005-01-27 Rorze Corporation 低誘電率膜、及びその製造方法、並びにそれを用いた電子部品
WO2005027323A1 (ja) 2003-09-08 2005-03-24 Rorze Corporation リニアモータ
JP4384638B2 (ja) 2003-10-22 2009-12-16 独立行政法人科学技術振興機構 低誘電率膜の製造方法
KR100555620B1 (ko) * 2003-10-28 2006-03-03 주식회사 디엠에스 기판 운반시스템 및 운반방법
US20060216137A1 (en) 2004-07-02 2006-09-28 Katsunori Sakata Carrying apparatus and carrying control method for sheet-like substrate
JP4452279B2 (ja) 2004-07-09 2010-04-21 ローツェ株式会社 駆動源および搬送ロボット
US20070209593A1 (en) 2006-03-07 2007-09-13 Ravinder Aggarwal Semiconductor wafer cooling device
WO2007132526A1 (ja) 2006-05-16 2007-11-22 Rorze Corporation シャトル型搬送装置、マイクロプレート供給回収装置、マイクロプレート用ピックアップ装置、マイクロプレート用カセット、及びマイクロプレート用収納棚
US20090016862A1 (en) * 2007-07-12 2009-01-15 Gould Richard H Method and apparatus for providing flat panel display environmental isolation
EP2298509B1 (en) 2008-05-27 2021-08-25 Rorze Corporation Transport apparatus and position-teaching method
US8827695B2 (en) 2008-06-23 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer's ambiance control
EP2292728B9 (en) 2008-07-01 2016-07-20 Rorze Corporation Constant-temperature equipment
JP5711965B2 (ja) 2008-07-01 2015-05-07 ローツェ株式会社 恒温装置
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
JP2013006222A (ja) 2009-10-14 2013-01-10 Rorze Corp 薄板状物の把持装置、および薄板状物の把持方法
WO2011065325A1 (ja) 2009-11-27 2011-06-03 ローツェ株式会社 搬送アーム、及びこれを備える搬送ロボット
JP5933450B2 (ja) 2010-11-26 2016-06-08 ローツェ株式会社 ロボットの制御装置および制御方法
JP6106176B2 (ja) * 2011-09-14 2017-03-29 ブルックス オートメーション インコーポレイテッド ロードステーション
US9048271B2 (en) 2011-09-29 2015-06-02 Asm International N.V. Modular semiconductor processing system
KR101258403B1 (ko) 2011-12-09 2013-04-30 로체 시스템즈(주) 강화유리 기판 절단방법
KR101251880B1 (ko) 2011-12-29 2013-04-08 로체 시스템즈(주) 웨이퍼 식각장치 및 이를 이용한 웨이퍼 식각방법
TW202203356A (zh) * 2012-02-10 2022-01-16 美商布魯克斯自動機械公司 基材處理設備
US8676375B2 (en) 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system
EP2840599B1 (en) 2012-04-16 2021-03-31 Rorze Corporation Accommodating container and wafer stocker using same
KR101355807B1 (ko) 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
CN104756243B (zh) 2012-10-29 2018-02-13 日商乐华股份有限公司 半导体衬底的位置检测装置和位置检测方法
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
JP6099945B2 (ja) * 2012-11-22 2017-03-22 東京エレクトロン株式会社 蓋開閉機構、遮蔽機構及び容器の内部パージ方法
KR101372805B1 (ko) 2012-11-30 2014-03-19 로체 시스템즈(주) 웨이퍼 식각 시스템 및 이를 이용한 웨이퍼 식각 공정
US9545724B2 (en) 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
JP6198043B2 (ja) 2013-06-06 2017-09-20 Tdk株式会社 ロードポートユニット及びｅｆｅｍシステム
US10269603B2 (en) 2013-07-09 2019-04-23 Kokusai Electric Corporation Substrate processing apparatus, gas-purging method, method for manufacturing semiconductor device, and recording medium containing abnormality-processing program
JP6268425B2 (ja) 2013-07-16 2018-01-31 シンフォニアテクノロジー株式会社 Ｅｆｅｍ、ロードポート、ウェーハ搬送方法
CN104347460B (zh) * 2013-08-01 2017-03-15 中微半导体设备(上海)有限公司 晶圆传递腔室
US20150088798A1 (en) * 2013-09-23 2015-03-26 Mastercard International Incorporated Detecting behavioral patterns and anomalies using metadata
CN105453247B (zh) 2013-09-26 2017-11-24 村田机械株式会社 吹扫装置以及吹扫方法
US9272315B2 (en) 2013-10-11 2016-03-01 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for controlling gas flow in enclosure
JP6287048B2 (ja) 2013-10-23 2018-03-07 Tdk株式会社 基板搬送方法
TWI629744B (zh) 2013-11-11 2018-07-11 昕芙旎雅股份有限公司 Surrounding gas replacement device, substrate transfer device, substrate transfer system, and EFEM
TWI678751B (zh) 2013-12-13 2019-12-01 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）
US10134621B2 (en) 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus
JP6291878B2 (ja) 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092335A (ja) * 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
JP2004281580A (ja) * 2003-03-13 2004-10-07 Seiko Epson Corp 搬送装置及び搬送方法
JP2006228808A (ja) * 2005-02-15 2006-08-31 Seiko Epson Corp 基板搬送装置、基板搬送方法及び半導体製造装置
JP2007273510A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置およびその製造方法
JP2010232522A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2013531363A (ja) * 2010-04-30 2013-08-01 株式会社テラセミコン 基板処理装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140130A (ja) * 2018-02-06 2019-08-22 ローツェ株式会社 薄板状基板保持装置、及び保持装置を備える搬送ロボット
JP7037379B2 (ja) 2018-02-06 2022-03-16 ローツェ株式会社 薄板状基板保持装置、及び保持装置を備える搬送ロボット
JP7061031B2 (ja) 2018-06-28 2022-04-27 株式会社日立ハイテク 半導体ワーク搬送装置
JP2020004839A (ja) * 2018-06-28 2020-01-09 株式会社日立ハイテクマニファクチャ＆サービス 半導体ワーク搬送装置
WO2020012669A1 (ja) * 2018-07-13 2020-01-16 ローツェ株式会社 局所パージ機能を有する搬送装置
JP2020013814A (ja) * 2018-07-13 2020-01-23 ローツェ株式会社 局所パージ機能を有する搬送装置
US12387959B2 (en) 2018-07-13 2025-08-12 Rorze Corporation Transport device having local purge function
JP7136612B2 (ja) 2018-07-13 2022-09-13 ローツェ株式会社 局所パージ機能を有する搬送装置
JP7365408B2 (ja) 2018-10-26 2023-10-19 アプライド マテリアルズ インコーポレイテッド 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法
JP2022505473A (ja) * 2018-10-26 2022-01-14 アプライド マテリアルズ インコーポレイテッド 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法
JP7341694B2 (ja) 2019-03-26 2023-09-11 キヤノン株式会社 搬送装置、搬送方法、リソグラフィ装置、リソグラフィシステム、および物品製造方法
JP2020161601A (ja) * 2019-03-26 2020-10-01 キヤノン株式会社 搬送装置、搬送方法、リソグラフィ装置、リソグラフィシステム、および物品製造方法
JP7323342B2 (ja) 2019-06-17 2023-08-08 株式会社ディスコ 加工装置
JP2020203338A (ja) * 2019-06-17 2020-12-24 株式会社ディスコ 加工装置
JP2023173972A (ja) * 2022-05-27 2023-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7801177B2 (ja) 2022-05-27 2026-01-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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