JP2017107950A - 光電変換装置およびその製造方法 - Google Patents
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 377
- 239000012212 insulator Substances 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims description 37
- 239000012535 impurity Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 17
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 12
- 238000002955 isolation Methods 0.000 description 19
- 239000010410 layer Substances 0.000 description 19
- 230000002093 peripheral effect Effects 0.000 description 16
- 230000003321 amplification Effects 0.000 description 7
- 238000005468 ion implantation Methods 0.000 description 7
- 238000003199 nucleic acid amplification method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241000293849 Cordylanthus Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- -1 bromine compound Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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Abstract
【解決手段】 溝を有する半導体基板の溝の中に第1導電型の第1半導体領域を形成する工程と、半導体基板の上に絶縁体を形成する工程と、光電変換部を成す第2導電型の第2半導体領域を形成する工程と、を備え、第1半導体領域、第2半導体領域および絶縁体を、半導体基板の深さ方向に垂直な方向において、第2半導体領域と絶縁体との間に第1半導体領域が存在するように形成する。
【選択図】 図2
Description
10 半導体基板
130 半導体領域
230 絶縁体
110 光電変換部
111 半導体領域
Claims (20)
- 光電変換装置の製造方法であって、
溝を有する半導体基板の前記溝の中に第1導電型の第1半導体領域を形成する工程と、
前記半導体基板の上に絶縁体を形成する工程と、
光電変換部を成す第2導電型の第2半導体領域を形成する工程と、を備え、
前記第1半導体領域、前記第2半導体領域および前記絶縁体を、前記半導体基板の深さ方向に垂直な方向において、前記第2半導体領域と前記絶縁体との間に前記第1半導体領域が存在するように形成することを特徴とする製造方法。 - 前記第1半導体領域、前記第2半導体領域および前記絶縁体を、前記第1半導体領域および前記第2半導体領域が前記絶縁体の底面よりも前記半導体基板の深い位置に延在し、かつ、前記第1半導体領域が前記第2半導体領域よりも前記半導体基板の深い位置に延在するように形成する、請求項1に記載の製造方法。
- 前記第1半導体領域および前記第2半導体領域を、前記第2半導体領域よりも前記半導体基板の深い位置に、前記第1半導体領域よりも不純物濃度が低い第1導電型の第3半導体領域が存在し、かつ、前記半導体基板の深さ方向に垂直な方向において、前記第2半導体領域と前記第3半導体領域が並ぶように形成する、請求項1または2に記載の製造方法。
- 前記第1半導体領域を形成する工程は、前記溝の側面が第2導電型の半導体領域で構成された状態で、前記溝の中に前記第1半導体領域となる半導体材料を配置する段階を含む、請求項1または2に記載の製造方法。
- 前記第1半導体領域を形成した後に前記絶縁体を形成する、請求項1乃至3のいずれか1項に記載の製造方法。
- 前記絶縁体を形成する工程は、前記第1半導体領域の一部を除去する段階と、前記除去によって形成された凹部の中に前記絶縁体となる絶縁体材料を配置する段階と、を含む、請求項1乃至5のいずれか1項に記載の製造方法。
- 前記第1半導体領域の一部を除去する段階では、前記半導体基板の一部をも除去する、請求項6に記載の製造方法。
- 前記第1半導体領域、前記第2半導体領域および前記絶縁体を、前記絶縁体と前記第1半導体領域が接し、前記第2半導体領域と前記第1半導体領域がPN接合を成すように形成する、請求項1乃至7のいずれか1項に記載の製造方法。
- 前記半導体基板の上にトランジスタのゲート電極を形成する工程を有し、
前記第1半導体領域、前記絶縁体および前記ゲート電極を、前記ゲート電極のうちの第1部分が前記トランジスタのチャネル領域の上に位置し、前記ゲート電極のうちの前記第1部分とは別の第2部分が前記絶縁体の上に位置するように形成する、請求項1乃至8のいずれか1項に記載の製造方法。 - 前記チャネル領域の下には、前記半導体基板の前記溝の側面を成す半導体領域が位置する、請求項9に記載の製造方法。
- 前記半導体基板の上に前記光電変換部の電荷を転送する転送ゲートのゲート電極を形成する工程を有し、
前記転送ゲートの前記ゲート電極を、前記絶縁体に重ならず、前記第2半導体領域に重なるように形成する、請求項1乃至10のいずれか1項に記載の製造方法。 - 前記第1半導体領域を形成する工程では、エピタキシャル成長法を用いて前記第1半導体領域を形成する、請求項1乃至11のいずれか1項に記載の製造方法。
- 前記第1半導体領域を形成する工程では、前記半導体基板のうち前記溝の外側の領域が絶縁体層で覆われている、請求項12に記載の製造方法。
- 前記溝の深さは3μm以上である、請求項1乃至13のいずれか1項に記載の製造方法。
- 溝を有する半導体基板と、
前記溝の中に位置する第1導電型の第1半導体領域と、
光電変換部を成す第2導電型の第2半導体領域と、
前記半導体基板の上に配された絶縁体と、
を備える光電変換装置であって、
前記半導体基板の深さ方向に垂直な方向において、前記第2半導体領域と前記絶縁体との間に前記第1半導体領域が存在することを特徴とする光電変換装置。 - 前記第1半導体領域および前記第2半導体領域が前記絶縁体の底面よりも前記半導体基板の深い位置に延在し、前記第1半導体領域が前記第2半導体領域よりも前記半導体基板の深い位置に延在する、請求項15に記載の光電変換装置。
- 前記第2半導体領域よりも前記半導体基板の深い位置に、前記第1半導体領域よりも不純物濃度が低い第1導電型の第3半導体領域が存在し、かつ、前記半導体基板の深さ方向に垂直な方向において、前記第2半導体領域と前記第3半導体領域が並ぶ、請求項15または16に記載の光電変換装置。
- 前記半導体基板の上にトランジスタのゲート電極を有し、
前記ゲート電極のうちの第1部分が前記トランジスタのチャネル領域の上に位置し、前記ゲート電極のうちの前記第1部分とは別の第2部分が前記絶縁体の上に位置する、請求項15乃至17のいずれか1項に記載の光電変換装置。 - 前記半導体基板の上に前記光電変換部の電荷を転送する転送ゲートのゲート電極を有し、
前記転送ゲートの前記ゲート電極は、前記絶縁体に重ならず、前記第2半導体領域に重なる、請求項15乃至18のいずれか1項に記載の光電変換装置。 - 前記第1半導体領域は単結晶シリコンで構成されていることを特徴とする請求項15乃至19のいずれか1項に記載の光電変換装置。
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