JP2017083878A5 - - Google Patents

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Publication number
JP2017083878A5
JP2017083878A5 JP2017001054A JP2017001054A JP2017083878A5 JP 2017083878 A5 JP2017083878 A5 JP 2017083878A5 JP 2017001054 A JP2017001054 A JP 2017001054A JP 2017001054 A JP2017001054 A JP 2017001054A JP 2017083878 A5 JP2017083878 A5 JP 2017083878A5
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micrometers
optical stack
film body
less
laser radiation
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JP2017001054A
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Japanese (ja)
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JP2017083878A (ja
JP6530429B2 (ja
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JP2017001054A 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品 Active JP6530429B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201061428395P 2010-12-30 2010-12-30
US61/428,395 2010-12-30

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013547671A Division JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品

Publications (3)

Publication Number Publication Date
JP2017083878A JP2017083878A (ja) 2017-05-18
JP2017083878A5 true JP2017083878A5 (https=) 2017-06-29
JP6530429B2 JP6530429B2 (ja) 2019-06-12

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JP2013547671A Expired - Fee Related JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品
JP2017001054A Active JP6530429B2 (ja) 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品

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JP2013547671A Expired - Fee Related JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品

Country Status (9)

Country Link
US (2) US9878530B2 (https=)
EP (1) EP2658716A1 (https=)
JP (2) JP6392514B2 (https=)
KR (1) KR101899617B1 (https=)
CN (1) CN103260879B (https=)
BR (1) BR112013016437A2 (https=)
SG (2) SG10201602517RA (https=)
TW (1) TWI552870B (https=)
WO (1) WO2012092478A1 (https=)

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CN106751589A (zh) * 2016-09-27 2017-05-31 无锡卡卡生物科技有限公司 一种生物降解型薄膜及其制备方法
CN106633009A (zh) * 2016-09-27 2017-05-10 无锡卡卡生物科技有限公司 一种聚2,3‑萘二甲酸乙二醇酯可生物降解聚酯及其制备方法和用途
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法
CN109725378B (zh) * 2018-02-13 2020-03-10 华为技术有限公司 保护膜、切割保护膜的方法和装置
US11845841B2 (en) * 2018-04-19 2023-12-19 Toyobo Co., Ltd. Polyester film for surface protection film of foldable display and use thereof
MX2021002001A (es) * 2018-08-31 2021-04-28 Kimberly Clark Co Metodos y sistemas para cortar o perforar una trama con un laser.
CN110039188B (zh) * 2019-05-06 2021-12-07 深圳市万普拉斯科技有限公司 镭雕方法
TWI704999B (zh) * 2019-12-24 2020-09-21 茂林光學股份有限公司 具保護膜之導光板之加工方法、加工設備及其導光板
KR102921537B1 (ko) * 2021-04-07 2026-02-03 주식회사 엘지에너지솔루션 분리막 커팅 장치 및 이를 포함하는 전극셀 제조 시스템
JP7220764B1 (ja) 2021-11-02 2023-02-10 住友化学株式会社 貫通孔付きフィルムの製造方法、及び、円偏光板
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US9878530B2 (en) 2010-12-30 2018-01-30 3M Innovative Properties Company Laser cutting method and articles produced therewith

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