JP2013524521A5 - - Google Patents

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Publication number
JP2013524521A5
JP2013524521A5 JP2013502858A JP2013502858A JP2013524521A5 JP 2013524521 A5 JP2013524521 A5 JP 2013524521A5 JP 2013502858 A JP2013502858 A JP 2013502858A JP 2013502858 A JP2013502858 A JP 2013502858A JP 2013524521 A5 JP2013524521 A5 JP 2013524521A5
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JP
Japan
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laser
laser parameter
parameter
microns
ranges
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JP2013502858A
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Japanese (ja)
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JP5823490B2 (ja
JP2013524521A (ja
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Priority claimed from US12/753,367 external-priority patent/US8383984B2/en
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JP2013502858A 2010-04-02 2011-03-31 脆性材料のレーザシンギュレーションのための改良された方法及び装置 Active JP5823490B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/753,367 US8383984B2 (en) 2010-04-02 2010-04-02 Method and apparatus for laser singulation of brittle materials
US12/753,367 2010-04-02
PCT/US2011/030768 WO2011123673A2 (en) 2010-04-02 2011-03-31 Improved method and apparatus for laser singulation of brittle materials

Publications (3)

Publication Number Publication Date
JP2013524521A JP2013524521A (ja) 2013-06-17
JP2013524521A5 true JP2013524521A5 (https=) 2014-05-08
JP5823490B2 JP5823490B2 (ja) 2015-11-25

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JP2013502858A Active JP5823490B2 (ja) 2010-04-02 2011-03-31 脆性材料のレーザシンギュレーションのための改良された方法及び装置

Country Status (7)

Country Link
US (2) US8383984B2 (https=)
EP (1) EP2553717B1 (https=)
JP (1) JP5823490B2 (https=)
KR (1) KR101754186B1 (https=)
CN (1) CN102844844B (https=)
TW (1) TWI532559B (https=)
WO (1) WO2011123673A2 (https=)

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