TWI532559B - 用於易碎材料的雷射單一化的改善的方法及裝置 - Google Patents

用於易碎材料的雷射單一化的改善的方法及裝置 Download PDF

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Publication number
TWI532559B
TWI532559B TW100111495A TW100111495A TWI532559B TW I532559 B TWI532559 B TW I532559B TW 100111495 A TW100111495 A TW 100111495A TW 100111495 A TW100111495 A TW 100111495A TW I532559 B TWI532559 B TW I532559B
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TW
Taiwan
Prior art keywords
laser
parameter comprises
laser parameter
pulse
workpiece
Prior art date
Application number
TW100111495A
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English (en)
Chinese (zh)
Other versions
TW201201945A (en
Inventor
大迫康
達瑞 芬恩
Original Assignee
伊雷克托科學工業股份有限公司
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Publication of TW201201945A publication Critical patent/TW201201945A/zh
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Publication of TWI532559B publication Critical patent/TWI532559B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW100111495A 2010-04-02 2011-04-01 用於易碎材料的雷射單一化的改善的方法及裝置 TWI532559B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/753,367 US8383984B2 (en) 2010-04-02 2010-04-02 Method and apparatus for laser singulation of brittle materials

Publications (2)

Publication Number Publication Date
TW201201945A TW201201945A (en) 2012-01-16
TWI532559B true TWI532559B (zh) 2016-05-11

Family

ID=44708399

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100111495A TWI532559B (zh) 2010-04-02 2011-04-01 用於易碎材料的雷射單一化的改善的方法及裝置

Country Status (7)

Country Link
US (2) US8383984B2 (https=)
EP (1) EP2553717B1 (https=)
JP (1) JP5823490B2 (https=)
KR (1) KR101754186B1 (https=)
CN (1) CN102844844B (https=)
TW (1) TWI532559B (https=)
WO (1) WO2011123673A2 (https=)

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Also Published As

Publication number Publication date
EP2553717A2 (en) 2013-02-06
KR101754186B1 (ko) 2017-07-19
US20130237035A1 (en) 2013-09-12
US20110240616A1 (en) 2011-10-06
KR20130051435A (ko) 2013-05-20
WO2011123673A3 (en) 2012-01-19
CN102844844A (zh) 2012-12-26
CN102844844B (zh) 2015-11-25
JP5823490B2 (ja) 2015-11-25
EP2553717B1 (en) 2020-05-06
EP2553717A4 (en) 2017-08-16
US8679948B2 (en) 2014-03-25
JP2013524521A (ja) 2013-06-17
US8383984B2 (en) 2013-02-26
WO2011123673A2 (en) 2011-10-06
TW201201945A (en) 2012-01-16

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