JP7072993B2 - チップ製造方法 - Google Patents
チップ製造方法 Download PDFInfo
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- JP7072993B2 JP7072993B2 JP2018143126A JP2018143126A JP7072993B2 JP 7072993 B2 JP7072993 B2 JP 7072993B2 JP 2018143126 A JP2018143126 A JP 2018143126A JP 2018143126 A JP2018143126 A JP 2018143126A JP 7072993 B2 JP7072993 B2 JP 7072993B2
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- protective film
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- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000005520 cutting process Methods 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 35
- 230000001681 protective effect Effects 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 230000001737 promoting effect Effects 0.000 claims description 8
- 206010020880 Hypertrophy Diseases 0.000 claims description 7
- 230000002745 absorbent Effects 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 139
- 238000003754 machining Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000002173 cutting fluid Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 206010000060 Abdominal distension Diseases 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 208000024330 bloating Diseases 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
11a 表面
11b 裏面
11c 加工溝
11d,11e 側壁
11f 底部
13 分割予定ライン
15 デバイス
17 積層体
19 金属層
21 テープ
23 環状フレーム
23a 開口
25 フレームユニット
27 保護膜
29 デブリ
2 レーザー加工装置
4 チャックテーブル
6 レーザー加工ユニット
8 撮像ユニット
10 切削装置
12 チャックテーブル
14 切削ユニット
16 スピンドルハウジング
18 切削ブレード
18a 下端
18b,18c 側面
20 撮像ユニット
Claims (5)
- 複数の分割予定ラインによって区画された領域に形成されたデバイスと、該分割予定ラインに形成されたCuを含む金属層と、を表面側に備えるSiを含むウェーハを分割してチップを製造するチップ製造方法であって、
該ウェーハの表面側に保護膜を形成する保護膜形成ステップと、
該保護膜形成ステップの実施後、該ウェーハに対して吸収性を有する波長のレーザービームを該ウェーハの表面側から該分割予定ラインに沿って照射して、該金属層を除去しつつ該ウェーハに加工溝を形成するレーザー加工溝形成ステップと、
該レーザー加工溝形成ステップの実施後、該加工溝の形成によって発生し該加工溝の内部に付着したデブリの肥大化を促進させる肥大化促進ステップと、
該肥大化促進ステップの実施後、該加工溝に沿って該ウェーハを分割する分割ステップと、を含むことを特徴とするチップ製造方法。 - 該肥大化促進ステップの実施後に、該保護膜を除去する除去ステップを更に含むことを特徴とする、請求項1に記載のチップ製造方法。
- 該分割ステップでは、該加工溝の幅よりも幅が小さい切削ブレードを該加工溝に沿って該ウェーハに切り込ませ、該ウェーハを分割することを特徴とする、請求項1または2に記載のチップ製造方法。
- 該肥大化促進ステップでは、温度が50℃以上200℃以下の環境下に該ウェーハを配置することで該デブリの肥大化を促進させることを特徴とする、請求項1乃至3のいずれかに記載のチップ製造方法。
- 該肥大化促進ステップでは、湿度が75%以上の環境下に該ウェーハを配置することで該デブリの肥大化を促進させることを特徴とする、請求項1乃至3のいずれかに記載のチップ製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018143126A JP7072993B2 (ja) | 2018-07-31 | 2018-07-31 | チップ製造方法 |
KR1020190081485A KR20200014195A (ko) | 2018-07-31 | 2019-07-05 | 칩 제조 방법 |
CN201910614448.5A CN110783185B (zh) | 2018-07-31 | 2019-07-09 | 芯片制造方法 |
SG10201906679RA SG10201906679RA (en) | 2018-07-31 | 2019-07-18 | Chip manufacturing method |
TW108126555A TWI800668B (zh) | 2018-07-31 | 2019-07-26 | 晶片製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018143126A JP7072993B2 (ja) | 2018-07-31 | 2018-07-31 | チップ製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020021786A JP2020021786A (ja) | 2020-02-06 |
JP7072993B2 true JP7072993B2 (ja) | 2022-05-23 |
Family
ID=69383822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018143126A Active JP7072993B2 (ja) | 2018-07-31 | 2018-07-31 | チップ製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7072993B2 (ja) |
KR (1) | KR20200014195A (ja) |
CN (1) | CN110783185B (ja) |
SG (1) | SG10201906679RA (ja) |
TW (1) | TWI800668B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7273756B2 (ja) * | 2020-03-18 | 2023-05-15 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP7450426B2 (ja) | 2020-03-24 | 2024-03-15 | 株式会社ディスコ | 被加工物の加工方法 |
KR102405460B1 (ko) * | 2020-06-26 | 2022-06-07 | 매그나칩 반도체 유한회사 | 초단파 펄스 레이저 미세 가공을 이용한 반도체 다이 형성 방법 및 패키징 방법 |
CN113649709A (zh) * | 2021-08-16 | 2021-11-16 | 湖北三维半导体集成创新中心有限责任公司 | 晶圆切割方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013524521A (ja) | 2010-04-02 | 2013-06-17 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 脆性材料のレーザシンギュレーションのための改良された方法及び装置 |
US20140239552A1 (en) | 2013-02-23 | 2014-08-28 | Raydiance, Inc. | Shaping of brittle materials with controlled surface and bulk properties |
WO2015008482A1 (ja) | 2013-07-19 | 2015-01-22 | アイシン精機株式会社 | レーザ加工装置、レーザ加工方法、及びレーザ発振装置 |
JP2017092363A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | ウエーハの分割方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3583279B2 (ja) * | 1998-01-13 | 2004-11-04 | 三菱電機株式会社 | 穴あけ加工方法 |
JP4694845B2 (ja) | 2005-01-05 | 2011-06-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2011035302A (ja) * | 2009-08-05 | 2011-02-17 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP6189700B2 (ja) * | 2013-10-03 | 2017-08-30 | 株式会社ディスコ | ウエーハの加工方法 |
CN104716066B (zh) * | 2015-03-20 | 2018-03-30 | 上海华力微电子有限公司 | 一种侦测图形底部光刻胶残留的缺陷检测方法 |
CN106229309B (zh) * | 2016-07-20 | 2019-05-07 | 日月光半导体(上海)有限公司 | 封装基板及其制造方法 |
-
2018
- 2018-07-31 JP JP2018143126A patent/JP7072993B2/ja active Active
-
2019
- 2019-07-05 KR KR1020190081485A patent/KR20200014195A/ko active IP Right Grant
- 2019-07-09 CN CN201910614448.5A patent/CN110783185B/zh active Active
- 2019-07-18 SG SG10201906679RA patent/SG10201906679RA/en unknown
- 2019-07-26 TW TW108126555A patent/TWI800668B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013524521A (ja) | 2010-04-02 | 2013-06-17 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 脆性材料のレーザシンギュレーションのための改良された方法及び装置 |
US20140239552A1 (en) | 2013-02-23 | 2014-08-28 | Raydiance, Inc. | Shaping of brittle materials with controlled surface and bulk properties |
WO2015008482A1 (ja) | 2013-07-19 | 2015-01-22 | アイシン精機株式会社 | レーザ加工装置、レーザ加工方法、及びレーザ発振装置 |
JP2017092363A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | ウエーハの分割方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110783185A (zh) | 2020-02-11 |
CN110783185B (zh) | 2023-10-10 |
TW202008452A (zh) | 2020-02-16 |
SG10201906679RA (en) | 2020-02-27 |
JP2020021786A (ja) | 2020-02-06 |
TWI800668B (zh) | 2023-05-01 |
KR20200014195A (ko) | 2020-02-10 |
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